Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Size | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC SRL CONFG EEPROM 2M LV 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione12.564 |
|
2Mb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SRL CONFG EEPROM 4M LV 44PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione20.208 |
|
4Mb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 64K 8LAP
|
pacchetto: 8-TDFN |
Azione2.192 |
|
64kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-TDFN | 8-LAP (6x6) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 512K 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione6.736 |
|
512kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SRL CONFIG EEPROM 512K 8LAP
|
pacchetto: 8-TDFN |
Azione6.672 |
|
512kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-TDFN | 8-LAP (6x6) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 256K 8LAP
|
pacchetto: 8-TDFN |
Azione5.712 |
|
256Kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-TDFN | 8-LAP (6x6) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 128K 8LAP
|
pacchetto: 8-TDFN |
Azione7.888 |
|
128kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-TDFN | 8-LAP (6x6) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 1M 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione5.232 |
|
1Mb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SRL CONFIG EEPROM 1M 8LAP
|
pacchetto: 8-TDFN |
Azione4.800 |
|
1Mb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-TDFN | 8-LAP (6x6) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 2M 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione2.512 |
|
2Mb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 2M 8LAP
|
pacchetto: 8-TDFN |
Azione6.832 |
|
2Mb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-TDFN | 8-LAP (6x6) |
||
Microchip Technology |
IC CONFIG SEEPROM 512K 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione5.056 |
|
512kb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC CONFIG SEEPROM 512K 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione6.544 |
|
512kb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SRL CONFIG EEPROM 512K 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione69.072 |
|
512kb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SRL CONFIG EEPROM 512K 8-LAP
|
pacchetto: 8-TDFN |
Azione2.784 |
|
512kb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-TDFN | 8-LAP (6x6) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 256K 8-LAP
|
pacchetto: 8-TDFN |
Azione3.088 |
|
256Kb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-TDFN | 8-LAP (6x6) |
||
Microchip Technology |
IC SRL CONFG EEPROM 4M LV 44PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione2.336 |
|
4Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Microchip Technology |
IC SRL CONFG EEPROM 4M LV 44PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione6.832 |
|
4Mb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 2M 44-PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione3.072 |
|
4Mb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 1M 32-TQFP
|
pacchetto: 32-TQFP |
Azione3.328 |
|
1Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 32-TQFP | 32-TQFP (7x7) |
||
Microchip Technology |
IC CONFIG SEEPROM 1M 3.3V 32TQFP
|
pacchetto: 32-TQFP |
Azione3.088 |
|
1Mb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 32-TQFP | 32-TQFP (7x7) |
||
Microchip Technology |
IC CONFIG SEEPROM 1M 3.3V 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione45.840 |
|
1Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC CONFIG SEEPROM 1M 3.3V 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione5.232 |
|
1Mb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SRL CONFIG EEPROM 1M 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione4.624 |
|
1Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SRL CONFIG EEPROM 1M 8-LAP
|
pacchetto: 8-TDFN |
Azione2.576 |
|
1Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-TDFN | 8-LAP (6x6) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 2M 20-PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione8.916 |
|
2Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 2M 44-PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione7.632 |
|
2Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 64K 8LAP
|
pacchetto: 8-TDFN |
Azione6.480 |
|
64kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-TDFN | 8-LAP |