Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC EEPROM 256KBIT 2.1MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione5.808 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | SPI | 2.1MHz | 10ms | - | 1.8 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microchip Technology |
IC EEPROM 256KBIT 3MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione4.944 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | SPI | 3MHz | 5ms | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microchip Technology |
IC EEPROM 256KBIT 3MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione4.752 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | SPI | 3MHz | 5ms | - | 2.7 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microchip Technology |
IC EEPROM 256KBIT 2.1MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione5.072 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | SPI | 2.1MHz | 10ms | - | 1.8 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microchip Technology |
IC EEPROM 256KBIT 3MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione4.624 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | SPI | 3MHz | 5ms | - | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microchip Technology |
IC EEPROM 256KBIT 2.1MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione4.592 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | SPI | 2.1MHz | 10ms | - | 1.8 V ~ 3.6 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM 256KBIT 2.1MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione7.696 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | SPI | 2.1MHz | 10ms | - | 1.8 V ~ 3.6 V | 0°C ~ 70°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM 256KBIT 3MHZ 8LAP
|
pacchetto: 8-TDFN |
Azione7.696 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | SPI | 3MHz | 5ms | - | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 8-TDFN | 8-LAP (5x6) |
||
Microchip Technology |
IC EEPROM 128KBIT 3MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione763.188 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | SPI | 3MHz | 5ms | - | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microchip Technology |
IC EEPROM 128KBIT 2.1MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione6.224 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | SPI | 2.1MHz | 10ms | - | 1.8 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microchip Technology |
IC EEPROM 128KBIT 3MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione4.272 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | SPI | 3MHz | 5ms | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microchip Technology |
IC EEPROM 128KBIT 3MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione2.816 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | SPI | 3MHz | 5ms | - | 2.7 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microchip Technology |
IC EEPROM 128KBIT 2.1MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione2.768 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | SPI | 2.1MHz | 10ms | - | 1.8 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microchip Technology |
IC EEPROM 128KBIT 3MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione4.816 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | SPI | 3MHz | 5ms | - | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microchip Technology |
IC EEPROM 128KBIT 3MHZ 14TSSOP
|
pacchetto: 14-TSSOP (0.173", 4.40mm Width) |
Azione4.080 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | SPI | 3MHz | 5ms | - | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 14-TSSOP (0.173", 4.40mm Width) | 14-TSSOP |
||
Microchip Technology |
IC EEPROM 128KBIT 3MHZ 14TSSOP
|
pacchetto: 14-TSSOP (0.173", 4.40mm Width) |
Azione4.384 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | SPI | 3MHz | 5ms | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 14-TSSOP (0.173", 4.40mm Width) | 14-TSSOP |
||
Microchip Technology |
IC EEPROM 128KBIT 3MHZ 14TSSOP
|
pacchetto: 14-TSSOP (0.173", 4.40mm Width) |
Azione7.296 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | SPI | 3MHz | 5ms | - | 2.7 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 14-TSSOP (0.173", 4.40mm Width) | 14-TSSOP |
||
Microchip Technology |
IC EEPROM 128KBIT 3MHZ 14TSSOP
|
pacchetto: 14-TSSOP (0.173", 4.40mm Width) |
Azione3.120 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | SPI | 3MHz | 5ms | - | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 14-TSSOP (0.173", 4.40mm Width) | 14-TSSOP |
||
Microchip Technology |
IC EEPROM 128KBIT 3MHZ 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione4.352 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | SPI | 3MHz | 5ms | - | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Microchip Technology |
IC EEPROM 128KBIT 2.1MHZ 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione7.712 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | SPI | 2.1MHz | 10ms | - | 1.8 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Microchip Technology |
IC EEPROM 128KBIT 3MHZ 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione7.744 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | SPI | 3MHz | 5ms | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Microchip Technology |
IC EEPROM 128KBIT 3MHZ 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione210.720 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | SPI | 3MHz | 5ms | - | 2.7 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Microchip Technology |
IC EEPROM 128KBIT 2.1MHZ 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione6.736 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | SPI | 2.1MHz | 10ms | - | 1.8 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Microchip Technology |
IC EEPROM 128KBIT 3MHZ 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione6.704 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | SPI | 3MHz | 5ms | - | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Microchip Technology |
IC EEPROM 128KBIT 2.1MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione33.576 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | SPI | 2.1MHz | 10ms | - | 1.8 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 128KBIT 2.1MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione2.592 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | SPI | 2.1MHz | 10ms | - | 1.8 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 128KBIT 2.1MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione6.928 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | SPI | 2.1MHz | 10ms | - | 1.8 V ~ 3.6 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM 128KBIT 2.1MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione6.816 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | SPI | 2.1MHz | 10ms | - | 1.8 V ~ 3.6 V | 0°C ~ 70°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |