Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Frequency | Function | Output | Voltage - Supply | Frequency Stability | Operating Temperature | Current - Supply (Max) | Ratings | Mounting Type | Package / Case | Size / Dimension | Height - Seated (Max) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
OSC MEMS 12.000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead |
Azione6.318 |
|
12MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -20°C ~ 70°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 48.000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead |
Azione7.506 |
|
48MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±50ppm | -20°C ~ 70°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 25.000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead |
Azione8.694 |
|
25MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±50ppm | -20°C ~ 70°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 16.000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead |
Azione5.112 |
|
16MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±50ppm | -20°C ~ 70°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 54.000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione7.056 |
|
54MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±50ppm | -20°C ~ 70°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 25.000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione6.480 |
|
25MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±50ppm | -20°C ~ 70°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 14.3182MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione4.644 |
|
14.3182MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±50ppm | -20°C ~ 70°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 6.144MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione8.478 |
|
6.144MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±50ppm | -20°C ~ 70°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 25.000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione3.618 |
|
25MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | 0°C ~ 70°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 33.33MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead |
Azione8.946 |
|
33.33MHz | Standby (Power Down) | CMOS | 3.3V | ±50ppm | -40°C ~ 85°C | 4mA (Typ) | - | Surface Mount | 4-SMD, No Lead | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 16.384MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead |
Azione3.834 |
|
16.384MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±50ppm | -40°C ~ 85°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 16.384MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead |
Azione2.142 |
|
16.384MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±50ppm | -40°C ~ 85°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 100.000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead |
Azione2.106 |
|
100MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±50ppm | 0°C ~ 70°C | 8.7mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 100.000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead |
Azione2.556 |
|
100MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±50ppm | 0°C ~ 70°C | 8.7mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 48.000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead |
Azione8.388 |
|
48MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -20°C ~ 70°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 24.000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead |
Azione5.220 |
|
24MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±50ppm | -20°C ~ 70°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 48.000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione4.374 |
|
48MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±50ppm | -20°C ~ 70°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 33.3333MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione3.384 |
|
33.3333MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±50ppm | -20°C ~ 70°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 24.000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione6.300 |
|
24MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±50ppm | -20°C ~ 70°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 24.000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione7.362 |
|
24MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±50ppm | -20°C ~ 70°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 16.6667MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione8.154 |
|
16.6667MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±50ppm | -20°C ~ 70°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 16.6667MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione6.858 |
|
16.6667MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±50ppm | -20°C ~ 70°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 24.000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead |
Azione3.834 |
|
24MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±50ppm | -40°C ~ 85°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 24.576MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead |
Azione5.436 |
|
24.576MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -20°C ~ 70°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 25.0000MHZ CMOS SMD
|
pacchetto: 6-SMD, No Lead |
Azione7.380 |
|
25MHz | Standby (Power Down) | CMOS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | 35mA | - | Surface Mount | 6-SMD, No Lead | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 4.9152MHZ LVCMOS SMD
|
pacchetto: 4-SMD, No Lead |
Azione7.812 |
|
4.9152MHz | Standby (Power Down) | LVCMOS | 1.7 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 66.6666MHZ LVCMOS SMD
|
pacchetto: 4-SMD, No Lead |
Azione3.418 |
|
66.6666MHz | Standby (Power Down) | LVCMOS | 1.7 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | 6.9mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 19.2000MHZ LVCMOS SMD
|
pacchetto: 4-SMD, No Lead |
Azione8.532 |
|
19.2MHz | Standby (Power Down) | LVCMOS | 1.7 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) |