Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Main Purpose | Input | Output | Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC CLK DATA REC SDH 155MBPS
|
pacchetto: 32-TQFP Exposed Pad |
Azione3.088 |
|
Ethernet, SONET/SDH, ATM OC-3 | PECL | PECL | 1 | 1:3 | Yes/Yes | 155Mbps | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 32-TQFP Exposed Pad | 32-TQFP-EP (7x7) |
||
Microchip Technology |
IC CLK LINK REPLICATOR HDTV
|
pacchetto: 28-TSSOP (0.173", 4.40mm Width) |
Azione3.616 |
|
Fibre Channel, Gigabit Ethernet, HDTV, SATA | CML, LVPECL | LVPECL | 1 | 3:3 | Yes/Yes | - | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 28-TSSOP (0.173", 4.40mm Width) | 28-TSSOP |
||
Microchip Technology |
IC CLK LINK REPLICATOR HDTV
|
pacchetto: 28-TSSOP (0.173", 4.40mm Width) |
Azione6.544 |
|
Fibre Channel, Gigabit Ethernet, HDTV, SATA | CML, LVPECL | LVPECL | 1 | 3:3 | Yes/Yes | - | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 28-TSSOP (0.173", 4.40mm Width) | 28-TSSOP |
||
Microchip Technology |
BUFFER 19-OUTPUT
|
pacchetto: 72-VFQFN Exposed Pad |
Azione2.304 |
|
PCI Express (PCIe), SATA CPU | HCSL | HCSL | 1 | 1:19 | Yes/Yes | 133.33MHz | 2.375 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 72-VFQFN Exposed Pad | 72-QFN (10x10) |
||
Microchip Technology |
BUFFER 19-OUTPUT
|
pacchetto: 72-VFQFN Exposed Pad |
Azione3.408 |
|
PCI Express (PCIe), SATA CPU | HCSL | HCSL | 1 | 2:19 | Yes/Yes | 133.33MHz | 2.375 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 72-VFQFN Exposed Pad | 72-QFN (10x10) |
||
Microchip Technology |
BUFFER 19-OUTPUT
|
pacchetto: 72-VFQFN Exposed Pad |
Azione3.216 |
|
PCI Express (PCIe), SATA CPU | HCSL | HCSL | 1 | 2:19 | Yes/Yes | 133.33MHz | 2.375 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 72-VFQFN Exposed Pad | 72-QFN (10x10) |
||
Microchip Technology |
IC ZERO DELAY BUFFER 72VQFN
|
pacchetto: 72-VFQFN Exposed Pad |
Azione3.456 |
|
PCI Express (PCIe), SATA CPU | HCSL | HCSL | 1 | 1:19 | Yes/Yes | 133.33MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 72-VFQFN Exposed Pad | 72-QFN (10x10) |
||
Microchip Technology |
IC ZERO DELAY BUFFER 72VQFN
|
pacchetto: 72-VFQFN Exposed Pad |
Azione6.736 |
|
PCI Express (PCIe), SATA CPU | HCSL | HCSL | 1 | 2:19 | Yes/Yes | 133.33MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 72-VFQFN Exposed Pad | 72-QFN (10x10) |
||
Microchip Technology |
IC CLK BUFFER 2:8 267MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione5.328 |
|
PCI Express (PCIe) | HCSL, LVDS | HCSL | 1 | 2:8 | No/Yes | 267MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFFER 2:8 267MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione5.264 |
|
PCI Express (PCIe) | HCSL, LVDS | HCSL | 1 | 2:8 | No/Yes | 267MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC ZERO DELAY BUFFER 72VQFN
|
pacchetto: 72-VFQFN Exposed Pad |
Azione6.780 |
|
PCI Express (PCIe), SATA CPU | HCSL | HCSL | 1 | 1:19 | Yes/Yes | 133.33MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 72-VFQFN Exposed Pad | 72-QFN (10x10) |
||
Microchip Technology |
IC SYNTHESIZER FRACTION N 32TQFP
|
pacchetto: 32-TQFP Exposed Pad |
Azione51.756 |
|
Ethernet, Fibre Channel, SONET/SDH/ATM | PECL | PECL | 1 | 1:1 | Yes/Yes | 365MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 32-TQFP Exposed Pad | 32-TQFP-EP (7x7) |
||
Microchip Technology |
IC ZERO DELAY BUFFER 72VQFN
|
pacchetto: 72-VFQFN Exposed Pad |
Azione16.668 |
|
PCI Express (PCIe), SATA CPU | HCSL | HCSL | 1 | 2:19 | Yes/Yes | 133.33MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 72-VFQFN Exposed Pad | 72-QFN (10x10) |
||
Microchip Technology |
IC CLK DATA REC SDH 1.3GBPS
|
pacchetto: 32-TQFP Exposed Pad |
Azione23.556 |
|
Ethernet, SONET/SDH, ATM applications | PECL, TTL | PECL | 1 | 3:3 | Yes/Yes | 1.3Gbps | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 32-TQFP Exposed Pad | 32-TQFP-EP (7x7) |
||
Microchip Technology |
IC SYNTHESIZER FRACTION N 32TQFP
|
pacchetto: 32-TQFP Exposed Pad |
Azione25.656 |
|
Ethernet, Fibre Channel, SONET/SDH/ATM | PECL | PECL | 1 | 1:1 | Yes/Yes | 729MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 32-TQFP Exposed Pad | 32-TQFP-EP (7x7) |
||
Microchip Technology |
IC CLK DATA REC SDH 208MBPS
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione22.284 |
|
Ethernet, SONET/SDH, ATM applications | PECL, TTL | PECL | 1 | 3:3 | Yes/Yes | 208Mbps | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
IC CLK DATA REC SDH 208MBPS
|
pacchetto: 32-TQFP Exposed Pad |
Azione20.364 |
|
Ethernet, SONET/SDH, ATM applications | PECL, TTL | PECL | 1 | 3:3 | Yes/Yes | 208Mbps | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 32-TQFP Exposed Pad | 32-TQFP-EP (7x7) |
||
Microchip Technology |
CLOCK RECOVERY UNIT PB FREE
|
pacchetto: - |
Azione4.736 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC CLK DATA REC SDH 622MBPS
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) Exposed Pad |
Azione8.388 |
|
SONET/SDH, DWDM | LVTTL | LVDS, LVPECL | 1 | 1:2 | Yes/Yes | 622Mbps | 3.135 V ~ 3.465 V | 0°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) Exposed Pad | 20-TSSOP |
||
Microchip Technology |
622 MHZ CRU / PB FREE T&R
|
pacchetto: - |
Azione4.224 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC CLK DATA REC SDH 622MBPS
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) Exposed Pad |
Azione6.800 |
|
SONET/SDH, DWDM | LVTTL | LVDS, LVPECL | 1 | 1:2 | Yes/Yes | 622Mbps | 3.135 V ~ 3.465 V | -40°C ~ 95°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) Exposed Pad | 20-TSSOP |
||
Microchip Technology |
BI-DIR QUAD PORT 8.5 GBPS TO 11.
|
pacchetto: - |
Azione6.944 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
QUAD PORT 8.5 GBPS TO 11.3 GBPS
|
pacchetto: - |
Azione3.088 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
MULTIRATE 14.5 GBPS 12-CHANNEL R
|
pacchetto: - |
Azione5.936 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
MULTIRATE 16 GBPS QUAD RETIMER/R
|
pacchetto: - |
Azione7.200 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
4.25 GBPS DUAL CONDITIONER AND R
|
pacchetto: - |
Azione6.832 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC LINE CARD ETH PLL 3I/O 32QFN
|
pacchetto: - |
Azione5.472 |
|
Fibre Channel, Ethernet, SONET/SDH | CML, CMOS, Crystal | CML, CMOS | 1 | 4:3 | Yes/Yes | 650MHz | - | -40°C ~ 85°C | Surface Mount | - | 32-QFN |
||
Microchip Technology |
IC SYNCHRONIZER ETH SGL 64CABGA
|
pacchetto: 64-BGA |
Azione4.000 |
|
Ethernet | LVCMOS, Crystal | LVCMOS | 1 | 4:1 | No/No | 77.76MHz | 2.97V ~ 3.63V | -40°C ~ 85°C | Surface Mount | 64-BGA | 64-CABGA (9x9) |