Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Interrupt Output | Features | Output Type | Current - Output Source/Sink | Clock Frequency | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC I/O EXPANDER CAN 8B 14SOIC
|
pacchetto: 14-SOIC (0.154", 3.90mm Width) |
Azione11.784 |
|
CAN V2.0b | No | ADC, EEPROM, PWM | Push-Pull | 25mA | 4MHz | 2.75 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | 14-SOIC |
||
Microchip Technology |
IC I/O EXPANDER I2C 16B 28SDIP
|
pacchetto: 28-DIP (0.300", 7.62mm) |
Azione14.244 |
|
I2C | Yes | POR | Push-Pull | 25mA | 400kHz | 2 V ~ 5.5 V | -40°C ~ 85°C | Through Hole | 28-DIP (0.300", 7.62mm) | 28-SPDIP |
||
Microchip Technology |
IC I/O EXPANDER I2C 8B 18DIP
|
pacchetto: 18-DIP (0.300", 7.62mm) |
Azione13.722 |
|
I2C | Yes | POR | Push-Pull | 25mA | 1.7MHz | 1.8 V ~ 5.5 V | -40°C ~ 125°C | Through Hole | 18-DIP (0.300", 7.62mm) | 18-PDIP |
||
Microchip Technology |
IC I/O EXPANDER I2C 16B 28SSOP
|
pacchetto: 28-SSOP (0.209", 5.30mm Width) |
Azione14.940 |
|
I2C | Yes | POR | Push-Pull | 25mA | 400kHz | 2 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 28-SSOP (0.209", 5.30mm Width) | 28-SSOP |
||
Microchip Technology |
IC I/O EXPANDER SPI 16B 24QFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione6.608 |
|
SPI | Yes | - | Open Drain | 25mA | 10MHz | 1.8 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
Microchip Technology |
IC I/O EXPANDER SPI 16B 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione14.052 |
|
SPI | Yes | - | Open Drain | 25mA | 10MHz | 1.8 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
IC I/O EXPANDER SPI 16B 28QFN
|
pacchetto: 28-VQFN Exposed Pad |
Azione6.176 |
|
SPI | Yes | POR | Push-Pull | 25mA | 10MHz | 1.8 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 28-VQFN Exposed Pad | 28-QFN (6x6) |
||
Microchip Technology |
IC I/O EXPANDER I2C 16B 24QFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione13.896 |
|
I2C | Yes | POR | Open Drain | 25mA | 3.4MHz | 1.8 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
Microchip Technology |
IC I/O EXPANDER I2C 16B 28QFN
|
pacchetto: 28-VQFN Exposed Pad |
Azione4.976 |
|
I2C | Yes | POR | Push-Pull | 25mA | 1.7MHz | 1.8 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 28-VQFN Exposed Pad | 28-QFN (6x6) |
||
Microchip Technology |
IC I/O EXPANDER SPI 16B 28SSOP
|
pacchetto: 28-SSOP (0.209", 5.30mm Width) |
Azione8.712 |
|
SPI | Yes | POR | Push-Pull | 25mA | 10MHz | 1.8 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 28-SSOP (0.209", 5.30mm Width) | 28-SSOP |
||
Microchip Technology |
IC I/O EXPANDER SPI 8B 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione20.160 |
|
SPI | Yes | - | Open Drain | 25mA | 10MHz | 1.8 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN-EP (3x3) |
||
Microchip Technology |
IC I/O EXPANDER SPI 16B 28SDIP
|
pacchetto: 28-DIP (0.300", 7.62mm) |
Azione6.416 |
|
SPI | Yes | POR | Push-Pull | 25mA | 10MHz | 1.8 V ~ 5.5 V | -40°C ~ 125°C | Through Hole | 28-DIP (0.300", 7.62mm) | 28-SPDIP |
||
Microchip Technology |
IC I/O EXPANDER I2C 16B 28SSOP
|
pacchetto: 28-SSOP (0.209", 5.30mm Width) |
Azione179.340 |
|
I2C | Yes | POR | Push-Pull | 25mA | 1.7MHz | 1.8 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 28-SSOP (0.209", 5.30mm Width) | 28-SSOP |
||
Microchip Technology |
IC I/O EXPANDER SPI 16B 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione44.616 |
|
SPI | Yes | POR | Push-Pull | 25mA | 10MHz | 1.8 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
IC I/O EXPANDER I2C 8B 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione221.532 |
|
I2C | Yes | POR | Open Drain | 25mA | 3.4MHz | 1.8 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN-EP (3x3) |
||
Microchip Technology |
IC I/O EXPANDER I2C 16B 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione5.840 |
|
I2C | Yes | POR | Push-Pull | 25mA | 1.7MHz | 1.8 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
IC I/O EXPANDER I2C 16B 28SDIP
|
pacchetto: 28-DIP (0.300", 7.62mm) |
Azione7.568 |
|
I2C | Yes | POR | Push-Pull | 25mA | 1.7MHz | 1.8 V ~ 5.5 V | -40°C ~ 125°C | Through Hole | 28-DIP (0.300", 7.62mm) | 28-SPDIP |
||
Microchip Technology |
IC I/O EXPANDER SPI 8B 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione14.916 |
|
SPI | Yes | POR | Push-Pull | 25mA | 10MHz | 1.8 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
Microchip Technology |
IC I/O EXPANDER SPI 8B 20QFN
|
pacchetto: 20-VFQFN Exposed Pad |
Azione7.232 |
|
SPI | Yes | POR | Push-Pull | 25mA | 10MHz | 1.8 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 20-VFQFN Exposed Pad | 20-QFN-EP (4x4) |
||
Microchip Technology |
IC I/O EXPANDER I2C 8B 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione5.552 |
|
I2C | Yes | POR | Push-Pull | 25mA | 1.7MHz | 1.8 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
Microchip Technology |
IC I/O EXPANDER I2C 8B 20QFN
|
pacchetto: 20-VFQFN Exposed Pad |
Azione15.120 |
|
I2C | Yes | POR | Push-Pull | 25mA | 1.7MHz | 1.8 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 20-VFQFN Exposed Pad | 20-QFN-EP (4x4) |
||
Microchip Technology |
IC I/O EXPANDER I2C 16B 28QFN
|
pacchetto: 28-VQFN Exposed Pad |
Azione70.242 |
|
I2C | Yes | POR | Push-Pull | 25mA | 1.7MHz | 1.8 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 28-VQFN Exposed Pad | 28-QFN (6x6) |
||
Microchip Technology |
IC I/O EXPANDER SPI 8B 18SOIC
|
pacchetto: 18-SOIC (0.295", 7.50mm Width) |
Azione5.504 |
|
SPI | Yes | POR | Push-Pull | 25mA | 10MHz | 1.8 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 18-SOIC (0.295", 7.50mm Width) | 18-SOIC |
||
Microchip Technology |
IC I/O EXPANDER I2C 8B 18SOIC
|
pacchetto: 18-SOIC (0.295", 7.50mm Width) |
Azione278.796 |
|
I2C | Yes | POR | Push-Pull | 25mA | 1.7MHz | 1.8 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 18-SOIC (0.295", 7.50mm Width) | 18-SOIC |
||
Microchip Technology |
IC I/O EXPANDER SPI 16B 28SSOP
|
pacchetto: 28-SSOP (0.209", 5.30mm Width) |
Azione173.580 |
|
SPI | Yes | - | Push-Pull | 25mA | 10MHz | 1.8 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 28-SSOP (0.209", 5.30mm Width) | 28-SSOP |
||
Microchip Technology |
IC I/O EXPANDER SPI 16B 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione19.200 |
|
SPI | Yes | POR | Push-Pull | 25mA | 10MHz | 1.8 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
IC I/O EXPANDER 16BIT I2C 28SSOP
|
pacchetto: 28-SSOP (0.209", 5.30mm Width) |
Azione56.460 |
|
I2C | Yes | POR | Push-Pull | 25mA | 1.7MHz | 1.8 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 28-SSOP (0.209", 5.30mm Width) | 28-SSOP |
||
Microchip Technology |
IC I/O EXPANDER I2C 16B 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione25.908 |
|
I2C | Yes | POR | Push-Pull | 25mA | 1.7MHz | 1.8 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |