Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC EEPROM 2KBIT 400KHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione194.544 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 1KBIT 2MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.728 |
|
EEPROM | EEPROM | 1Kb (64 x 16) | SPI | 2MHz | 2ms | - | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 256KBIT 70NS 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione61.800 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 70ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
IC EEPROM 256KBIT 70NS 28TSOP
|
pacchetto: 28-TSSOP (0.465", 11.80mm Width) |
Azione5.872 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 70ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
Microchip Technology |
IC EEPROM 256KBIT 120NS 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione5.424 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 120ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
IC EEPROM 256KBIT 200NS 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione9.204 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 200ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
IC EEPROM 256KBIT 200NS 28TSOP
|
pacchetto: 28-TSSOP (0.465", 11.80mm Width) |
Azione38.676 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 200ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
Microchip Technology |
IC OTP 4MBIT 90NS 44PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione22.764 |
|
EPROM | EPROM - OTP | 4Mb (256K x 16) | Parallel | - | - | 90ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Microchip Technology |
IC FLASH 8MBIT 33MHZ 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione87.900 |
|
FLASH | FLASH | 8Mb (1M x 8) | Parallel | 33MHz | 20µs | 120ns | 3 V ~ 3.6 V | 0°C ~ 85°C (TA) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 64KBIT 70NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione6.368 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 70ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 64KBIT 120NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione13.212 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 120ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC FLASH 64MBIT 104MHZ 8WDFN
|
pacchetto: 8-WDFN Exposed Pad |
Azione16.086 |
|
FLASH | FLASH | 64Mb (8M x 8) | SPI - Quad I/O | 104MHz | 1.5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WDFN (6x8) |
||
Microchip Technology |
IC EEPROM 64KBIT 120NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione6.876 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 120ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 1MBIT 20MHZ 8DFN
|
pacchetto: 8-VDFN Exposed Pad |
Azione19.320 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | SPI | 20MHz | 6ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-VDFN Exposed Pad | 8-DFN-S (6x5) |
||
Microchip Technology |
IC EEPROM 1MBIT 400KHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione6.992 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC FLASH 32MBIT 80MHZ 8SOIC
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione4.512 |
|
FLASH | FLASH | 32Mb (4M x 8) | SPI - Quad I/O | 80MHz | 1.5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 512KBIT 1MHZ 8SOIJ
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione7.560 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | I2C | 1MHz | 5ms | 400ns | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIJ |
||
Microchip Technology |
IC EEPROM 512KBIT 400KHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione45.360 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SRAM 1MBIT 20MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione8.940 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 1Mb (128K x 8) | SPI - Dual I/O | 20MHz | - | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-DIP |
||
Microchip Technology |
IC OTP 1MBIT 70NS 40DIP
|
pacchetto: 40-DIP (0.600", 15.24mm) |
Azione15.828 |
|
EPROM | EPROM - OTP | 1Mb (64K x 16) | Parallel | - | - | 70ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 40-DIP (0.600", 15.24mm) | 40-PDIP |
||
Microchip Technology |
IC OTP 1MBIT 45NS 44PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione18.072 |
|
EPROM | EPROM - OTP | 1Mb (64K x 16) | Parallel | - | - | 45ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Microchip Technology |
IC SRAM 1MBIT 20MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione7.404 |
|
SRAM | SRAM | 1Mb (128K x 8) | SPI - Quad I/O | 20MHz | - | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC FLASH 4MBIT 70NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione412.536 |
|
FLASH | FLASH | 4Mb (512K x 8) | Parallel | - | 20µs | 70ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC SRAM 512KBIT 20MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione2.100 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 512Kb (64K x 8) | SPI - Dual I/O | 20MHz | - | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC FLASH 32MBIT 104MHZ 8WDFN
|
pacchetto: 8-WDFN Exposed Pad |
Azione15.420 |
|
FLASH | FLASH | 32Mb (4M x 8) | SPI - Quad I/O | 104MHz | 1.5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WDFN (5x6) |
||
Microchip Technology |
IC EEPROM 512KBIT 20MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione15.360 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | SPI | 20MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM 512KBIT 20MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione8.100 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | SPI | 20MHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SRAM 512KBIT 20MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione17.880 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 512Kb (64K x 8) | SPI - Dual I/O | 20MHz | - | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |