Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
512MBYTE USB FIRMWARE MEMORY 125
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.640 |
|
FLASH | FLASH | 4Mb (512K x 8) | SPI | 40MHz | 5ms | - | 2.3V ~ 3.6V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
16MBIT SPI/SQI FLASH 125C AUTO 2
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.064 |
|
FLASH | FLASH | 16M (2M x 8) | SPI - Quad I/O | 80MHz | 1.5ms | - | 2.3V ~ 3.6V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
16MBIT SPI/SQI FLASH 125C AUTO 2
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione3.936 |
|
FLASH | FLASH | 16M (2M x 8) | SPI - Quad I/O | 80MHz | 1.5ms | - | 2.3V ~ 3.6V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIJ |
||
Microchip Technology |
16MBIT SPI/SQI FLASH 125C AUTO 2
|
pacchetto: 8-WDFN Exposed Pad |
Azione4.896 |
|
FLASH | FLASH | 16M (2M x 8) | SPI - Quad I/O | 80MHz | 1.5ms | - | 2.3V ~ 3.6V | -40°C ~ 125°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WDFN (5x6) |
||
Microchip Technology |
16MBIT SPI/SQI FLASH 125C AUTO 2
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.168 |
|
FLASH | FLASH | 16M (2M x 8) | SPI - Quad I/O | 80MHz | 1.5ms | - | 2.3V ~ 3.6V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
16MBIT SPI/SQI FLASH 125C AUTO 2
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione7.840 |
|
FLASH | FLASH | 16M (2M x 8) | SPI - Quad I/O | 80MHz | 1.5ms | - | 2.3V ~ 3.6V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIJ |
||
Microchip Technology |
16MBIT SPI/SQI FLASH 125C AUTO 2
|
pacchetto: 8-WDFN Exposed Pad |
Azione2.544 |
|
FLASH | FLASH | 16M (2M x 8) | SPI - Quad I/O | 80MHz | 1.5ms | - | 2.3V ~ 3.6V | -40°C ~ 125°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WDFN (5x6) |
||
Microchip Technology |
16K 5.0V EERAM 125C AUTO
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.784 |
|
EERAM | EEPROM, SRAM | 16Kb (2K x 8) | I²C | 1MHz | 1ms | - | 4.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
16K 5.0V EERAM 125C AUTO
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione2.832 |
|
EERAM | EEPROM, SRAM | 16Kb (2K x 8) | I²C | 1MHz | 1ms | - | 4.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
4KB I2C EEPROM 1MHZ 1.7-5.5V 8-P
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione5.904 |
|
EEPROM | EEPROM | 4Kb (256 x 8 x 2) | I²C | 1MHz | 5ms | 450ns | 1.7V ~ 5.5V | -40°C ~ 125°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
4KB I2C EEPROM 1MHZ 1.7-5.5V 8-P
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione6.464 |
|
EEPROM | EEPROM | 4Kb (256 x 8 x 2) | I²C | 1MHz | 5ms | 450ns | 1.7V ~ 5.5V | -40°C ~ 125°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
2KB I2C EEPROM 1MHZ 1.7-5.5V 8-P
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione7.088 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I²C | 1MHz | 5ms | 450ns | 1.7V ~ 5.5V | -40°C ~ 125°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
1KB I2C EEPROM 1MHZ 1.7-5.5V 8-P
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione7.168 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I²C | 1MHz | 5ms | 450ns | 1.7V ~ 5.5V | -40°C ~ 125°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
4KB I2C EEPROM 1MHZ 1.7-5.5V 8-M
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione6.464 |
|
EEPROM | EEPROM | 4Kb (256 x 8 x 2) | I²C | 1MHz | 5ms | 450ns | 1.7V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Microchip Technology |
4KB I2C EEPROM 1MHZ 1.7-5.5V 8-M
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione5.072 |
|
EEPROM | EEPROM | 4Kb (256 x 8 x 2) | I²C | 1MHz | 5ms | 450ns | 1.7V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Microchip Technology |
4KB I2C EEPROM 1MHZ 1.7-5.5V 8-T
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione6.032 |
|
EEPROM | EEPROM | 4Kb (256 x 8 x 2) | I²C | 1MHz | 5ms | 450ns | 1.7V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
4KB I2C EEPROM 1MHZ 1.7-5.5V 8-T
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione3.984 |
|
EEPROM | EEPROM | 4Kb (256 x 8 x 2) | I²C | 1MHz | 5ms | 450ns | 1.7V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
2KB I2C EEPROM 1MHZ 1.7-5.5V 8-M
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione2.608 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I²C | 1MHz | 5ms | 450ns | 1.7V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Microchip Technology |
2KB I2C EEPROM 1MHZ 1.7-5.5V 8-T
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione5.952 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I²C | 1MHz | 5ms | 450ns | 1.7V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
1KB I2C EEPROM 1MHZ 1.7-5.5V 8-M
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione5.376 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I²C | 1MHz | 5ms | 450ns | 1.7V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Microchip Technology |
4KB I2C EEPROM 1MHZ 1.7-5.5V 8-S
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.160 |
|
EEPROM | EEPROM | 4Kb (256 x 8 x 2) | I²C | 1MHz | 5ms | 450ns | 1.7V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
4KB I2C EEPROM 1MHZ 1.7-5.5V 8-S
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione3.360 |
|
EEPROM | EEPROM | 4Kb (256 x 8 x 2) | I²C | 1MHz | 5ms | 450ns | 1.7V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
1KB I2C EEPROM 1MHZ 1.7-5.5V 8-T
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione2.256 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I²C | 1MHz | 5ms | 450ns | 1.7V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
2KB I2C EEPROM 1MHZ 1.7-5.5V 8-S
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione2.192 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I²C | 1MHz | 5ms | 450ns | 1.7V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
1KB I2C EEPROM 1MHZ 1.7-5.5V 8-S
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.744 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I²C | 1MHz | 5ms | 450ns | 1.7V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
4KB I2C EEPROM 1MHZ 1.7-5.5V 8-T
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione4.464 |
|
EEPROM | EEPROM | 4Kb (256 x 8 x 2) | I²C | 1MHz | 5ms | 450ns | 1.7V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
4KB I2C EEPROM 1MHZ 1.7-5.5V 8-M
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione2.672 |
|
EEPROM | EEPROM | 4Kb (256 x 8 x 2) | I²C | 1MHz | 5ms | 450ns | 1.7V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Microchip Technology |
4KB I2C EEPROM 1MHZ 1.7-5.5V 8-T
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione2.016 |
|
EEPROM | EEPROM | 4Kb (256 x 8 x 2) | I²C | 1MHz | 5ms | 450ns | 1.7V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |