Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC EEPROM 64KBIT 400KHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione16.044 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 6.0 V | 0°C ~ 70°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC FLASH 8MBIT 70NS 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione192.876 |
|
FLASH | FLASH | 8Mb (512K x 16) | Parallel | - | 20µs | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Microchip Technology |
IC FLASH 4MBIT 70NS 32TSOP
|
pacchetto: 32-TFSOP (0.488", 12.40mm Width) |
Azione28.992 |
|
FLASH | FLASH | 4Mb (512K x 8) | Parallel | - | 20µs | 70ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 32-TFSOP (0.488", 12.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC FLASH 2MBIT 55NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione8.904 |
|
FLASH | FLASH | 2Mb (256K x 8) | Parallel | - | 20µs | 55ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
Microchip Technology |
IC FLASH 2MBIT 70NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione150.000 |
|
FLASH | FLASH | 2Mb (256K x 8) | Parallel | - | 20µs | 70ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC FLASH 16MBIT 80MHZ 8SOIC
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione7.632 |
|
FLASH | FLASH | 16Mb (2M x 8) | SPI - Quad I/O | 80MHz | 1.5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
Microchip Technology |
IC FLASH 4MBIT 70NS 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione15.108 |
|
FLASH | FLASH | 4Mb (256K x 16) | Parallel | - | 20µs | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Microchip Technology |
IC FLASH 8MBIT 70NS 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione267.384 |
|
FLASH | FLASH | 8Mb (512K x 16) | Parallel | - | 20µs | 70ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Microchip Technology |
CUSTOM REEL- SST26VF016B-104I/MF
|
pacchetto: 8-WDFN Exposed Pad |
Azione22.356 |
|
FLASH | FLASH | 16Mb (2M x 8) | SPI - Quad I/O | 104MHz | 1.5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WDFN (5x6) |
||
Microchip Technology |
IC EEPROM 512KBIT 400KHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione9.624 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC FLASH 1MBIT 70NS 32TSOP
|
pacchetto: 32-TFSOP (0.488", 12.40mm Width) |
Azione7.584 |
|
FLASH | FLASH | 1Mb (128K x 8) | Parallel | - | 20µs | 70ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 32-TFSOP (0.488", 12.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC FLASH 4MBIT 70NS 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione18.348 |
|
FLASH | FLASH | 4Mb (256K x 16) | Parallel | - | 20µs | 70ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Microchip Technology |
IC FLASH 16MBIT 104MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione16.632 |
|
FLASH | FLASH | 16Mb (2M x 8) | SPI - Quad I/O | 104MHz | 1.5ms | - | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC FLASH 2MBIT 70NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione6.736 |
|
FLASH | FLASH | 2Mb (256K x 8) | Parallel | - | 20µs | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC FLASH 1MBIT 70NS 32TSOP
|
pacchetto: 32-TFSOP (0.488", 12.40mm Width) |
Azione15.984 |
|
FLASH | FLASH | 1Mb (128K x 8) | Parallel | - | 20µs | 70ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 32-TFSOP (0.488", 12.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC FLASH 1MBIT 70NS 32TSOP
|
pacchetto: 32-TFSOP (0.488", 12.40mm Width) |
Azione2.000 |
|
FLASH | FLASH | 1Mb (128K x 8) | Parallel | - | 20µs | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 32-TFSOP (0.488", 12.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC FLASH 2MBIT 70NS 32TSOP
|
pacchetto: 32-TFSOP (0.488", 12.40mm Width) |
Azione225.624 |
|
FLASH | FLASH | 2Mb (256K x 8) | Parallel | - | 20µs | 70ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 32-TFSOP (0.488", 12.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC FLASH 2MBIT 70NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione210.276 |
|
FLASH | FLASH | 2Mb (256K x 8) | Parallel | - | 20µs | 70ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 128KBIT 10MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione7.344 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | SPI | 10MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM 128KBIT 10MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione17.352 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | SPI | 10MHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 128KBIT 10MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione6.276 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | SPI | 10MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 16KBIT 3MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione7.068 |
|
EEPROM | EEPROM | 16Kb (2K x 8, 1K x 16) | SPI | 3MHz | 5ms | - | 2.5 V ~ 6.0 V | 0°C ~ 70°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM 16KBIT 2MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione18.768 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | SPI | 2MHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC FLASH 2MBIT 20MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione69.840 |
|
FLASH | FLASH | 2Mb (256K x 8) | SPI | 20MHz | 20µs | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 8KBIT 3MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione4.480 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | SPI | 3MHz | 5ms | - | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM 256KBIT 1MHZ 8SOIJ
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione7.280 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I2C | 1MHz | 5ms | 400ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIJ |
||
Microchip Technology |
IC EEPROM 128KBIT 400KHZ 8DFN
|
pacchetto: 8-VDFN Exposed Pad |
Azione7.260 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-VDFN Exposed Pad | 8-DFN-S (6x5) |
||
Microchip Technology |
IC EEPROM 256KBIT 400KHZ 8SOIJ
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione7.056 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIJ |