Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Current - Supply | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC PWR MANAGEMENT PMAAC 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione7.504 |
|
2mA | 1.55 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN-EP (3x3) |
||
Microchip Technology |
IC PWR MANAGEMENT PMAAC 64QFN
|
pacchetto: 64-VFQFN Exposed Pad |
Azione528.732 |
|
- | 2.9 V ~ 5.5 V | - | Surface Mount | 64-VFQFN Exposed Pad | 64-QFN (7.5x7.5) |
||
Microchip Technology |
IC POWER MANAGEMENT PMAAC 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione7.536 |
|
6mA | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-VQFN (5x5) |
||
Microchip Technology |
IC PWR MGMT ANALOG PMAAC 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione2.064 |
|
- | 2.8 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-VQFN (5x5) |
||
Microchip Technology |
IC PWR MGMT ANALOG PMAAC 32QFN
|
pacchetto: 32-VQFN Exposed Pad |
Azione6.336 |
|
6mA | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 32-VQFN Exposed Pad | 32-QFN (7x7) |
||
Microchip Technology |
IC PWR MANAGER PROG 3OUT 14-TMLF
|
pacchetto: 14-UFQFN Exposed Pad, 14-TMLF? |
Azione4.768 |
|
- | 2.7 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 14-UFQFN Exposed Pad, 14-TMLF? | 14-TMLF? (2.5x2.5) |
||
Microchip Technology |
IC FLASHER W/TRAILER CTRL 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione5.072 |
|
- | 9 V ~ 15 V | -40°C ~ 95°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-DIP |
||
Microchip Technology |
IC POWER MANAGEMENT
|
pacchetto: - |
Azione12.756 |
|
- | - | -40°C ~ 85°C | - | - | - |
||
Microchip Technology |
IC POWER MANAGEMENT
|
pacchetto: - |
Azione31.212 |
|
- | - | - | - | - | - |
||
Microchip Technology |
IC POWER MANAGEMENT 49-BGA
|
pacchetto: 49-BGA |
Azione199.224 |
|
- | - | - | Surface Mount | 49-BGA | - |
||
Microchip Technology |
IC SMART BATTERY CHARGER
|
pacchetto: - |
Azione6.032 |
|
- | - | - | - | - | - |
||
Microchip Technology |
IC PWR MNGMT FOR MOBILES 49-BGA
|
pacchetto: 49-TFBGA |
Azione31.188 |
|
11µA | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 49-TFBGA | 49-BGA (5x5) |
||
Microchip Technology |
IC PWR/BATT MGT DATACOM 100-BGA
|
pacchetto: 100-TFBGA |
Azione2.304 |
|
- | - | -40°C ~ 85°C | Surface Mount | 100-TFBGA | 100-TFBGA (9x9) |
||
Microchip Technology |
IC PWR/BATT MNGMT CELL 49-BGA
|
pacchetto: 49-VFBGA |
Azione23.688 |
|
- | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 49-VFBGA | 49-VFBGA (5x5) |
||
Microchip Technology |
IC FAILSAFE HISIDE/RELAY 16-SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione72.480 |
|
15mA | 4.5 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SO |
||
Microchip Technology |
IC FAILSAFE W/RELAY DRVR 8-SOIC
|
pacchetto: - |
Azione3.328 |
|
15mA | 4.5 V ~ 5.5 V | -40°C ~ 125°C | - | - | - |
||
Microchip Technology |
IC FAILSAFE W/RELAY DRVR 8-SOIC
|
pacchetto: - |
Azione4.384 |
|
15mA | 4.5 V ~ 5.5 V | -40°C ~ 125°C | - | - | - |
||
Microchip Technology |
IC DRIVER HEX THERMAL MON 14SOIC
|
pacchetto: 14-SOIC (0.154", 3.90mm Width) |
Azione495.972 |
|
3.2mA | 4.75 V ~ 5.25 V | -40°C ~ 125°C | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | 14-SO |
||
Microchip Technology |
IC DRIVER TRPL THERMAL MON 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione32.292 |
|
3.2mA | 4.75 V ~ 5.25 V | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SO |
||
Microchip Technology |
IC MOTOR DRIVER PAR 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione1.041.852 |
|
10mA | 9 V ~ 16.5 V | -40°C ~ 85°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-DIP |
||
Microchip Technology |
IC MOTOR DRIVER PAR 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione4.480 |
|
10mA | 9 V ~ 16.5 V | -40°C ~ 85°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-DIP |
||
Microchip Technology |
IC MOTOR DRIVER PAR 8SO
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.880 |
|
10mA | 9 V ~ 16.5 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SO |
||
Microchip Technology |
IC PWR MGMT FOR MOBILES 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione2.144 |
|
- | 3 V ~ 3.6 V | - | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC PWR MGMT FOR MOBILES 32QFN
|
pacchetto: 32-VQFN Exposed Pad |
Azione11.640 |
|
6mA | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 32-VQFN Exposed Pad | 32-QFN (7x7) |
||
Microchip Technology |
IC PWR MGMT FOR MOBILES 48FBGA
|
pacchetto: 48-FBGA |
Azione6.976 |
|
- | 3 V ~ 5.5 V | -20°C ~ 85°C | - | 48-FBGA | - |
||
Microchip Technology |
IC PWR MGMT FOR MOBILES 48FBGA
|
pacchetto: 48-FBGA |
Azione3.600 |
|
- | 3 V ~ 5.5 V | -20°C ~ 85°C | - | 48-FBGA | - |
||
Microchip Technology |
IC POWER MANAGEMENT 48FBGA
|
pacchetto: 48-FBGA |
Azione5.824 |
|
- | - | -20°C ~ 85°C | - | 48-FBGA | - |
||
Microchip Technology |
IC POWER MANAGEMENT 48FBGA
|
pacchetto: 48-FBGA |
Azione7.056 |
|
- | - | -20°C ~ 85°C | - | 48-FBGA | - |