Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC FLASH 2MBIT 80MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.904 |
|
FLASH | FLASH | 2Mb (256K x 8) | SPI | 80MHz | 10µs | - | 2.3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC FLASH 2MBIT 80MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione9.936 |
|
FLASH | FLASH | 2Mb (256K x 8) | SPI | 80MHz | 10µs | - | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC FLASH 2MBIT 33MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione269.124 |
|
FLASH | FLASH | 2Mb (256K x 8) | SPI | 33MHz | 20µs | - | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 4KBIT 5MHZ M2J
|
pacchetto: M2 J, Smart Card Module (TWI) |
Azione7.792 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | I2C | 5MHz | 5ms | 35µs | 2.7 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | M2 J, Smart Card Module (TWI) | M2 - J Module (TWI) |
||
Microchip Technology |
IC EEPROM 2KBIT 5MHZ M2P
|
pacchetto: M2 P, Smart Card Module (TWI) |
Azione2.720 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I2C | 5MHz | 5ms | 35µs | 2.7 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | M2 P, Smart Card Module (TWI) | M2 - P Module (TWI) |
||
Microchip Technology |
IC EEPROM 2KBIT 4MHZ M2J
|
pacchetto: M2 J, Smart Card Module (ISO) |
Azione6.288 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I2C | 4MHz | 5ms | 250ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | M2 J, Smart Card Module (ISO) | M2 - J Module (ISO) |
||
Microchip Technology |
IC EEPROM 1KBIT 4MHZ M2P
|
pacchetto: M2 J, Smart Card Module (ISO) |
Azione6.096 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I2C | 4MHz | 5ms | 250ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | M2 J, Smart Card Module (ISO) | M2 - P Module (ISO) |
||
Microchip Technology |
IC EEPROM 256KBIT 400KHZ 8SOIJ
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione5.328 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIJ |
||
Microchip Technology |
IC EEPROM 128KBIT 1MHZ 8DFNS
|
pacchetto: 8-VDFN Exposed Pad |
Azione6.336 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | I2C | 1MHz | 5ms | 400ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-VDFN Exposed Pad | 8-DFN-S (6x5) |
||
Microchip Technology |
IC EEPROM 128KBIT 400KHZ 8DFN
|
pacchetto: 8-VDFN Exposed Pad |
Azione5.280 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-VDFN Exposed Pad | 8-DFN-S (6x5) |
||
Microchip Technology |
IC EEPROM 128KBIT 400KHZ 8DFN
|
pacchetto: 8-VDFN Exposed Pad |
Azione2.640 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-VDFN Exposed Pad | 8-DFN-S (6x5) |
||
Microchip Technology |
IC EEPROM 256KBIT 400KHZ 8SOIJ
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione4.128 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIJ |
||
Microchip Technology |
IC EEPROM 128KBIT 400KHZ 8DFN
|
pacchetto: 8-VDFN Exposed Pad |
Azione10.128 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-VDFN Exposed Pad | 8-DFN-S (6x5) |
||
Microchip Technology |
IC EEPROM 128KBIT 1MHZ 8DFN
|
pacchetto: 8-VDFN Exposed Pad |
Azione4.176 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | I2C | 1MHz | 5ms | 400ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-VDFN Exposed Pad | 8-DFN-S (6x5) |
||
Microchip Technology |
IC EEPROM 16KBIT 2MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.544 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | SPI | 2MHz | 5ms | - | 2.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 16KBIT 2MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione9.360 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | SPI | 2MHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 16KBIT 3MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.096 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | SPI | 3MHz | 5ms | - | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 16KBIT 3MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.016 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | SPI | 3MHz | 5ms | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 16KBIT 1MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.136 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | SPI | 1MHz | 5ms | - | 1.8 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 16KBIT 1MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione14.280 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | SPI | 1MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 256KBIT 1MHZ 8SOIJ
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione17.256 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I2C | 1MHz | 5ms | 400ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIJ |
||
Microchip Technology |
IC EEPROM 256KBIT 400KHZ 8SOIJ
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione4.992 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIJ |
||
Microchip Technology |
IC EEPROM 256KBIT 400KHZ 8SOIJ
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione4.896 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIJ |
||
Microchip Technology |
IC EEPROM 16KBIT 2MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione20.100 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | SPI | 2MHz | 5ms | - | 2.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 16KBIT 1MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione12.756 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | SPI | 1MHz | 5ms | - | 1.8 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EERAM 16KBIT 1MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.280 |
|
EERAM | EEPROM, SRAM | 16Kb (2K x 8) | I2C | 1MHz | 1ms | 400ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EERAM 16KBIT 1MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.184 |
|
EERAM | EEPROM, SRAM | 16Kb (2K x 8) | I2C | 1MHz | 1ms | 400ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC SRAM 64KBIT 20MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione4.496 |
|
SRAM | SRAM | 64Kb (8K x 8) | SPI | 20MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |