Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC EEPROM 2KBIT 2MHZ 8MINIMAP
|
pacchetto: 8-UFDFN Exposed Pad |
Azione4.832 |
|
EEPROM | EEPROM | 2Kb (256 x 8, 128 x 16) | SPI | 2MHz | 5ms | - | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-Mini Map (2x3) |
||
Microchip Technology |
IC EEPROM 16KBIT 3MHZ SOT23-6
|
pacchetto: SOT-23-6 |
Azione26.196 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | SPI | 3MHz | 2ms | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | SOT-23-6 | SOT-23-6 |
||
Microchip Technology |
IC EEPROM 2KBIT 1MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione18.720 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I2C | 1MHz | 5ms | 550ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 2KBIT 100KHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione12.678 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | Single Wire | 100kHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 4KBIT 1MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione12.090 |
|
EEPROM | EEPROM | 4Kb (256 x 8 x 2) | I2C | 1MHz | 5ms | 350ns | 1.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM 16KBIT 100KHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione15.156 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Single Wire | 100kHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM 16KBIT 400KHZ 8MSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione13.968 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Microchip Technology |
IC EEPROM 16KBIT 400KHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione16.716 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 16KBIT 400KHZ 8TDFN
|
pacchetto: 8-WFDFN Exposed Pad |
Azione4.816 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
IC EEPROM 1KBIT 2MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione4.032 |
|
EEPROM | EEPROM | 1Kb (64 x 16) | SPI | 2MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM 1KBIT 2MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione17.730 |
|
EEPROM | EEPROM | 1Kb (64 x 16) | SPI | 2MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 16KBIT 400KHZ 8TDFN
|
pacchetto: 8-WFDFN Exposed Pad |
Azione7.632 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
IC EEPROM 32KBIT 400KHZ SOT23-5
|
pacchetto: SC-74A, SOT-753 |
Azione36.000 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | SC-74A, SOT-753 | SOT-23-5 |
||
Microchip Technology |
IC EEPROM 2KBIT 2MHZ 8DFN
|
pacchetto: 8-VFDFN Exposed Pad |
Azione6.704 |
|
EEPROM | EEPROM | 2Kb (128 x 16) | SPI | 2MHz | 6ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-VFDFN Exposed Pad | 8-DFN (2x3) |
||
Microchip Technology |
IC EEPROM 1KBIT 2MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione2.618.652 |
|
EEPROM | EEPROM | 1Kb (128 x 8, 64 x 16) | SPI | 2MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM 1KBIT 2MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione7.344 |
|
EEPROM | EEPROM | 1Kb (128 x 8, 64 x 16) | SPI | 2MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 2KBIT 1MHZ SOT23-5
|
pacchetto: SOT-23-5 Thin, TSOT-23-5 |
Azione4.144 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I2C | 1MHz | 5ms | 550ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | SOT-23-5 Thin, TSOT-23-5 | SOT-23-5 |
||
Microchip Technology |
IC EEPROM 8KBIT 20MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione1.770.648 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | SPI | 20MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 8KBIT 1MHZ 4WLCSP
|
pacchetto: 4-XFBGA, WLCSP |
Azione5.808 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | I2C | 1MHz | 5ms | 450ns | 1.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 4-XFBGA, WLCSP | 4-WLCSP (2x2) |
||
Microchip Technology |
IC EEPROM 1KBIT 2MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.096 |
|
EEPROM | EEPROM | 1Kb (128 x 8, 64 x 16) | SPI | 2MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 4KBIT 2MHZ 8DFN
|
pacchetto: 8-VFDFN Exposed Pad |
Azione24.390 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | SPI | 2MHz | 6ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-VFDFN Exposed Pad | 8-DFN (2x3) |
||
Microchip Technology |
IC EEPROM 4KBIT 3MHZ 8DFN
|
pacchetto: 8-VFDFN Exposed Pad |
Azione27.882 |
|
EEPROM | EEPROM | 4Kb (512 x 8, 256 x 16) | SPI | 3MHz | 6ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-VFDFN Exposed Pad | 8-DFN (2x3) |
||
Microchip Technology |
IC EEPROM 4KBIT 2MHZ 8DFN
|
pacchetto: 8-VFDFN Exposed Pad |
Azione45.696 |
|
EEPROM | EEPROM | 4Kb (256 x 16) | SPI | 2MHz | 2ms | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-VFDFN Exposed Pad | 8-DFN (2x3) |
||
Microchip Technology |
IC EEPROM 4KBIT 2MHZ 8DFN
|
pacchetto: 8-VFDFN Exposed Pad |
Azione60.840 |
|
EEPROM | EEPROM | 4Kb (256 x 16) | SPI | 2MHz | 6ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-VFDFN Exposed Pad | 8-DFN (2x3) |
||
Microchip Technology |
IC EEPROM 2KBIT 400KHZ 8MSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione13.272 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Microchip Technology |
IC EEPROM 1KBIT 2MHZ 8DFN
|
pacchetto: 8-VFDFN Exposed Pad |
Azione4.448 |
|
EEPROM | EEPROM | 1Kb (64 x 16) | SPI | 2MHz | 2ms | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-VFDFN Exposed Pad | 8-DFN (2x3) |
||
Microchip Technology |
IC EEPROM 8KBIT 100KHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione12.684 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | Single Wire | 100kHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM 2KBIT 100KHZ SOT23-3
|
pacchetto: TO-236-3, SC-59, SOT-23-3 |
Azione7.472 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | Single Wire | 100kHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | TO-236-3, SC-59, SOT-23-3 | SOT-23-3 |