Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC EEPROM 64KBIT 200NS 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione5.328 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 200ns | 2.7 V ~ 3.6 V | -40°C ~ 125°C (TC) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
IC EEPROM 64KBIT 200NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione4.608 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 200ns | 2.7 V ~ 3.6 V | -40°C ~ 125°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 256KBIT 200NS 28TSOP
|
pacchetto: 28-TSSOP (0.465", 11.80mm Width) |
Azione2.080 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 200ns | 2.7 V ~ 3.6 V | -40°C ~ 125°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
Microchip Technology |
IC EEPROM 256KBIT 200NS 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione6.464 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 200ns | 2.7 V ~ 3.6 V | -40°C ~ 125°C (TC) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
IC EEPROM 256KBIT 200NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione5.792 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 200ns | 2.7 V ~ 3.6 V | -40°C ~ 125°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC OTP 512KBIT 70NS 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione3.680 |
|
EPROM | EPROM - OTP | 512Kb (64K x 8) | Parallel | - | - | 70ns | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microchip Technology |
IC OTP 2MBIT 100NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione3.120 |
|
EPROM | EPROM - OTP | 2Mb (256K x 8) | Parallel | - | - | 100ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 1MBIT 2.1MHZ 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione12.744 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | SPI | 2.1MHz | 5ms | - | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC EEPROM 1MBIT 2.1MHZ 8LAP
|
pacchetto: 8-TDFN |
Azione5.200 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | SPI | 2.1MHz | 5ms | - | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 8-TDFN | 8-LAP (5x8) |
||
Microchip Technology |
IC EEPROM 1MBIT 2.1MHZ 8LAP
|
pacchetto: 8-TDFN |
Azione7.040 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | SPI | 1MHz | 10ms | - | 1.8 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-TDFN | 8-LAP (5x8) |
||
Microchip Technology |
IC EEPROM 512KBIT 10MHZ 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione14.628 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | SPI | 10MHz | 10ms | - | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Microchip Technology |
IC EEPROM 512KBIT 10MHZ 8LAP
|
pacchetto: 8-TDFN |
Azione18.360 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | SPI | 10MHz | 10ms | - | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TDFN | 8-LAP (5x8) |
||
Microchip Technology |
IC EEPROM 512KBIT 10MHZ 8LAP
|
pacchetto: 8-TDFN |
Azione7.312 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | SPI | 10MHz | 10ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TDFN | 8-LAP (5x8) |
||
Microchip Technology |
IC EEPROM 512KBIT 10MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione4.304 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | SPI | 10MHz | 10ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM 512KBIT 10MHZ 8LAP
|
pacchetto: 8-TDFN |
Azione4.848 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | SPI | 10MHz | 10ms | - | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TDFN | 8-LAP (5x8) |
||
Microchip Technology |
IC EEPROM 512KBIT 10MHZ 8LAP
|
pacchetto: 8-TDFN |
Azione6.400 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | SPI | 10MHz | 10ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TDFN | 8-LAP (5x8) |
||
Microchip Technology |
IC EEPROM 256KBIT 10MHZ 8SOIC
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione5.776 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | SPI | 10MHz | 10ms | - | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 256KBIT 10MHZ 8SOIC
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione3.280 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | SPI | 10MHz | 10ms | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 256KBIT 10MHZ 8SOIC
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione23.880 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | SPI | 10MHz | 10ms | - | 2.7 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 256KBIT 10MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione7.296 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | SPI | 10MHz | 10ms | - | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM 256KBIT 10MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione3.104 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | SPI | 10MHz | 10ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC FLASH 512KBIT 20MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione558.384 |
|
FLASH | FLASH | 512Kb (64K x 8) | SPI | 20MHz | 100µs | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 64KBIT 3MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.912 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | SPI | 3MHz | 5ms | - | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 64KBIT 3MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.080 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | SPI | 3MHz | 5ms | - | 1.8 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 32KBIT 3MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.424 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | SPI | 3MHz | 5ms | - | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 32KBIT 3MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.288 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | SPI | 3MHz | 5ms | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 32KBIT 3MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.816 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | SPI | 3MHz | 5ms | - | 2.7 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 32KBIT 3MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione2.656 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | SPI | 3MHz | 5ms | - | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |