Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC EEPROM 2KBIT 1MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione4.016 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I2C | 1MHz | 5ms | 550ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 2KBIT 1MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione5.808 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I2C | 1MHz | 5ms | 550ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM 2KBIT 1MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione9.708 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I2C | 1MHz | 5ms | 550ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 2KBIT 1MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione101.172 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I2C | 1MHz | 5ms | 550ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 2KBIT 1MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione76.200 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I2C | 1MHz | 5ms | 550ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC FLASH 16MBIT 50MHZ 8VDFN
|
pacchetto: 8-VDFN Exposed Pad |
Azione7.440 |
|
FLASH | FLASH | 16Mb (528 Bytes x 4096 pages) | SPI | 50MHz | 6ms | - | 2.5 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-VDFN Exposed Pad | 8-VDFN (6x5) |
||
Microchip Technology |
IC EEPROM 1KBIT 2MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione2.256 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | SPI | 2MHz | 6ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM 1MBIT 1MHZ 8SAP
|
pacchetto: 8-VDFN Exposed Pad |
Azione5.664 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | I2C | 1MHz | 10ms | 550ns | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-VDFN Exposed Pad | 8-SAP (4.9x6.0) |
||
Microchip Technology |
IC EEPROM 512KBIT 10MHZ 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione6.432 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | SPI | 10MHz | 10ms | - | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Microchip Technology |
IC EEPROM 1MBIT 1MHZ 8SOIC
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione4.432 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | I2C | 1MHz | 10ms | 550ns | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 16KBIT 2MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione7.888 |
|
EEPROM | EEPROM | 16Kb (2K x 8, 1K x 16) | SPI | 2MHz | 10ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM 4KBIT 2MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione2.464 |
|
EEPROM | EEPROM | 4Kb (512 x 8, 256 x 16) | SPI | 2MHz | 10ms | - | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 4KBIT 2MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione4.848 |
|
EEPROM | EEPROM | 4Kb (512 x 8, 256 x 16) | SPI | 2MHz | 10ms | - | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 4KBIT 2MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.496 |
|
EEPROM | EEPROM | 4Kb (512 x 8, 256 x 16) | SPI | 2MHz | 10ms | - | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 4KBIT 2MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione3.200 |
|
EEPROM | EEPROM | 4Kb (512 x 8, 256 x 16) | SPI | 2MHz | 10ms | - | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 4KBIT 2MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione36.000 |
|
EEPROM | EEPROM | 4Kb (512 x 8, 256 x 16) | SPI | 2MHz | 10ms | - | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM 4KBIT 2MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione2.288 |
|
EEPROM | EEPROM | 4Kb (512 x 8, 256 x 16) | SPI | 2MHz | 10ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM 2KBIT 2MHZ 8MAP
|
pacchetto: 8-UDFN Exposed Pad |
Azione4.768 |
|
EEPROM | EEPROM | 2Kb (256 x 8, 128 x 16) | SPI | 2MHz | 10ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UDFN Exposed Pad | 8-MAP (3x4.9) |
||
Microchip Technology |
IC EEPROM 2KBIT 2MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione69.744 |
|
EEPROM | EEPROM | 2Kb (256 x 8, 128 x 16) | SPI | 2MHz | 10ms | - | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM 2KBIT 2MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione4.640 |
|
EEPROM | EEPROM | 2Kb (256 x 8, 128 x 16) | SPI | 2MHz | 10ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM 2KBIT 2MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione3.552 |
|
EEPROM | EEPROM | 2Kb (256 x 8, 128 x 16) | SPI | 2MHz | 10ms | - | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 1KBIT 2MHZ 8MAP
|
pacchetto: 8-UDFN Exposed Pad |
Azione6.832 |
|
EEPROM | EEPROM | 1Kb (128 x 8, 64 x 16) | SPI | 2MHz | 10ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UDFN Exposed Pad | 8-MAP (3x4.9) |
||
Microchip Technology |
IC EEPROM 1KBIT 2MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione48.048 |
|
EEPROM | EEPROM | 1Kb (128 x 8 , 64 x 16) | SPI | 2MHz | 10ms | - | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 1KBIT 2MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.616 |
|
EEPROM | EEPROM | 1Kb (128 x 8 , 64 x 16) | SPI | 2MHz | 10ms | - | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 1KBIT 2MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.512 |
|
EEPROM | EEPROM | 1Kb (128 x 8 , 64 x 16) | SPI | 2MHz | 10ms | - | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 1KBIT 2MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione5.920 |
|
EEPROM | EEPROM | 1Kb (128 x 8 , 64 x 16) | SPI | 2MHz | 10ms | - | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM 1KBIT 2MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione7.712 |
|
EEPROM | EEPROM | 1Kb (128 x 8, 64 x 16) | SPI | 2MHz | 10ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM 1KBIT 2MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione4.288 |
|
EEPROM | EEPROM | 1Kb (128 x 8 , 64 x 16) | SPI | 2MHz | 10ms | - | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |