Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC EEPROM 256KBIT 90NS 28TSOP
|
pacchetto: 28-TSSOP (0.465", 11.80mm Width) |
Azione5.040 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 90ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
Microchip Technology |
IC EEPROM 256KBIT 90NS 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione5.376 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 90ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
IC EEPROM 256KBIT 90NS 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione7.840 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 90ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
IC EEPROM 256KBIT 90NS 28DIP
|
pacchetto: 28-DIP (0.600", 15.24mm) |
Azione2.736 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 90ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
||
Microchip Technology |
IC EEPROM 256KBIT 90NS 28DIP
|
pacchetto: 28-DIP (0.600", 15.24mm) |
Azione2.320 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 90ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
||
Microchip Technology |
IC EEPROM 256KBIT 90NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione6.096 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 90ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 256KBIT 90NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione6.272 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 90ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 256KBIT 70NS 28TSOP
|
pacchetto: 28-TSSOP (0.465", 11.80mm Width) |
Azione7.296 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 70ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
Microchip Technology |
IC EEPROM 256KBIT 70NS 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione7.904 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 70ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
IC EEPROM 256KBIT 70NS 28DIP
|
pacchetto: 28-DIP (0.600", 15.24mm) |
Azione2.688 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 70ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
||
Microchip Technology |
IC EEPROM 256KBIT 70NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione3.024 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 70ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 256KBIT 120NS 28TSOP
|
pacchetto: 28-TSSOP (0.465", 11.80mm Width) |
Azione2.768 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 120ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
Microchip Technology |
IC EEPROM 256KBIT 120NS 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione11.976 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 120ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
IC EEPROM 256KBIT 120NS 28DIP
|
pacchetto: 28-DIP (0.600", 15.24mm) |
Azione2.800 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 120ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
||
Microchip Technology |
IC EEPROM 256KBIT 120NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione6.032 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 120ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 256KBIT 90NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione2.208 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 90ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 256KBIT 90NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione9.672 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 90ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 256KBIT 70NS 28TSOP
|
pacchetto: 28-TSSOP (0.465", 11.80mm Width) |
Azione2.288 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 70ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
Microchip Technology |
IC EEPROM 256KBIT 70NS 28TSOP
|
pacchetto: 28-TSSOP (0.465", 11.80mm Width) |
Azione3.152 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 70ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
Microchip Technology |
IC EEPROM 256KBIT 70NS 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione2.400 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 70ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
IC EEPROM 256KBIT 70NS 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione2.448 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 70ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
IC EEPROM 256KBIT 70NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione6.816 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 70ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 256KBIT 70NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione2.608 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 70ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 64KBIT 250NS 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione3.808 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 1ms | 250ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
IC EEPROM 64KBIT 250NS 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione4.944 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 1ms | 250ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
IC EEPROM 64KBIT 250NS 28DIP
|
pacchetto: 28-DIP (0.600", 15.24mm) |
Azione4.336 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 1ms | 250ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
||
Microchip Technology |
IC EEPROM 64KBIT 250NS 28DIP
|
pacchetto: 28-DIP (0.600", 15.24mm) |
Azione6.704 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 1ms | 250ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
||
Microchip Technology |
IC EEPROM 64KBIT 250NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione6.672 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 1ms | 250ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |