Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Frequency | Function | Output | Voltage - Supply | Frequency Stability | Operating Temperature | Current - Supply (Max) | Ratings | Mounting Type | Package / Case | Size / Dimension | Height - Seated (Max) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
OSC MEMS 24.576MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione5.562 |
|
24.576MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±10ppm | -40°C ~ 105°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 18.432MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione8.424 |
|
18.432MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±10ppm | -40°C ~ 105°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 18.432MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione2.160 |
|
18.432MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±10ppm | -40°C ~ 105°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 12.000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione5.040 |
|
12MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±10ppm | -40°C ~ 105°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 12.000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione2.340 |
|
12MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±10ppm | -40°C ~ 105°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 50.000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead |
Azione5.346 |
|
50MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±10ppm | -40°C ~ 105°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 48.000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead |
Azione2.790 |
|
48MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±10ppm | -40°C ~ 105°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 40.000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead |
Azione5.310 |
|
40MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±10ppm | -40°C ~ 105°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 25.000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead |
Azione3.312 |
|
25MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±10ppm | -40°C ~ 105°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 24.000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead |
Azione8.010 |
|
24MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±10ppm | -40°C ~ 105°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 16.000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead |
Azione7.398 |
|
16MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±10ppm | -40°C ~ 105°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 10.000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead |
Azione5.778 |
|
10MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±10ppm | -40°C ~ 105°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 8.000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead |
Azione2.268 |
|
8MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±10ppm | -40°C ~ 105°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 32.000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione6.570 |
|
32MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±10ppm | -40°C ~ 105°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 16.000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione5.166 |
|
16MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±10ppm | -40°C ~ 105°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 50.000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione7.668 |
|
50MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±10ppm | -40°C ~ 105°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 40.000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione3.006 |
|
40MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±10ppm | -40°C ~ 105°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 32.000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione8.316 |
|
32MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±10ppm | -40°C ~ 105°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 25.000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione4.464 |
|
25MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±10ppm | -40°C ~ 105°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 24.000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione4.032 |
|
24MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±10ppm | -40°C ~ 105°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 16.000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione4.950 |
|
16MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±10ppm | -40°C ~ 105°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 8.000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione8.352 |
|
8MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±10ppm | -40°C ~ 105°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 4.000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione3.420 |
|
4MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±10ppm | -40°C ~ 105°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 1.8432MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione8.406 |
|
1.8432MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±10ppm | -40°C ~ 105°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 16.384MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione7.884 |
|
16.384MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±10ppm | -40°C ~ 105°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 16.384MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione5.328 |
|
16.384MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±10ppm | -40°C ~ 105°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 7.3728MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione7.038 |
|
7.3728MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±10ppm | -40°C ~ 105°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 7.3728MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione6.138 |
|
7.3728MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±10ppm | -40°C ~ 105°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |