Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Frequency | Function | Output | Voltage - Supply | Frequency Stability | Operating Temperature | Current - Supply (Max) | Ratings | Mounting Type | Package / Case | Size / Dimension | Height - Seated (Max) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
OSC MEMS 24.576MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione2.520 |
|
24.576MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±50ppm | -40°C ~ 85°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 24.545MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione3.690 |
|
24.545MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±50ppm | -40°C ~ 85°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 20.000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione8.172 |
|
20MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±50ppm | -40°C ~ 85°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 13.1072MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione3.132 |
|
13.1072MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±50ppm | -40°C ~ 85°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 5.000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione8.244 |
|
5MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±50ppm | -40°C ~ 85°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 98.304MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione6.570 |
|
98.304MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -20°C ~ 70°C | 8.7mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 80.000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione8.964 |
|
80MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -20°C ~ 70°C | 8.7mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 66.6666MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione7.308 |
|
66.6666MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -20°C ~ 70°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSCILLATOR MEMS 62.5MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione4.266 |
|
62.5MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -20°C ~ 70°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 58.000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione5.760 |
|
58MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -20°C ~ 70°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 54.000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione6.984 |
|
54MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -20°C ~ 70°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 38.000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione4.068 |
|
38MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -20°C ~ 70°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 32.768MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione5.742 |
|
32.768MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -20°C ~ 70°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 27.000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione3.888 |
|
27MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -20°C ~ 70°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 24.000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione8.100 |
|
24MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -20°C ~ 70°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 12.288MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione8.658 |
|
12.288MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -20°C ~ 70°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 131.072MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione5.976 |
|
131.072MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±50ppm | -20°C ~ 70°C | 8.7mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 125.000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione4.590 |
|
125MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±50ppm | -20°C ~ 70°C | 8.7mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 7.3728MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione6.246 |
|
7.3728MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±50ppm | -20°C ~ 70°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSCILLATOR MEMS 2.44MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione8.352 |
|
2.44MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±50ppm | -20°C ~ 70°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 10.000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione3.544 |
|
10MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | 0°C ~ 70°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 131.072MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione7.434 |
|
131.072MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±50ppm | 0°C ~ 70°C | 8.7mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 100.000MHZ HCSL SMD
|
pacchetto: 20-VFQFN Exposed Pad |
Azione8.766 |
|
100MHz | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±100ppm | -20°C ~ 70°C | 120mA (Typ) | - | Surface Mount | 20-VFQFN Exposed Pad | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 100.000MHZ HCSL SMD
|
pacchetto: 20-VFQFN Exposed Pad |
Azione5.508 |
|
100MHz | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±100ppm | -20°C ~ 70°C | 120mA (Typ) | - | Surface Mount | 20-VFQFN Exposed Pad | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 100.000MHZ LVDS SMD
|
pacchetto: 20-VFQFN Exposed Pad |
Azione6.714 |
|
100MHz | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | 100mA (Typ) | - | Surface Mount | 20-VFQFN Exposed Pad | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 100.000MHZ HCSLLVDS SMD
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione3.042 |
|
100MHz | Enable/Disable | HCSL, LVDS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | 60mA (Typ) | - | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 0.197" L x 0.177" W (5.00mm x 4.50mm) | 0.043" (1.10mm) |
||
Microchip Technology |
OSC MEMS 100.000MHZ HCSLLVDS SMD
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione3.618 |
|
100MHz | Enable/Disable | HCSL, LVDS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | 60mA (Typ) | - | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 0.197" L x 0.177" W (5.00mm x 4.50mm) | 0.043" (1.10mm) |
||
Microchip Technology |
OSC MEMS 100.000MHZ HCSLLVDS SMD
|
pacchetto: 14-VFQFN Exposed Pad |
Azione7.506 |
|
100MHz | Enable/Disable | HCSL, LVDS | 2.25 V ~ 3.6 V | ±100ppm | -20°C ~ 70°C | 60mA (Typ) | - | Surface Mount | 14-VFQFN Exposed Pad | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) |