Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Core Size | Speed | Connectivity | Peripherals | Number of I/O | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
IC MCU 8BIT 12KB OTP 52PLCC
|
pacchetto: 52-LCC (J-Lead) |
Azione5.120 |
|
8-Bit | 2MHz | SCI, SPI | POR, WDT | 38 | 12KB (12K x 8) | OTP | 512 x 8 | 512 x 8 | 4.5 V ~ 5.5 V | A/D 8x8b | Internal | -40°C ~ 105°C (TA) | - | 52-LCC (J-Lead) | 52-PLCC (19.1x19.1) |
||
NXP |
IC MCU 8BIT 12KB OTP 52PLCC
|
pacchetto: 52-LCC (J-Lead) |
Azione6.224 |
|
8-Bit | 2MHz | SCI, SPI | POR, WDT | 38 | 12KB (12K x 8) | OTP | 512 x 8 | 512 x 8 | 4.5 V ~ 5.5 V | A/D 8x8b | Internal | -40°C ~ 125°C (TA) | - | 52-LCC (J-Lead) | 52-PLCC (19.1x19.1) |
||
NXP |
IC MCU 8BIT 12KB OTP 52PLCC
|
pacchetto: 52-LCC (J-Lead) |
Azione5.376 |
|
8-Bit | 3MHz | SCI, SPI | POR, WDT | 38 | 12KB (12K x 8) | OTP | 512 x 8 | 512 x 8 | 4.5 V ~ 5.5 V | A/D 8x8b | Internal | -40°C ~ 85°C (TA) | - | 52-LCC (J-Lead) | 52-PLCC (19.1x19.1) |
||
NXP |
IC MCU 8BIT 12KB OTP 52PLCC
|
pacchetto: 52-LCC (J-Lead) |
Azione157.188 |
|
8-Bit | 2MHz | SCI, SPI | POR, WDT | 38 | 12KB (12K x 8) | OTP | 512 x 8 | 512 x 8 | 4.5 V ~ 5.5 V | A/D 8x8b | Internal | -40°C ~ 85°C (TA) | - | 52-LCC (J-Lead) | 52-PLCC (19.1x19.1) |
||
NXP |
IC MCU 8BIT 4KB OTP 44PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione12.972 |
|
8-Bit | 3MHz | SCI, SPI | POR, WDT | 26 | 4KB (4K x 8) | OTP | - | 192 x 8 | 4.5 V ~ 5.5 V | - | Internal | -40°C ~ 85°C (TA) | - | 44-LCC (J-Lead) | 44-PLCC (17.525x17.525) |
||
NXP |
IC MCU 8BIT 4KB OTP 44PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione14.928 |
|
8-Bit | 2MHz | SCI, SPI | POR, WDT | 26 | 4KB (4K x 8) | OTP | - | 192 x 8 | 4.5 V ~ 5.5 V | - | Internal | -40°C ~ 85°C (TA) | - | 44-LCC (J-Lead) | 44-PLCC (17.525x17.525) |
||
NXP |
IC MCU 8BIT 16KB OTP 44PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione5.344 |
|
8-Bit | 2.1MHz | SCI, SPI | POR, WDT | 24 | 16KB (16K x 8) | OTP | - | 352 x 8 | 3 V ~ 5.5 V | - | Internal | -40°C ~ 105°C (TA) | - | 44-LCC (J-Lead) | 44-PLCC (17.525x17.525) |
||
NXP |
IC MCU 8BIT ROMLESS 44PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione5.152 |
|
8-Bit | 3MHz | SCI, SPI | POR, WDT | 26 | - | ROMless | - | 192 x 8 | 4.5 V ~ 5.5 V | - | Internal | -40°C ~ 85°C (TA) | - | 44-LCC (J-Lead) | 44-PLCC (17.525x17.525) |
||
NXP |
IC MCU 8BIT ROMLESS 52PLCC
|
pacchetto: 52-LCC (J-Lead) |
Azione5.232 |
|
8-Bit | 3MHz | SCI, SPI | POR, WDT | 38 | - | ROMless | 512 x 8 | 256 x 8 | 4.5 V ~ 5.5 V | A/D 8x8b | External | -40°C ~ 85°C (TA) | - | 52-LCC (J-Lead) | 52-PLCC (19.1x19.1) |
||
NXP |
IC MCU 8BIT ROMLESS 52PLCC
|
pacchetto: 52-LCC (J-Lead) |
Azione6.464 |
|
8-Bit | 3MHz | SCI, SPI | POR, WDT | 38 | - | ROMless | - | 256 x 8 | 4.5 V ~ 5.5 V | A/D 8x8b | External | -40°C ~ 85°C (TA) | - | 52-LCC (J-Lead) | 52-PLCC (19.1x19.1) |
||
NXP |
IC MCU 8BIT 8KB FLASH 32LQFP
|
pacchetto: 32-LQFP |
Azione6.480 |
|
8-Bit | 8MHz | CAN, LIN, SCI, SPI | LVD, POR, PWM | 21 | 8KB (8K x 8) | FLASH | - | 1K x 8 | 3 V ~ 5.5 V | A/D 8x10b | Internal | -40°C ~ 125°C (TA) | - | 32-LQFP | 32-LQFP (7x7) |
||
NXP |
IC MCU 8BIT 16KB FLASH 32LQFP
|
pacchetto: 32-LQFP |
Azione3.552 |
|
8-Bit | 8MHz | LIN, SCI, SPI | LVD, POR, PWM | 21 | 16KB (16K x 8) | FLASH | - | 1K x 8 | 3 V ~ 5.5 V | A/D 8x10b | Internal | -40°C ~ 105°C (TA) | - | 32-LQFP | 32-LQFP (7x7) |
||
NXP |
IC MCU 32BIT ROMLESS 160QFP
|
pacchetto: 160-BQFP |
Azione2.512 |
|
32-Bit | 25MHz | CAN, EBI/EMI, SCI, SPI | POR, PWM, WDT | 18 | - | ROMless | - | 7.5K x 8 | 4.75 V ~ 5.25 V | A/D 16x10b | External | -40°C ~ 105°C (TA) | - | 160-BQFP | 160-QFP (28x28) |
||
NXP |
IC MCU 32BIT ROMLESS 160QFP
|
pacchetto: 160-BQFP |
Azione4.832 |
|
32-Bit | 20MHz | CAN, EBI/EMI, SCI, SPI | POR, PWM, WDT | 18 | - | ROMless | - | 7.5K x 8 | 4.75 V ~ 5.25 V | A/D 16x10b | External | -40°C ~ 105°C (TA) | - | 160-BQFP | 160-QFP (28x28) |
||
NXP |
IC MCU 32BIT ROMLESS 160QFP
|
pacchetto: 160-BQFP |
Azione2.032 |
|
32-Bit | 20MHz | CAN, EBI/EMI, SCI, SPI | POR, PWM, WDT | 18 | - | ROMless | - | 7.5K x 8 | 4.75 V ~ 5.25 V | A/D 16x10b | External | -40°C ~ 125°C (TA) | - | 160-BQFP | 160-QFP (28x28) |
||
NXP |
IC MCU 32BIT ROMLESS 160QFP
|
pacchetto: 160-BQFP |
Azione4.000 |
|
32-Bit | 25MHz | CAN, EBI/EMI, SCI, SPI | POR, PWM, WDT | 18 | - | ROMless | - | 7.5K x 8 | 4.75 V ~ 5.25 V | A/D 16x10b | External | -40°C ~ 85°C (TA) | - | 160-BQFP | 160-QFP (28x28) |
||
NXP |
IC MCU 32BIT ROMLESS 160QFP
|
pacchetto: 160-BQFP |
Azione2.928 |
|
32-Bit | 20MHz | CAN, EBI/EMI, SCI, SPI | POR, PWM, WDT | 18 | - | ROMless | - | 7.5K x 8 | 4.75 V ~ 5.25 V | A/D 16x10b | External | -40°C ~ 85°C (TA) | - | 160-BQFP | 160-QFP (28x28) |
||
NXP |
IC MCU 32BIT ROMLESS 160QFP
|
pacchetto: 160-BQFP |
Azione4.048 |
|
32-Bit | 25MHz | CAN, EBI/EMI, SCI, SPI | POR, PWM, WDT | 18 | - | ROMless | - | 7.5K x 8 | 4.75 V ~ 5.25 V | A/D 16x10b | External | -40°C ~ 105°C (TA) | - | 160-BQFP | 160-QFP (28x28) |
||
NXP |
IC MCU 32BIT ROMLESS 160QFP
|
pacchetto: 160-BQFP |
Azione6.128 |
|
32-Bit | 20MHz | CAN, EBI/EMI, SCI, SPI | POR, PWM, WDT | 18 | - | ROMless | - | 7.5K x 8 | 4.75 V ~ 5.25 V | A/D 16x10b | External | -40°C ~ 105°C (TA) | - | 160-BQFP | 160-QFP (28x28) |
||
NXP |
IC MCU 32BIT ROMLESS 160QFP
|
pacchetto: 160-BQFP |
Azione2.752 |
|
32-Bit | 20MHz | CAN, EBI/EMI, SCI, SPI | POR, PWM, WDT | 18 | - | ROMless | - | 7.5K x 8 | 4.75 V ~ 5.25 V | A/D 16x10b | External | -40°C ~ 125°C (TA) | - | 160-BQFP | 160-QFP (28x28) |
||
NXP |
IC MCU 32BIT ROMLESS 160QFP
|
pacchetto: 160-BQFP |
Azione5.088 |
|
32-Bit | 25MHz | CAN, EBI/EMI, SCI, SPI | POR, PWM, WDT | 18 | - | ROMless | - | 7.5K x 8 | 4.75 V ~ 5.25 V | A/D 16x10b | External | -40°C ~ 85°C (TA) | - | 160-BQFP | 160-QFP (28x28) |
||
NXP |
IC MCU 32BIT ROMLESS 160QFP
|
pacchetto: 160-BQFP |
Azione2.128 |
|
32-Bit | 20MHz | CAN, EBI/EMI, SCI, SPI | POR, PWM, WDT | 18 | - | ROMless | - | 7.5K x 8 | 4.75 V ~ 5.25 V | A/D 16x10b | External | -40°C ~ 85°C (TA) | - | 160-BQFP | 160-QFP (28x28) |
||
NXP |
IC MCU 32BIT ROMLESS 160QFP
|
pacchetto: 160-BQFP |
Azione7.216 |
|
32-Bit | 25MHz | CAN, EBI/EMI, SCI, SPI | POR, PWM, WDT | 18 | - | ROMless | - | 7.5K x 8 | 4.75 V ~ 5.25 V | A/D 16x10b | External | -40°C ~ 105°C (TA) | - | 160-BQFP | 160-QFP (28x28) |
||
NXP |
IC MCU 32BIT ROMLESS 160QFP
|
pacchetto: 160-BQFP |
Azione7.440 |
|
32-Bit | 20MHz | CAN, EBI/EMI, SCI, SPI | POR, PWM, WDT | 18 | - | ROMless | - | 7.5K x 8 | 4.75 V ~ 5.25 V | A/D 16x10b | External | -40°C ~ 105°C (TA) | - | 160-BQFP | 160-QFP (28x28) |
||
NXP |
IC MCU 32BIT ROMLESS 160QFP
|
pacchetto: 160-BQFP |
Azione5.264 |
|
32-Bit | 20MHz | CAN, EBI/EMI, SCI, SPI | POR, PWM, WDT | 18 | - | ROMless | - | 7.5K x 8 | 4.75 V ~ 5.25 V | A/D 16x10b | External | -40°C ~ 125°C (TA) | - | 160-BQFP | 160-QFP (28x28) |
||
NXP |
IC MCU 32BIT ROMLESS 160QFP
|
pacchetto: 160-BQFP |
Azione6.944 |
|
32-Bit | 25MHz | CAN, EBI/EMI, SCI, SPI | POR, PWM, WDT | 18 | - | ROMless | - | 7.5K x 8 | 4.75 V ~ 5.25 V | A/D 16x10b | External | -40°C ~ 85°C (TA) | - | 160-BQFP | 160-QFP (28x28) |
||
NXP |
IC MCU 32BIT ROMLESS 160QFP
|
pacchetto: 160-BQFP |
Azione5.232 |
|
32-Bit | 20MHz | CAN, EBI/EMI, SCI, SPI | POR, PWM, WDT | 18 | - | ROMless | - | 7.5K x 8 | 4.75 V ~ 5.25 V | A/D 16x10b | External | -40°C ~ 125°C (TA) | - | 160-BQFP | 160-QFP (28x28) |
||
NXP |
IC MCU 32BIT ROMLESS 160QFP
|
pacchetto: 160-BQFP |
Azione2.624 |
|
32-Bit | 25MHz | CAN, EBI/EMI, SCI, SPI | POR, PWM, WDT | 18 | - | ROMless | - | 7.5K x 8 | 4.75 V ~ 5.25 V | A/D 16x10b | External | -40°C ~ 85°C (TA) | - | 160-BQFP | 160-QFP (28x28) |