Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Core Size | Speed | Connectivity | Peripherals | Number of I/O | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
32 BITDUAL CORE4M FLAS
|
pacchetto: 324-LBGA |
Azione2.880 |
|
32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 246 | 4MB (4M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 105°C (TA) | - | 324-LBGA | 324-MAPBGA (19x19) |
||
NXP |
2M FLASH 1.5MB SRAM 2X
|
pacchetto: 257-LFBGA |
Azione3.392 |
|
32-Bit Tri-Core | 180MHz, 240MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI, ZipWire | POR, PWM, WDT | - | 2MB (2M x 8) | FLASH | 64K x 8 | 1.5M x 8 | 1.19 V ~ 5.5 V | A/D 16x12b SAR, 4x12 Sigma, D/A 1x12b | Internal | -40°C ~ 125°C (TA) | - | 257-LFBGA | 257-MAPBGA (14x14) |
||
NXP |
TRIPLE CORE, 6M FLASH
|
pacchetto: 256-LBGA |
Azione5.648 |
|
32-Bit Tri-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 178 | 6MB (6M x 8) | FLASH | - | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 105°C (TA) | - | 256-LBGA | 256-MAPPBGA (17x17) |
||
NXP |
TRIPLE CORE, 6M FLASH
|
pacchetto: 176-LQFP Exposed Pad |
Azione6.336 |
|
32-Bit Tri-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 129 | 6MB (6M x 8) | FLASH | - | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
||
NXP |
NXP 32-BIT MCU DUAL POWER ARCH
|
pacchetto: 176-LQFP |
Azione5.520 |
|
32-Bit Dual-Core | 80MHz/120MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 3MB (3M x 8) | FLASH | 64K x 8 | 256K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
||
NXP |
NXP 32-BIT MCU DUAL POWER ARCH
|
pacchetto: 176-LQFP |
Azione3.248 |
|
32-Bit Dual-Core | 80MHz/120MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 3MB (3M x 8) | FLASH | 64K x 8 | 256K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
||
NXP |
1M FLASH 256K SRAM EBI
|
pacchetto: 257-LFBGA |
Azione6.592 |
|
32-Bit Dual-Core | 150MHz | CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, POR, PWM, WDT | - | 1MB (1M x 8) | FLASH | 64K x 8 | 256K x 8 | 1.14 V ~ 5.5 V | A/D 22x12b | Internal | -40°C ~ 105°C (TA) | - | 257-LFBGA | 257-MAPBGA (14x14) |
||
NXP |
DUAL CORE 4M FLASH 512K RAM F
|
pacchetto: 256-LBGA |
Azione7.120 |
|
32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 178 | 4MB (4M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 105°C (TA) | - | 256-LBGA | 256-MAPPBGA (17x17) |
||
NXP |
NXP 32-BIT MCU POWER ARCH 3MB
|
pacchetto: 256-LBGA |
Azione5.456 |
|
32-Bit | 120MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 199 | 3MB (3M x 8) | FLASH | 64K x 8 | 192K x 8 | 3 V ~ 5.5 V | A/D 33x10b, 10x12b | Internal | -40°C ~ 125°C (TA) | - | 256-LBGA | 256-MAPBGA |
||
NXP |
NXP 32-BIT MCU POWER ARCH 3MB
|
pacchetto: 256-LBGA |
Azione3.552 |
|
32-Bit | 120MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 199 | 3MB (3M x 8) | FLASH | 64K x 8 | 192K x 8 | 3 V ~ 5.5 V | A/D 33x10b, 10x12b | Internal | -40°C ~ 125°C (TA) | - | 256-LBGA | 256-MAPBGA |
||
NXP |
MCF5234 V2CORE 64KSRAM
|
pacchetto: 256-LBGA |
Azione5.008 |
|
32-Bit | 150MHz | CANbus, EBI/EMI, Ethernet, I²C, SPI, UART/USART | DMA, WDT | 97 | - | ROMless | - | 64K x 8 | 1.4 V ~ 1.6 V | - | External | -40°C ~ 85°C (TA) | - | 256-LBGA | 256-MAPBGA (17x17) |
||
NXP |
NXP 32-BIT MCU DUAL POWER ARCH
|
pacchetto: 256-LBGA |
Azione4.496 |
|
32-Bit Dual-Core | 80MHz/120MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 199 | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 192K x 8 | 3 V ~ 5.5 V | A/D 33x10b, 10x12b | Internal | -40°C ~ 125°C (TA) | - | 256-LBGA | 256-MAPBGA |
||
NXP |
NXP 32-BIT MCU DUAL POWER ARCH
|
pacchetto: 208-LQFP |
Azione6.304 |
|
32-Bit Dual-Core | 80MHz/120MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 177 | 2MB (2M x 8) | FLASH | 64K x 8 | 256K x 8 | 3 V ~ 5.5 V | A/D 33x10b, 10x12b | Internal | -40°C ~ 125°C (TA) | - | 208-LQFP | 208-TQFP (28x28) |
||
NXP |
NXP 32-BIT MCU DUAL POWER ARCH
|
pacchetto: 256-LBGA |
Azione3.600 |
|
32-Bit Dual-Core | 80MHz/120MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 199 | 3MB (3M x 8) | FLASH | 64K x 8 | 256K x 8 | 3 V ~ 5.5 V | A/D 33x10b, 10x12b | Internal | -40°C ~ 105°C (TA) | - | 256-LBGA | 256-MAPBGA |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
pacchetto: 176-LQFP |
Azione6.832 |
|
32-Bit | 125MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 128 | 2MB (2M x 8) | FLASH | - | 1.064M x 8 | 3 V ~ 5.5 V | A/D 16x10b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
pacchetto: 144-LQFP |
Azione2.704 |
|
32-Bit Dual-Core | 66MHz | CANbus, EBI/EMI, I²C, SCI, SPI | DMA, POR, PWM, WDT | 111 | 1.5MB (1.5M x 8) | FLASH | - | 80K x 8 | 4.5 V ~ 5.25 V | A/D 40x12b | Internal | -40°C ~ 105°C (TA) | - | 144-LQFP | 144-LQFP (20x20) |
||
NXP |
NXP 32-BIT MCU DUAL POWER ARCH
|
pacchetto: 256-LBGA |
Azione3.264 |
|
32-Bit Dual-Core | 80MHz/120MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 199 | 2MB (2M x 8) | FLASH | 64K x 8 | 256K x 8 | 3 V ~ 5.5 V | A/D 33x10b, 10x12b | Internal | -40°C ~ 125°C (TA) | - | 256-LBGA | 256-MAPBGA |
||
NXP |
NXP 32-BIT MCU DUAL POWER ARCH
|
pacchetto: 176-LQFP |
Azione2.160 |
|
32-Bit Dual-Core | 80MHz/120MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 3MB (3M x 8) | FLASH | 64K x 8 | 256K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
||
NXP |
NXP 32-BIT MCU DUAL POWER ARCH
|
pacchetto: 176-LQFP |
Azione5.568 |
|
32-Bit Dual-Core | 80MHz/120MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 3MB (3M x 8) | FLASH | 64K x 8 | 256K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
||
NXP |
TRIPLE CORE, 6M FLASH
|
pacchetto: 256-LBGA |
Azione2.816 |
|
32-Bit Tri-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 178 | 6MB (6M x 8) | FLASH | - | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 105°C (TA) | - | 256-LBGA | 256-MAPPBGA (17x17) |
||
NXP |
NXP 32-BIT MCU TRIPLE CORE 4MB
|
pacchetto: 176-LQFP Exposed Pad |
Azione4.800 |
|
32-Bit Tri-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 129 | 4MB (4M x 8) | FLASH | - | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
||
NXP |
ULTRA RELIABLE MCU WITH VAST PER
|
pacchetto: 176-LQFP Exposed Pad |
Azione5.328 |
|
32-Bit Tri-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 129 | 4MB (4M x 8) | FLASH | - | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
pacchetto: 324-BBGA |
Azione7.808 |
|
32-Bit | 150MHz | CANbus, EBI/EMI, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 151 | 2MB (2M x 8) | FLASH | - | 128K x 8 | 1.14 V ~ 5.25 V | A/D 40x12b | Internal | -40°C ~ 125°C (TA) | - | 324-BBGA | 324-TEPBGA (23x23) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
pacchetto: 176-LQFP |
Azione3.328 |
|
32-Bit | 120MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 3MB (3M x 8) | FLASH | 64K x 8 | 192K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
pacchetto: 176-LQFP |
Azione2.032 |
|
32-Bit | 120MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 3MB (3M x 8) | FLASH | 64K x 8 | 192K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
||
NXP |
NXP 32 BIT MCU 2M FLASH 1.5MB
|
pacchetto: 257-LFBGA |
Azione6.752 |
|
32-Bit Tri-Core | 180MHz, 240MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI, ZipWire | POR, PWM, WDT | - | 2MB (2M x 8) | FLASH | 64K x 8 | 1.5M x 8 | 1.19 V ~ 5.5 V | A/D 16x12b SAR, 4x12 Sigma, D/A 1x12b | Internal | -40°C ~ 105°C (TA) | - | 257-LFBGA | 257-MAPBGA (14x14) |
||
NXP |
2M FLASH 1.5MB SRAM 2X
|
pacchetto: 257-LFBGA |
Azione2.144 |
|
32-Bit Tri-Core | 180MHz, 240MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI, ZipWire | POR, PWM, WDT | - | 2MB (2M x 8) | FLASH | 64K x 8 | 1.5M x 8 | 1.19 V ~ 5.5 V | A/D 16x12b SAR, 4x12 Sigma, D/A 1x12b | Internal | -40°C ~ 105°C (TA) | - | 257-LFBGA | 257-MAPBGA (14x14) |
||
NXP |
NXP 32-BIT MCU DUAL POWER ARCH
|
pacchetto: 176-LQFP |
Azione7.776 |
|
32-Bit Dual-Core | 80MHz/120MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 3MB (3M x 8) | FLASH | 64K x 8 | 256K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |