Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Maxim Integrated |
IC TXRX DS3/E3 DUAL 400-BGA
|
pacchetto: 400-BBGA |
Azione2.768 |
|
DS3, E3 | 2 | 3.135 V ~ 3.465 V | 328mA | - | 0°C ~ 70°C | Surface Mount | 400-BBGA | 400-PBGA (27x27) |
||
Maxim Integrated |
IC TXRX DS3/E3 QUAD 400-BGA
|
pacchetto: 400-BBGA |
Azione7.040 |
|
DS3, E3 | 4 | 3.135 V ~ 3.465 V | 725mA | - | 0°C ~ 70°C | Surface Mount | 400-BBGA | 400-PBGA (27x27) |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 12P 484-BGA
|
pacchetto: 484-BGA |
Azione6.560 |
|
LIU | 1 | 3.135 V ~ 3.465 V | 150mA | - | -40°C ~ 85°C | Surface Mount | 484-BGA | 484-BGA (23x23) |
||
Maxim Integrated |
IC FRAMER DS3/E3 SNGL 144CSBGA
|
pacchetto: 144-BGA, CSPBGA |
Azione2.224 |
|
LIU | 1 | 3.135 V ~ 3.465 V | 80mA | - | 0°C ~ 70°C | Surface Mount | 144-BGA, CSPBGA | 144-TECSBGA (13x13) |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 144CSBGA
|
pacchetto: 144-BGA, CSPBGA |
Azione4.256 |
|
LIU | 1 | 3.135 V ~ 3.465 V | 75mA | - | -40°C ~ 85°C | Surface Mount | 144-BGA, CSPBGA | 144-TECSBGA (13x13) |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 144CSBGA
|
pacchetto: 144-BGA, CSPBGA |
Azione6.976 |
|
LIU | 2 | 3.3V | 150mA | - | 0°C ~ 70°C | Surface Mount | 144-BGA, CSPBGA | 144-TECSBGA (13x13) |
||
Maxim Integrated |
IC OCTAL FRAMER T1/E1/J1 256BGA
|
pacchetto: 256-LBGA, CSBGA |
Azione5.520 |
|
WAN | 8 | 3.135 V ~ 3.465 V | 275mA | - | 0°C ~ 70°C | Surface Mount | 256-LBGA, CSBGA | 256-CSBGA (17x17) |
||
Maxim Integrated |
IC FRAMER DUAL T1 LIU 100-LQFP
|
pacchetto: 100-LQFP |
Azione3.952 |
|
Parallel/Serial | 2 | 3.135 V ~ 3.465 V | 85mA | - | -40°C ~ 85°C | Surface Mount | 100-LQFP | 100-LQFP (14x14) |
||
Maxim Integrated |
IC TXRX T1/E1/J1 QUAD 256CSBGA
|
pacchetto: 256-LBGA, CSBGA |
Azione5.232 |
|
LIU | 4 | 3.135 V ~ 3.465 V | 260mA | - | -40°C ~ 85°C | Surface Mount | 256-LBGA, CSBGA | 256-CSBGA (17x17) |
||
Maxim Integrated |
IC TXRX T1/E1/J1 QUAD 256CSBGA
|
pacchetto: 256-LBGA, CSBGA |
Azione2.816 |
|
LIU | 4 | 3.135 V ~ 3.465 V | 260mA | - | 0°C ~ 70°C | Surface Mount | 256-LBGA, CSBGA | 256-CSBGA (17x17) |
||
Maxim Integrated |
IC FRAMER 4X4 16CH 300-BGA
|
pacchetto: 300-BBGA |
Azione5.056 |
|
Parallel/Serial | - | 2.97 V ~ 3.63 V | 225mA | - | -40°C ~ 85°C | Surface Mount | 300-BBGA | 300-PBGA (27x27) |
||
Maxim Integrated |
IC FRAMER 4X4 16CH 300-BGA
|
pacchetto: 300-BBGA |
Azione7.568 |
|
Parallel/Serial | - | 2.97 V ~ 3.63 V | 225mA | - | 0°C ~ 70°C | Surface Mount | 300-BBGA | 300-PBGA (27x27) |
||
Maxim Integrated |
IC TXRX LIU 256CSBGA
|
pacchetto: 256-LBGA, CSBGA |
Azione2.784 |
|
LIU | 16 | 3.135 V ~ 3.465 V | 500mA | - | 0°C ~ 70°C | Surface Mount | 256-LBGA, CSBGA | 256-CSBGA (17x17) |
||
Maxim Integrated |
IC SLIC 16CH 256CSBGA
|
pacchetto: 256-LBGA, CSBGA |
Azione9.804 |
|
LIU | 16 | 3.135 V ~ 3.465 V | 500mA | - | -40°C ~ 85°C | Surface Mount | 256-LBGA, CSBGA | 256-CSBGA (17x17) |
||
Maxim Integrated |
IC RECEIVE BUFFER T1 28-PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione5.360 |
|
TDM | 1 | - | 5mA | - | 0°C ~ 70°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Maxim Integrated |
IC TRPL DS3/E3 TXRX 400BGA
|
pacchetto: 400-BBGA |
Azione5.328 |
|
DS3, E3 | 3 | 3.135 V ~ 3.465 V | 449mA | - | -40°C ~ 85°C | Surface Mount | 400-BBGA | 400-PBGA (27x27) |
||
Maxim Integrated |
IC QUAD DS3/E3 TXRX 400BGA
|
pacchetto: 400-BBGA |
Azione3.024 |
|
DS3, E3 | 4 | 3.135 V ~ 3.465 V | 725mA | - | 0°C ~ 70°C | Surface Mount | 400-BBGA | 400-PBGA (27x27) |
||
Maxim Integrated |
IC 12CH DS3/E3/STS1 LIU 484-BGA
|
pacchetto: 484-BGA |
Azione5.072 |
|
LIU | 1 | 3.135 V ~ 3.465 V | 150mA | - | -40°C ~ 85°C | Surface Mount | 484-BGA | 484-BGA (23x23) |
||
Maxim Integrated |
IC 8CH DS3/3 FRAMER 349-BGA
|
pacchetto: 349-BGA Exposed Pad |
Azione5.920 |
|
LIU | - | 3.135 V ~ 3.465 V | 640mA | - | -40°C ~ 85°C | Surface Mount | 349-BGA Exposed Pad | 349-HCBGA (27x27) |
||
Maxim Integrated |
IC QUAD DS3/E3 TXRX 400BGA
|
pacchetto: 400-BBGA |
Azione4.624 |
|
DS3, E3 | 4 | 3.135 V ~ 3.465 V | 725mA | - | -40°C ~ 85°C | Surface Mount | 400-BBGA | 400-PBGA (27x27) |
||
Maxim Integrated |
IC QUAD DS3/E3 TXRX 400BGA
|
pacchetto: 400-BBGA |
Azione5.456 |
|
DS3, E3 | 4 | 3.135 V ~ 3.465 V | 725mA | - | -40°C ~ 85°C | Surface Mount | 400-BBGA | 400-PBGA (27x27) |
||
Maxim Integrated |
IC 8CH DS3/3 FRAMER 349-BGA
|
pacchetto: 349-BGA Exposed Pad |
Azione5.728 |
|
LIU | - | 3.135 V ~ 3.465 V | 640mA | - | -40°C ~ 85°C | Surface Mount | 349-BGA Exposed Pad | 349-HCBGA (27x27) |
||
Maxim Integrated |
IC 12CH DS3/3 FRAMER 349BGA
|
pacchetto: 349-BGA Exposed Pad |
Azione4.704 |
|
LIU | - | 3.135 V ~ 3.465 V | 960mA | - | -40°C ~ 85°C | Surface Mount | 349-BGA Exposed Pad | 349-TE-PBGA-2 (27x27) |
||
Maxim Integrated |
IC 12CH DS3/3 FRAMER 349BGA
|
pacchetto: 349-BGA Exposed Pad |
Azione5.840 |
|
LIU | - | 3.135 V ~ 3.465 V | 960mA | - | -40°C ~ 85°C | Surface Mount | 349-BGA Exposed Pad | 349-TE-PBGA-2 (27x27) |
||
Maxim Integrated |
IC OCTAL FRAMER T1/E1/J1 256BGA
|
pacchetto: 256-LBGA, CSBGA |
Azione5.392 |
|
WAN | 8 | 3.135 V ~ 3.465 V | 275mA | - | -40°C ~ 85°C | Surface Mount | 256-LBGA, CSBGA | 256-CSBGA (17x17) |
||
Maxim Integrated |
IC OCTAL FRAMER T1/E1/J1 256BGA
|
pacchetto: 256-LBGA, CSBGA |
Azione5.392 |
|
WAN | 8 | 3.135 V ~ 3.465 V | 275mA | - | 0°C ~ 70°C | Surface Mount | 256-LBGA, CSBGA | 256-CSBGA (17x17) |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 144-CSBGA
|
pacchetto: 144-BGA, CSPBGA |
Azione4.272 |
|
LIU | 4 | 3.135 V ~ 3.465 V | 290mA | - | -40°C ~ 85°C | Surface Mount | 144-BGA, CSPBGA | 144-TECSBGA (13x13) |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 144-CSBGA
|
pacchetto: 144-BGA, CSPBGA |
Azione8.892 |
|
LIU | 4 | 3.135 V ~ 3.465 V | 290mA | - | 0°C ~ 70°C | Surface Mount | 144-BGA, CSPBGA | 144-TECSBGA (13x13) |