Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Core Size | Speed | Connectivity | Peripherals | Number of I/O | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC MCU 16BIT 584KB FLASH 64QFN
|
pacchetto: 64-VFQFN Exposed Pad |
Azione3.968 |
|
16-Bit Dual-Core | 180MHz, 200MHz | CANbus, I²C, IrDA, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, QEI, WDT | 53 | 584kB (584k x 8) | FLASH, PRAM | - | 64K x 8 | 3V ~ 3.6V | A/D 34x12b; D/A 4x12b | Internal | -40°C ~ 85°C (TA) | Surface Mount | 64-VFQFN Exposed Pad | 64-QFN (9x9) |
||
Microchip Technology |
16 BIT DSC DUAL CORE 512K FLASH
|
pacchetto: 48-TQFP |
Azione5.088 |
|
16-Bit Dual-Core | 180MHz, 200MHz | CANbus, I²C, IrDA, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, QEI, WDT | 39 | 584kB (584k x 8) | FLASH, PRAM | - | 64K x 8 | 3V ~ 3.6V | A/D 31x12b; D/A 4x12b | Internal | -40°C ~ 85°C (TA) | Surface Mount | 48-TQFP | 48-TQFP (7x7) |
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Microchip Technology |
IC MCU 16BIT 584KB FLASH 64TQFP
|
pacchetto: 64-TQFP |
Azione2.100 |
|
16-Bit Dual-Core | 180MHz, 200MHz | I²C, IrDA, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, QEI, WDT | 53 | 584kB (584k x 8) | FLASH, PRAM | - | 64K x 8 | 3V ~ 3.6V | A/D 34x12b; D/A 4x12b | Internal | -40°C ~ 85°C (TA) | Surface Mount | 64-TQFP | 64-TQFP (10x10) |
||
Microchip Technology |
16 BIT DSC DUAL CORE 512K FLASH
|
pacchetto: 48-TQFP |
Azione7.776 |
|
16-Bit Dual-Core | 180MHz, 200MHz | I²C, IrDA, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, QEI, WDT | 39 | 584kB (584k x 8) | FLASH, PRAM | - | 64K x 8 | 3V ~ 3.6V | A/D 31x12b; D/A 4x12b | Internal | -40°C ~ 85°C (TA) | Surface Mount | 48-TQFP | 48-TQFP (7x7) |
||
Microchip Technology |
16 BIT 5V DSC 256KB ECC FLASH 4K
|
pacchetto: 48-TQFP |
Azione6.016 |
|
16-Bit | 70MHz | CANbus, I²C, IrDA, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 35 | 256KB (85.5K x 24) | FLASH | - | 16K x 8 | 4.5V ~ 5.5V | A/D 24x10/12b; D/A 1x7b | Internal | -40°C ~ 85°C (TA) | Surface Mount | 48-TQFP | 48-TQFP (7x7) |
||
Microchip Technology |
16 BIT DSC SINGLE CORE 64K FLASH
|
pacchetto: 28-UQFN Exposed Pad |
Azione4.784 |
|
16-Bit | 100MHz | I²C, IrDA, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, QEI, Smart Card, WDT | 21 | 64KB (64K x 8) | FLASH | - | 8K x 8 | 3V ~ 3.6V | A/D 12x12b; D/A 3x12b | Internal | -40°C ~ 85°C (TA) | Surface Mount | 28-UQFN Exposed Pad | 28-UQFN (6x6) |
||
Microchip Technology |
64KB FLASH 16KB SRAM 32 MHZ ARM
|
pacchetto: 32-TQFP |
Azione12.780 |
|
32-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 25 | 64KB (64K x 8) | FLASH | 2K x 8 | 16K x 8 | 1.62V ~ 3.63V | A/D 10x12b; D/A 1x10b | Internal | -40°C ~ 85°C (TA) | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
Microchip Technology |
64BGA 85C GREEN1.6-3.6V48MHZ
|
pacchetto: 64-UFBGA |
Azione5.904 |
|
32-Bit | 48MHz | I²C, LINbus, SPI, UART/USART, USB | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | 52 | 128KB (128K x 8) | FLASH | - | 16K x 8 | 1.62V ~ 3.63V | A/D 20x12b; D/A 1x10b | Internal | -40°C ~ 85°C (TA) | Surface Mount | 64-UFBGA | 64-UFBGA (5x5) |
||
Microchip Technology |
16 BIT DSC SINGLE CORE 32K FLASH
|
pacchetto: 28-SSOP (0.209", 5.30mm Width) |
Azione4.096 |
|
16-Bit | 100MHz | I²C, IrDA, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, QEI, Smart Card, WDT | 21 | 32KB (32K x 8) | FLASH | - | 8K x 8 | 3V ~ 3.6V | A/D 12x12b; D/A 3x12b | Internal | -40°C ~ 85°C (TA) | Surface Mount | 28-SSOP (0.209", 5.30mm Width) | 28-SSOP |
||
Microchip Technology |
16 BIT DSC SINGLE CORE 32K FLASH
|
pacchetto: 28-UQFN Exposed Pad |
Azione6.080 |
|
16-Bit | 100MHz | I²C, IrDA, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, QEI, Smart Card, WDT | 21 | 32KB (32K x 8) | FLASH | - | 8K x 8 | 3V ~ 3.6V | A/D 12x12b; D/A 3x12b | Internal | -40°C ~ 85°C (TA) | Surface Mount | 28-UQFN Exposed Pad | 28-UQFN (6x6) |
||
Microchip Technology |
64KB FLASH 3.6KB RAM 1024B EEPRO
|
pacchetto: 44-TQFP |
Azione2.832 |
|
8-Bit | 16MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT | 36 | 64KB (64K x 8) | FLASH | 1K x 8 | 3.53K x 8 | 1.8V ~ 5.5V | A/D 35x10b; D/A 1x5b | Internal | -40°C ~ 85°C (TA) | Surface Mount | 44-TQFP | 44-TQFP (10x10) |
||
Microchip Technology |
32KB FLASH 2KB RAM 256B EEPROM 1
|
pacchetto: 44-TQFP |
Azione6.368 |
|
8-Bit | 16MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT | 36 | 32KB (32K x 8) | FLASH | 256 x 8 | 2.25K x 8 | 1.8V ~ 5.5V | A/D 35x10b; D/A 1x5b | Internal | -40°C ~ 85°C (TA) | Surface Mount | 44-TQFP | 44-TQFP (10x10) |
||
Microchip Technology |
128KB FLASH 3.6KB RAM 1024B EEPR
|
pacchetto: 28-VQFN Exposed Pad |
Azione3.744 |
|
8-Bit | 64MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, HLVD, POR, PWM, WDT | 25 | 128KB (128K x 8) | FLASH | 1K x 8 | 3.53K x 8 | 1.8V ~ 5.5V | A/D 24x10b; D/A 1x5b | Internal | -40°C ~ 85°C (TA) | Surface Mount | 28-VQFN Exposed Pad | 28-QFN (6x6) |
||
Microchip Technology |
64KB FLASH 3.6KB RAM 1024B EEPRO
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione5.424 |
|
8-Bit | 16MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT | 25 | 64KB (64K x 8) | FLASH | 1K x 8 | 3.53K x 8 | 1.8V ~ 5.5V | A/D 24x10b; D/A 1x5b | Internal | -40°C ~ 85°C (TA) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
64KB FLASH 3.6KB RAM 1024B EEPRO
|
pacchetto: 28-SSOP (0.209", 5.30mm Width) |
Azione6.720 |
|
8-Bit | 16MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT | 25 | 64KB (64K x 8) | FLASH | 1K x 8 | 3.53K x 8 | 1.8V ~ 5.5V | A/D 24x10b; D/A 1x5b | Internal | -40°C ~ 85°C (TA) | Surface Mount | 28-SSOP (0.209", 5.30mm Width) | 28-SSOP |
||
Microchip Technology |
20MHZ 8KB TQFP48
|
pacchetto: 48-TQFP |
Azione6.288 |
|
8-Bit | 20MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, POR, WDT | 41 | 8KB (8K x 8) | FLASH | 256 x 8 | 1K x 8 | 1.8V ~ 5.5V | A/D 16x10b | Internal | -40°C ~ 125°C (TA) | Surface Mount | 48-TQFP | 48-TQFP (7x7) |
||
Microchip Technology |
20MHZ 16KB SSOP28 IND 125C GREEN
|
pacchetto: 28-SSOP (0.209", 5.30mm Width) |
Azione7.472 |
|
8-Bit | 20MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, POR, WDT | 27 | 16KB (16K x 8) | FLASH | 256 x 8 | 2K x 8 | 1.8V ~ 5.5V | A/D 12x10b | Internal | -40°C ~ 125°C (TA) | Surface Mount | 28-SSOP (0.209", 5.30mm Width) | 28-SSOP |
||
Microchip Technology |
MICROCONTROLLER 8BIT 20MHZ
|
pacchetto: 32-VFQFN Exposed Pad |
Azione6.048 |
|
8-Bit | 20MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, POR, WDT | 27 | 16KB (16K x 8) | FLASH | 256 x 8 | 2K x 8 | 1.8V ~ 5.5V | A/D 12x10b | Internal | -40°C ~ 125°C | Surface Mount | 32-VFQFN Exposed Pad | 32-VQFN (5x5) |
||
Microchip Technology |
20MHZ 8KB VQFN32
|
pacchetto: 32-VFQFN Exposed Pad |
Azione3.008 |
|
8-Bit | 20MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, POR, WDT | 27 | 8KB (8K x 8) | FLASH | 256 x 8 | 1K x 8 | 1.8V ~ 5.5V | A/D 12x10b | Internal | -40°C ~ 125°C (TA) | Surface Mount | 32-VFQFN Exposed Pad | 32-VQFN (5x5) |
||
Microchip Technology |
20MHZ 16KB SOIC20 IND 125C GREEN
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione5.264 |
|
8-Bit | 20MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 18 | 16KB (16K x 8) | FLASH | 256 x 8 | 1K x 8 | 1.8V ~ 5.5V | A/D 12x10b | Internal | -40°C ~ 125°C (TA) | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
20MHZ 16KB SOIC20 IND 105C GREEN
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione3.696 |
|
8-Bit | 20MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 18 | 16KB (16K x 8) | FLASH | 256 x 8 | 1K x 8 | 1.8V ~ 5.5V | A/D 12x10b | Internal | -40°C ~ 105°C (TA) | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
20MHZ 16KB SOIC14
|
pacchetto: 14-SOIC (0.154", 3.90mm Width) |
Azione6.512 |
|
8-Bit | 20MHz | I²C, IrDA, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, WDT | 12 | 16KB (16K x 8) | FLASH | 256 x 8 | 1K x 8 | 1.8V ~ 5.5V | A/D 10x10b | Internal | -40°C ~ 125°C (TA) | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | 14-SOIC |
||
Microchip Technology |
20MHZ 16KB SOIC14
|
pacchetto: 14-SOIC (0.154", 3.90mm Width) |
Azione3.968 |
|
8-Bit | 20MHz | I²C, IrDA, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, WDT | 12 | 16KB (16K x 8) | FLASH | 256 x 8 | 1K x 8 | 1.8V ~ 5.5V | A/D 10x10b | Internal | -40°C ~ 105°C (TA) | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | 14-SOIC |
||
Microchip Technology |
32-BIT CACHE-BASED MCU GRAPHICS
|
pacchetto: 176-LQFP Exposed Pad |
Azione7.344 |
|
32-Bit | 200MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, HLVD, I²S, POR, PWM, WDT | 120 | 2MB (2M x 8) | FLASH | - | 640K x 8 | 1.7V ~ 1.9V | A/D 45x12b | Internal | -40°C ~ 85°C (TA) | Surface Mount | 176-LQFP Exposed Pad | 176-LQFP (20x20) |
||
Microchip Technology |
32-BIT CACHE-BASED MCU GRAPHICS
|
pacchetto: 176-LQFP Exposed Pad |
Azione7.596 |
|
32-Bit | 200MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, HLVD, I²S, POR, PWM, WDT | 120 | 2MB (2M x 8) | FLASH | - | 640K x 8 | 1.7V ~ 1.9V | A/D 45x12b | Internal | -40°C ~ 85°C (TA) | Surface Mount | 176-LQFP Exposed Pad | 176-LQFP (20x20) |
||
Microchip Technology |
32-BIT CACHE-BASED MCU GRAPHICS
|
pacchetto: 169-LFBGA |
Azione8.976 |
|
32-Bit | 200MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, HLVD, I²S, POR, PWM, WDT | 120 | 2MB (2M x 8) | FLASH | - | 640K x 8 | 1.7V ~ 1.9V | A/D 45x12b | Internal | -40°C ~ 85°C (TA) | Surface Mount | 169-LFBGA | 169-LFBGA (11x11) |
||
Microchip Technology |
32-BIT CACHE-BASED MCU GRAPHICS
|
pacchetto: 176-LQFP Exposed Pad |
Azione7.200 |
|
32-Bit | 200MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, HLVD, I²S, POR, PWM, WDT | 120 | 2MB (2M x 8) | FLASH | - | 256K x 8 | 1.7V ~ 1.9V | A/D 45x12b | Internal | -40°C ~ 85°C (TA) | Surface Mount | 176-LQFP Exposed Pad | 176-LQFP (20x20) |
||
Microchip Technology |
32-BIT CACHE-BASED MCU GRAPHICS
|
pacchetto: 176-LQFP Exposed Pad |
Azione6.432 |
|
32-Bit | 200MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, HLVD, I²S, POR, PWM, WDT | 120 | 1MB (1M x 8) | FLASH | - | 640K x 8 | 1.7V ~ 1.9V | A/D 45x12b | Internal | -40°C ~ 85°C (TA) | Surface Mount | 176-LQFP Exposed Pad | 176-LQFP (20x20) |