Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Frequency | Function | Output | Voltage - Supply | Frequency Stability | Operating Temperature | Current - Supply (Max) | Ratings | Mounting Type | Package / Case | Size / Dimension | Height - Seated (Max) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
OSC MEMS 133.333MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead |
Azione8.460 |
|
133.333MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±10ppm | -40°C ~ 105°C | 8.7mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 125.000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead |
Azione4.968 |
|
125MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±10ppm | -40°C ~ 105°C | 8.7mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 75.000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead |
Azione7.182 |
|
75MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±10ppm | -40°C ~ 105°C | 8.7mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 125.000MHZ HCSL SMD
|
pacchetto: 6-SMD, No Lead |
Azione8.928 |
|
125MHz | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | 42mA | - | Surface Mount | 6-SMD, No Lead | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 156.2500MHZ LVDS SMD
|
pacchetto: 6-SMD, No Lead |
Azione3.508 |
|
156.25MHz | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±10ppm | -20°C ~ 70°C | 32mA | AEC-Q100 | Surface Mount | 6-SMD, No Lead | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 400.0000MHZ LVDS SMD
|
pacchetto: 6-SMD, No Lead |
Azione7.308 |
|
400MHz | Standby (Power Down) | LVDS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | 32mA | AEC-Q100 | Surface Mount | 6-SMD, No Lead | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 150.000MHZ CMOS SMD
|
pacchetto: 6-SMD, No Lead |
Azione2.052 |
|
150MHz | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | 32mA | AEC-Q100 | Surface Mount | 6-SMD, No Lead | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 125.000MHZ CMOS SMD
|
pacchetto: 6-SMD, No Lead |
Azione3.472 |
|
125MHz | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | 32mA | AEC-Q100 | Surface Mount | 6-SMD, No Lead | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 40.000MHZ LVDS SMD
|
pacchetto: 6-SMD, No Lead, Exposed Pad |
Azione3.186 |
|
40MHz | Enable/Disable | LVDS | 2.25 V ~ 3.6V | ±25ppm | -20°C ~ 70°C | 32mA | - | Surface Mount | 6-SMD, No Lead, Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS PCIE CLOCK
|
pacchetto: 20-VFQFN Exposed Pad |
Azione4.104 |
|
100MHz | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | 100mA (Typ) | - | Surface Mount | 20-VFQFN Exposed Pad | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 100.000MHZ PCIE SMD
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione8.172 |
|
100MHz | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±100ppm | -40°C ~ 85°C | 60mA (Typ) | - | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 0.197" L x 0.177" W (5.00mm x 4.50mm) | 0.043" (1.10mm) |
||
Microchip Technology |
OSC MEMS 100.000MHZ PCIE SMD
|
pacchetto: 14-SMD, No Lead |
Azione2.052 |
|
100MHz | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±100ppm | -40°C ~ 85°C | 60mA (Typ) | - | Surface Mount | 14-SMD, No Lead | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 100.000MHZ PCIE SMD
|
pacchetto: 14-SMD, No Lead |
Azione6.606 |
|
100MHz | Enable/Disable | HCSL, LVDS | 2.25 V ~ 3.6 V | ±100ppm | -40°C ~ 85°C | 60mA (Typ) | - | Surface Mount | 14-SMD, No Lead | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 100.000MHZ PCIE SMD
|
pacchetto: 14-SMD, No Lead |
Azione3.526 |
|
100MHz | Enable/Disable | HCSL, LVCMOS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | 60mA (Typ) | - | Surface Mount | 14-SMD, No Lead | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 100.000MHZ PCIE SMD
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione5.256 |
|
100MHz | Enable/Disable | HCSL, LVDS | 2.25 V ~ 3.6 V | ±100ppm | -40°C ~ 85°C | 60mA (Typ) | - | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 0.197" L x 0.177" W (5.00mm x 4.50mm) | 0.043" (1.10mm) |
||
Microchip Technology |
OSC MEMS 100.000MHZ PCIE SMD
|
pacchetto: 14-SMD, No Lead |
Azione4.608 |
|
100MHz | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 105°C | 60mA (Typ) | - | Surface Mount | 14-SMD, No Lead | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 100.000MHZ PCIE SMD
|
pacchetto: 14-SMD, No Lead |
Azione4.626 |
|
100MHz | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±100ppm | -40°C ~ 85°C | 60mA (Typ) | - | Surface Mount | 14-SMD, No Lead | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 100.000MHZ HCSL SMD
|
pacchetto: 14-VFQFN Exposed Pad |
Azione4.896 |
|
100MHz | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | 60mA (Typ) | - | Surface Mount | 14-VFQFN Exposed Pad | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 100.000MHZ HCSL SMD
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione8.730 |
|
100MHz | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | 60mA (Typ) | - | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 0.197" L x 0.177" W (5.00mm x 4.50mm) | 0.043" (1.10mm) |
||
Microchip Technology |
OSC MEMS 100.000MHZ HCSL SMD
|
pacchetto: 14-VFQFN Exposed Pad |
Azione2.466 |
|
100MHz | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | 60mA (Typ) | - | Surface Mount | 14-VFQFN Exposed Pad | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 100.000MHZ LVDS SMD
|
pacchetto: 20-VFQFN Exposed Pad |
Azione7.416 |
|
100MHz | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | 100mA (Typ) | - | Surface Mount | 20-VFQFN Exposed Pad | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 100.000MHZ HCSLLVDS SMD
|
pacchetto: 14-VFQFN Exposed Pad |
Azione5.490 |
|
100MHz | Enable/Disable | HCSL, LVDS | 2.25 V ~ 3.6 V | ±100ppm | -20°C ~ 70°C | 60mA (Typ) | - | Surface Mount | 14-VFQFN Exposed Pad | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 100.000MHZ HCSLLVDS SMD
|
pacchetto: 14-VFQFN Exposed Pad |
Azione3.204 |
|
100MHz | Enable/Disable | HCSL, LVDS | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | 60mA (Typ) | - | Surface Mount | 14-VFQFN Exposed Pad | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 100.000MHZ LVDS SMD
|
pacchetto: 14-VFQFN Exposed Pad |
Azione6.552 |
|
100MHz | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±100ppm | -20°C ~ 70°C | 60mA (Typ) | - | Surface Mount | 14-VFQFN Exposed Pad | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 125.000MHZ LVDS SMD
|
pacchetto: 6-SMD, No Lead |
Azione7.830 |
|
125MHz | Standby (Power Down) | LVDS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | 32mA | - | Surface Mount | 6-SMD, No Lead | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 171.8181MHZ LVDS SMD
|
pacchetto: 6-SMD, No Lead, Exposed Pad |
Azione2.664 |
|
171.8181MHz | Standby (Power Down) | LVDS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | 32mA | AEC-Q100 | Surface Mount | 6-SMD, No Lead, Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 200.000MHZ LVDS SMD
|
pacchetto: 6-SMD, No Lead, Exposed Pad |
Azione5.274 |
|
200MHz | Standby (Power Down) | LVDS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | 32mA | AEC-Q100 | Surface Mount | 6-SMD, No Lead, Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 100.000MHZ LVDS SMD
|
pacchetto: 6-SMD, No Lead, Exposed Pad |
Azione2.808 |
|
100MHz | Standby (Power Down) | LVDS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | 32mA | AEC-Q100 | Surface Mount | 6-SMD, No Lead, Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |