Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Data Rate | Input Type | Output Type | Number of Inputs | Number of Outputs | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Maxim Integrated |
IC DESERIALIZER GMSL 3.12GBPS
|
pacchetto: 48-WFQFN Exposed Pad |
Azione2.608 |
|
3.12Gbps | CML | CML | 3 | 1 | 1.7 V ~ 1.9 V | -40°C ~ 105°C (TA) | Surface Mount | 48-WFQFN Exposed Pad | 48-TQFN (7x7) |
||
Maxim Integrated |
IC DESERIALIZER GMSL 3.12GBPS
|
pacchetto: 48-VFQFN Exposed Pad |
Azione5.760 |
|
3.12Gbps | CML | CML | 3 | 1 | 1.7 V ~ 1.9 V | -40°C ~ 105°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
Maxim Integrated |
IC SERIALIZER 3.12GBPS 48TQFN
|
pacchetto: 48-WFQFN Exposed Pad |
Azione2.592 |
|
3.12Gbps | LVDS | CML | 30 | 1 | 1.7 V ~ 1.9 V | -40°C ~ 105°C (TA) | Surface Mount | 48-WFQFN Exposed Pad | 48-TQFN (7x7) |
||
Maxim Integrated |
IC SERIALIZER 3.12GBPS 48TQFN
|
pacchetto: 48-WFQFN Exposed Pad |
Azione4.048 |
|
3.12Gbps | LVDS | CML | 30 | 1 | 1.7 V ~ 1.9 V | -40°C ~ 105°C (TA) | Surface Mount | 48-WFQFN Exposed Pad | 48-TQFN (7x7) |
||
Maxim Integrated |
IC DESERIALIZER GMSL 3.12GBPS
|
pacchetto: 56-WFQFN Exposed Pad |
Azione2.928 |
|
3.12Gbps | CML | LVCMOS | 1 | 32 | 1.7 V ~ 1.9 V | -40°C ~ 105°C (TA) | Surface Mount | 56-WFQFN Exposed Pad | 56-TQFN (8x8) |
||
Maxim Integrated |
IC SERIALIZER 3.12GBPS 48TQFN
|
pacchetto: 48-WFQFN Exposed Pad |
Azione7.264 |
|
3.12Gbps | LVDS | CML | 30 | 1 | 1.7 V ~ 1.9 V | -40°C ~ 105°C (TA) | Surface Mount | 48-WFQFN Exposed Pad | 48-TQFN (7x7) |
||
Maxim Integrated |
IC SERIALIZER 3.12GBPS 48TQFN
|
pacchetto: 48-WFQFN Exposed Pad |
Azione3.568 |
|
3.12Gbps | LVDS | CML | 30 | 1 | 1.7 V ~ 1.9 V | -40°C ~ 105°C (TA) | Surface Mount | 48-WFQFN Exposed Pad | 48-TQFN (7x7) |
||
Maxim Integrated |
IC DESERIALIZER 3.12GBPS
|
pacchetto: 56-WFQFN Exposed Pad |
Azione7.072 |
|
3.12Gbps | CML | CMOS | 1 | 32 | 1.7 V ~ 1.9 V | -40°C ~ 105°C (TA) | Surface Mount | 56-WFQFN Exposed Pad | 56-TQFN (8x8) |
||
Maxim Integrated |
IC DESERIALIZER GMSL 3.12GBPS
|
pacchetto: 56-WFQFN Exposed Pad |
Azione24.000 |
|
3.12Gbps | CML | CMOS | 1 | 32 | 1.7 V ~ 1.9 V | -40°C ~ 105°C (TA) | Surface Mount | 56-WFQFN Exposed Pad | 56-TQFN (8x8) |
||
Maxim Integrated |
IC SERIALIZER 2.5GBPS 56TQFN
|
pacchetto: 56-WFQFN Exposed Pad |
Azione2.960 |
|
2.5Gbps | CML | CML | 30 | 1 | 1.7 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 56-WFQFN Exposed Pad | 56-TQFN (8x8) |
||
Maxim Integrated |
IC SERIALIZER 2.5GBPS 56TQFN
|
pacchetto: 56-WFQFN Exposed Pad |
Azione2.100 |
|
2.5Gbps | CML | CML | 30 | 1 | 1.7 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 56-WFQFN Exposed Pad | 56-TQFN (8x8) |
||
Maxim Integrated |
IC DESERIALIZER 28BIT GMSL QFN
|
pacchetto: 48-WFQFN Exposed Pad |
Azione4.832 |
|
1.5Gbps | CML | CMOS, LVCMOS | 1 | 28 | 1.8V, 3.3V | -40°C ~ 105°C (TA) | Surface Mount | 48-WFQFN Exposed Pad | 48-TQFN (7x7) |
||
Maxim Integrated |
IC SERIALIZER GMSL LVDS 48TQFP
|
pacchetto: 48-TQFP Exposed Pad |
Azione2.320 |
|
2.5Gbs | LVDS | CML | 5 | 1 | 1.8V, 3.3V | -40°C ~ 105°C (TA) | Surface Mount | 48-TQFP Exposed Pad | 48-TQFP-EP (7x7) |
||
Maxim Integrated |
IC SERIALIZER GMSL 64TQFP
|
pacchetto: 64-TQFP Exposed Pad |
Azione2.528 |
|
2.5Gbps | CML | CML | 30 | 1 | 1.7 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 64-TQFP Exposed Pad | 64-TQFP-EP (10x10) |
||
Maxim Integrated |
IC DESERIALIZER 28BIT GMSL QFN
|
pacchetto: 48-WFQFN Exposed Pad |
Azione4.848 |
|
1.5Gbps | CML | CMOS, LVCMOS | 1 | 28 | 1.8V, 3.3V | -40°C ~ 105°C (TA) | Surface Mount | 48-WFQFN Exposed Pad | 48-TQFN (7x7) |
||
Maxim Integrated |
IC COMPARATOR SGL LOW PWR TSSOP
|
pacchetto: 48-TFSOP (0.240", 6.10mm Width) |
Azione7.440 |
|
1.785Gbps | LVDS | LVCMOS, LVTTL | 3 | 21 | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.240", 6.10mm Width) | 48-TSSOP |
||
Maxim Integrated |
IC COMPARATOR SGL LOW PWR TSSOP
|
pacchetto: 48-TFSOP (0.240", 6.10mm Width) |
Azione6.080 |
|
1.785Gbps | LVDS | LVCMOS, LVTTL | 3 | 21 | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.240", 6.10mm Width) | 48-TSSOP |
||
Maxim Integrated |
IC DESERIALIZER SSOP
|
pacchetto: 24-SSOP (0.209", 5.30mm Width) |
Azione54.540 |
|
622Mbps | PECL | LVDS | 1 | 4 | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 24-SSOP (0.209", 5.30mm Width) | 24-SSOP |
||
Maxim Integrated |
IC DESERIALIZER SSOP
|
pacchetto: 28-SSOP (0.209", 5.30mm Width) |
Azione6.352 |
|
622Mbps | PECL | TTL | 1 | 8 | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 28-SSOP (0.209", 5.30mm Width) | 28-SSOP |
||
Maxim Integrated |
IC DESERIALIZER GMSL 64TQFP
|
pacchetto: 64-TQFP Exposed Pad |
Azione3.440 |
|
2.5Gbps | CML | CMOS, LVCMOS | 1 | 30 | 1.7 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 64-TQFP Exposed Pad | 64-TQFP-EP (10x10) |
||
Maxim Integrated |
IC DESERIALIZER PROG 48TSSOP
|
pacchetto: 48-TFSOP (0.240", 6.10mm Width) |
Azione2.528 |
|
1.785Gbps | LVDS | LVCMOS, LVTTL | 3 | 21 | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.240", 6.10mm Width) | 48-TSSOP |
||
Maxim Integrated |
IC SERIALIZER PROG 48TSSOP
|
pacchetto: 48-TFSOP (0.240", 6.10mm Width) |
Azione4.240 |
|
1.785Gbps | LVCMOS, LVTTL | LVDS | 21 | 3 | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.240", 6.10mm Width) | 48-TSSOP |
||
Maxim Integrated |
IC DESERIALIZER GMSL 64TQFP
|
pacchetto: 64-TQFP Exposed Pad |
Azione6.368 |
|
2.5Gbps | CML | CMOS, LVCMOS | 1 | 30 | 1.7 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 64-TQFP Exposed Pad | 64-TQFP-EP (10x10) |
||
Maxim Integrated |
IC SERIALIZER PROG 48TSSOP
|
pacchetto: 48-TFSOP (0.240", 6.10mm Width) |
Azione5.408 |
|
1.785Gbps | LVCMOS, LVTTL | LVDS | 21 | 3 | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.240", 6.10mm Width) | 48-TSSOP |
||
Maxim Integrated |
IC DESERIALIZER PROG 48TSSOP
|
pacchetto: 48-TFSOP (0.240", 6.10mm Width) |
Azione4.112 |
|
1.785Gbps | LVDS | LVCMOS, LVTTL | 3 | 21 | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.240", 6.10mm Width) | 48-TSSOP |
||
Maxim Integrated |
IC SERIALIZER 22BIT GMSL 40TQFN
|
pacchetto: 40-WFQFN Exposed Pad |
Azione5.184 |
|
1.5Gbps | CMOS, LVCMOS | CML | 22 | 1 | 1.7 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 40-WFQFN Exposed Pad | 40-TQFN-EP (6x6) |
||
Maxim Integrated |
IC DSERIALIZER 28BIT GMSL 48TQFN
|
pacchetto: 48-WFQFN Exposed Pad |
Azione5.984 |
|
1.5Gbps | CML | LVCMOS | 1 | 28 | 1.7 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 48-WFQFN Exposed Pad | 48-TQFN (7x7) |
||
Maxim Integrated |
IC DSERIALIZER 28BIT GMSL 48TQFN
|
pacchetto: 48-WFQFN Exposed Pad |
Azione3.744 |
|
1.5Gbps | CML | LVCMOS | 1 | 28 | 1.7 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 48-WFQFN Exposed Pad | 48-TQFN (7x7) |