Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Maxim Integrated |
IC MODULATOR DRVR 10GBPS 24-TQFN
|
pacchetto: 24-WFQFN Exposed Pad |
Azione4.464 |
|
- | 1 | -5.5 V ~ -4.9 V | 140mA | - | -40°C ~ 85°C | Surface Mount | 24-WFQFN Exposed Pad | 24-TQFN (4x4) |
||
Maxim Integrated |
IC MODULATOR DRVR 10GBPS 24-TQFN
|
pacchetto: 24-WFQFN Exposed Pad |
Azione7.888 |
|
- | 1 | -5.5 V ~ -4.9 V | 140mA | - | -40°C ~ 85°C | Surface Mount | 24-WFQFN Exposed Pad | 24-TQFN (4x4) |
||
Maxim Integrated |
IC EAM DRIVER 10GBPS 24-TQFN
|
pacchetto: 24-WFQFN Exposed Pad |
Azione4.720 |
|
- | 1 | -5.5 V ~ -4.9 V | 140mA | - | -40°C ~ 85°C | Surface Mount | 24-WFQFN Exposed Pad | 24-TQFN (4x4) |
||
Maxim Integrated |
IC EAM DRIVER 10GBPS 24-TQFN
|
pacchetto: 24-WFQFN Exposed Pad |
Azione7.328 |
|
- | 1 | -5.5 V ~ -4.9 V | 140mA | - | -40°C ~ 85°C | Surface Mount | 24-WFQFN Exposed Pad | 24-TQFN (4x4) |
||
Maxim Integrated |
IC TDM/PACKET TRANSPORT 676BGA
|
pacchetto: 676-BGA |
Azione2.624 |
|
TDMoP | 1 | 1.8V, 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 676-BGA | 676-PBGA (27x27) |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 144CBSGA
|
pacchetto: 144-BGA, CSPBGA |
Azione4.976 |
|
LIU | 4 | 3.135 V ~ 3.465 V | 290mA | - | -40°C ~ 85°C | Surface Mount | 144-BGA, CSPBGA | 144-TECSBGA (13x13) |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 144CBSGA
|
pacchetto: 144-BGA, CSPBGA |
Azione5.792 |
|
LIU | 4 | 3.135 V ~ 3.465 V | 290mA | - | -40°C ~ 85°C | Surface Mount | 144-BGA, CSPBGA | 144-TECSBGA (13x13) |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 144CBSGA
|
pacchetto: 144-BGA, CSPBGA |
Azione5.888 |
|
LIU | 4 | 3.135 V ~ 3.465 V | 290mA | - | 0°C ~ 70°C | Surface Mount | 144-BGA, CSPBGA | 144-TECSBGA (13x13) |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 144CBSGA
|
pacchetto: 144-BGA, CSPBGA |
Azione2.672 |
|
LIU | 3 | 3.135 V ~ 3.465 V | 220mA | - | -40°C ~ 85°C | Surface Mount | 144-BGA, CSPBGA | 144-TECSBGA (13x13) |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 144CBSGA
|
pacchetto: 144-BGA, CSPBGA |
Azione2.512 |
|
LIU | 3 | 3.135 V ~ 3.465 V | 220mA | - | -40°C ~ 85°C | Surface Mount | 144-BGA, CSPBGA | 144-TECSBGA (13x13) |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 144CBSGA
|
pacchetto: 144-BGA, CSPBGA |
Azione3.936 |
|
LIU | 3 | 3.135 V ~ 3.465 V | 220mA | - | 0°C ~ 70°C | Surface Mount | 144-BGA, CSPBGA | 144-TECSBGA (13x13) |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 144CBSGA
|
pacchetto: 144-BGA, CSPBGA |
Azione7.360 |
|
LIU | 2 | 3.3V | 150mA | - | 0°C ~ 70°C | Surface Mount | 144-BGA, CSPBGA | 144-TECSBGA (13x13) |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 144CBSGA
|
pacchetto: 144-BGA, CSPBGA |
Azione4.480 |
|
LIU | 2 | 3.3V | 150mA | - | 0°C ~ 70°C | Surface Mount | 144-BGA, CSPBGA | 144-TECSBGA (13x13) |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 144CBSGA
|
pacchetto: 144-BGA, CSPBGA |
Azione5.600 |
|
LIU | 2 | 3.3V | 150mA | - | 0°C ~ 70°C | Surface Mount | 144-BGA, CSPBGA | 144-TECSBGA (13x13) |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 144CBSGA
|
pacchetto: 144-BGA, CSPBGA |
Azione4.752 |
|
LIU | 1 | 3.135 V ~ 3.465 V | 80mA | - | -40°C ~ 85°C | Surface Mount | 144-BGA, CSPBGA | 144-TECSBGA (13x13) |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 144CBSGA
|
pacchetto: 144-BGA, CSPBGA |
Azione9.156 |
|
LIU | 1 | 3.135 V ~ 3.465 V | 80mA | - | -40°C ~ 85°C | Surface Mount | 144-BGA, CSPBGA | 144-TECSBGA (13x13) |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 144CBSGA
|
pacchetto: 144-BGA, CSPBGA |
Azione6.528 |
|
LIU | 1 | 3.135 V ~ 3.465 V | 80mA | - | -40°C ~ 85°C | Surface Mount | 144-BGA, CSPBGA | 144-TECSBGA (13x13) |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 144CBSGA
|
pacchetto: 484-BGA |
Azione5.568 |
|
LIU | 1 | 3.135 V ~ 3.465 V | 150mA | - | -40°C ~ 85°C | Surface Mount | 484-BGA | 484-BGA (23x23) |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 144CBSGA
|
pacchetto: 484-BGA |
Azione7.968 |
|
LIU | 1 | 3.135 V ~ 3.465 V | 150mA | - | 0°C ~ 70°C | Surface Mount | 484-BGA | 484-BGA (23x23) |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 144CBSGA
|
pacchetto: 144-BGA, CSPBGA |
Azione4.832 |
|
LIU | 1 | 3.135 V ~ 3.465 V | 80mA | - | 0°C ~ 70°C | Surface Mount | 144-BGA, CSPBGA | 144-TECSBGA (13x13) |
||
Maxim Integrated |
IC LIU 8PORT T3E3 484BGA
|
pacchetto: 484-BGA |
Azione7.920 |
|
LIU | - | 1.8V, 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 484-BGA | 484-BGA (23x23) |
||
Maxim Integrated |
IC LIU 8PORT T3E3 484BGA
|
pacchetto: 484-BGA |
Azione5.168 |
|
LIU | - | 1.8V, 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 484-BGA | 484-BGA (23x23) |
||
Maxim Integrated |
IC LIU 6PORT T3E3 484BGA
|
pacchetto: 484-BGA |
Azione5.808 |
|
LIU | - | 1.8V, 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 484-BGA | 484-BGA (23x23) |
||
Maxim Integrated |
IC LIU 6PORT T3E3 484BGA
|
pacchetto: 484-BGA |
Azione4.320 |
|
LIU | - | 1.8V, 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 484-BGA | 484-BGA (23x23) |
||
Maxim Integrated |
IC TXRX DS3/E3 100CSBGA
|
pacchetto: 100-LBGA, CSBGA |
Azione2.208 |
|
DS3, E3 | 1 | 3.135 V ~ 3.465 V | 120mA | - | -40°C ~ 85°C | Surface Mount | 100-LBGA, CSBGA | 100-CSBGA (11x11) |
||
Maxim Integrated |
IC TXRX DS3/E3 100CSBGA
|
pacchetto: 100-LBGA, CSBGA |
Azione6.896 |
|
DS3, E3 | 1 | 3.135 V ~ 3.465 V | 120mA | - | 0°C ~ 70°C | Surface Mount | 100-LBGA, CSBGA | 100-CSBGA (11x11) |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 144CSBGA
|
pacchetto: 144-BGA, CSPBGA |
Azione3.824 |
|
LIU | 4 | 3.135 V ~ 3.465 V | 300mA | - | -40°C ~ 85°C | Surface Mount | 144-BGA, CSPBGA | 144-TECSBGA (13x13) |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 144CSBGA
|
pacchetto: 144-BGA, CSPBGA |
Azione6.800 |
|
LIU | 4 | 3.135 V ~ 3.465 V | 300mA | - | -40°C ~ 85°C | Surface Mount | 144-BGA, CSPBGA | 144-TECSBGA (13x13) |