Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Core Size | Speed | Connectivity | Peripherals | Number of I/O | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
pacchetto: 144-LQFP |
Azione3.328 |
|
32-Bit Dual-Core | 66MHz | CANbus, EBI/EMI, I²C, SCI, SPI | DMA, POR, PWM, WDT | 111 | 1MB (1M x 8) | FLASH | - | 64K x 8 | 4.5 V ~ 5.25 V | A/D 40x12b | Internal | -40°C ~ 105°C (TA) | - | 144-LQFP | 144-LQFP (20x20) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
pacchetto: 176-LQFP |
Azione7.072 |
|
32-Bit | 80MHz | CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART | DMA, POR, PWM, WDT | 80 | 1MB (1M x 8) | FLASH | - | 64K x 8 | 4.5 V ~ 5.25 V | A/D 34x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
||
NXP |
SINGLE CORE 3M FLASH 384K RAM
|
pacchetto: 176-LQFP Exposed Pad |
Azione6.144 |
|
32-Bit | 120MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | 129 | 3MB (3M x 8) | FLASH | 64K x 8 | 384K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b, 16x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
||
NXP |
ETHERNET CAMERA MCU
|
pacchetto: 121-LFBGA |
Azione6.096 |
|
32-Bit | 64MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, WDT | 39 | 512KB (512K x 8) | FLASH | 64K x 8 | 96K x 8 | 3 V ~ 3.6 V | A/D 4x10b | Internal | -40°C ~ 105°C (TA) | - | 121-LFBGA | 121-MAPBGA (8x8) |
||
NXP |
DUAL CORE 3M FLASH 384K RAM F
|
pacchetto: 256-LBGA |
Azione7.744 |
|
32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 178 | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | 256-LBGA | 256-MAPPBGA (17x17) |
||
NXP |
32 BIT DUAL CORE 3M FLASH 384
|
pacchetto: 176-LQFP Exposed Pad |
Azione7.888 |
|
32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 129 | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
||
NXP |
32 BIT DUAL CORE 3M FLASH 384
|
pacchetto: 176-LQFP Exposed Pad |
Azione2.592 |
|
32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 129 | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
||
NXP |
DUAL CORE, 3M FLASH, 256
|
pacchetto: 100-LBGA |
Azione6.784 |
|
32-Bit Dual-Core | 80MHz, 160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | - | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | 100-LBGA | 100-MAPBGA (11x11) |
||
NXP |
ETHERNET CAMERA MCU
|
pacchetto: 121-LFBGA |
Azione4.320 |
|
32-Bit | 64MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, WDT | 39 | 512KB (512K x 8) | FLASH | 64K x 8 | 96K x 8 | 3 V ~ 3.6 V | A/D 4x10b | Internal | -40°C ~ 105°C (TA) | - | 121-LFBGA | 121-MAPBGA (8x8) |
||
NXP |
DUAL CORE, 3M FLASH, 256
|
pacchetto: 100-LBGA |
Azione5.664 |
|
32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | - | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | 100-LBGA | 100-MAPBGA (11x11) |
||
NXP |
16-BIT MCU S12X CORE 512KB FLA
|
pacchetto: 144-LQFP |
Azione4.112 |
|
16-Bit | 80MHz | CANbus, EBI/EMI, I²C, SCI, SPI | LVD, POR, PWM, WDT | 119 | 512KB (512K x 8) | FLASH | 4K x 8 | 32K x 8 | 2.35 V ~ 5.5 V | A/D 8x10b, 16x10b | External | -40°C ~ 125°C (TA) | - | 144-LQFP | 144-LQFP (20x20) |
||
NXP |
DUAL CORE 1.5M FLASH
|
pacchetto: 176-LQFP Exposed Pad |
Azione6.448 |
|
32-Bit Dual-Core | 80MHz, 160MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | 129 | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 192K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b, 16x12b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
||
NXP |
SINGLE CORE, 1.5M FLASH
|
pacchetto: 176-LQFP Exposed Pad |
Azione3.072 |
|
32-Bit | 160MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | 129 | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 192K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b, 16x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
||
NXP |
32 BIT DUAL CORE 3M FLASH 384
|
pacchetto: 176-LQFP Exposed Pad |
Azione4.608 |
|
32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 129 | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
pacchetto: 144-LQFP |
Azione6.096 |
|
32-Bit | 80MHz | CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART | DMA, POR, PWM, WDT | 80 | 1MB (1M x 8) | FLASH | - | 64K x 8 | 4.5 V ~ 5.25 V | A/D 32x12b | Internal | -40°C ~ 125°C (TA) | - | 144-LQFP | 144-LQFP (20x20) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
pacchetto: 176-LQFP |
Azione6.528 |
|
32-Bit | 60MHz | CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART | DMA, POR, PWM, WDT | 80 | 1MB (1M x 8) | FLASH | - | 64K x 8 | 4.5 V ~ 5.25 V | A/D 34x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
||
NXP |
16-BIT MCU S12 CORE 256KB FLAS
|
pacchetto: 112-LQFP |
Azione5.120 |
|
16-Bit | 25MHz | CANbus, I²C, SCI, SPI | PWM, WDT | 91 | 256KB (256K x 8) | FLASH | 4K x 8 | 12K x 8 | 2.35 V ~ 5.25 V | A/D 16x10b | Internal | -40°C ~ 85°C (TA) | - | 112-LQFP | 112-LQFP (20x20) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
pacchetto: 144-LQFP |
Azione7.904 |
|
32-Bit | 60MHz | CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART | DMA, POR, PWM, WDT | 80 | 1.5MB (1.5M x 8) | FLASH | - | 94K x 8 | 4.5 V ~ 5.25 V | A/D 32x12b | Internal | -40°C ~ 125°C (TA) | - | 144-LQFP | 144-LQFP (20x20) |
||
NXP |
32 BIT DUAL CORE 3M FLASH 384
|
pacchetto: 100-LBGA |
Azione5.760 |
|
32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | - | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | 100-LBGA | 100-MAPBGA (11x11) |
||
NXP |
32-BIT MCU DUAL CORE POWER ARCH
|
pacchetto: 144-LQFP |
Azione5.184 |
|
32-Bit Dual-Core | 180MHz | CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART | DMA, LVD, POR, WDT | 79 | 2.5MB (2.5M x 8) | FLASH | - | 384K x 8 | 3.15 V ~ 5.5 V | A/D 64x12b | Internal | -40°C ~ 135°C (TA) | - | 144-LQFP | 144-LQFP (20x20) |
||
NXP |
16-BIT MCU S12X CORE 1MB FLASH
|
pacchetto: 144-LQFP |
Azione3.408 |
|
16-Bit | 50MHz | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | LVD, POR, PWM, WDT | 119 | 1MB (1M x 8) | FLASH | 4K x 8 | 64K x 8 | 1.72 V ~ 5.5 V | A/D 24x12b | External | -40°C ~ 105°C (TA) | - | 144-LQFP | 144-LQFP (20x20) |
||
NXP |
DUAL CORE 2M FLASH
|
pacchetto: 176-LQFP Exposed Pad |
Azione5.184 |
|
32-Bit Dual-Core | 80MHz, 160MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | - | 2MB (2M x 8) | FLASH | 64K x 8 | 256K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b, 16x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
||
NXP |
SINGLE CORE 3M FLASH 384K RAM
|
pacchetto: 176-LQFP Exposed Pad |
Azione4.784 |
|
32-Bit | 120MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | 129 | 3MB (3M x 8) | FLASH | 64K x 8 | 384K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b, 16x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
||
NXP |
32 BIT DUAL CORE 3M FLASH 384
|
pacchetto: 100-LBGA |
Azione4.960 |
|
32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | - | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | 100-LBGA | 100-MAPBGA (11x11) |
||
NXP |
150MHZ ARM CORTEX 1.3
|
pacchetto: 169-LFBGA |
Azione7.648 |
|
32-Bit | 150MHz | EBI/EMI, I²C, QSPI, SDHC, SPI, UART/USART, USB | DMA, I²S, PWM, WDT | 120 | 2MB (2M x 8) | FLASH | - | 1M x 8 | 1.71 V ~ 3.6 V | A/D 16b SAR, D/A 2x6b, 1x12b | Internal/External | -40°C ~ 105°C (TA) | - | 169-LFBGA | 169-MAPBGA (9x9) |
||
NXP |
16-BIT MCU S12X CORE 512KB FLA
|
pacchetto: 144-LQFP |
Azione6.144 |
|
16-Bit | 80MHz | CANbus, I²C, SCI, SPI | LVD, POR, PWM, WDT | 119 | 512KB (512K x 8) | FLASH | 4K x 8 | 32K x 8 | 2.35 V ~ 5.5 V | A/D 8x10b, 16x10b | External | -40°C ~ 105°C (TA) | - | 144-LQFP | 144-LQFP (20x20) |
||
NXP |
SINGLE CORE, 2M FLASH
|
pacchetto: 176-LQFP Exposed Pad |
Azione6.736 |
|
32-Bit | 160MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | 129 | 2MB (2M x 8) | FLASH | 64K x 8 | 256K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b, 16x12b | Internal | -40°C ~ 85°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
||
NXP |
32 BIT DUAL CORE 3M FLASH 384
|
pacchetto: 176-LQFP Exposed Pad |
Azione7.840 |
|
32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 129 | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |