Prodotti Intel

10AS066H1F34E1HG

Intel

IC SOC FPGA 492 I/O 1152FBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, POR, WDT
• Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 660K Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

pacchetto: 1152-BBGA, FCBGA

10AS016C4U19E3SG

Intel

IC SOC FPGA 192 I/O 484UBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, POR, WDT
• Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 160K Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 484-BFBGA, FCBGA
• Supplier Device Package: 484-UBGA (19x19)

pacchetto: 484-BFBGA, FCBGA

5CSEMA4U23A7N

Intel

IC FPGA 188 I/O 672UBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 64KB
• Peripherals: DMA, POR, WDT
• Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 700MHz
• Primary Attributes: FPGA - 40K Logic Elements
• Operating Temperature: -40°C ~ 125°C (TJ)
• Package / Case: 672-FBGA
• Supplier Device Package: 672-UBGA (23x23)

pacchetto: 672-FBGA

EPCQ16SI8N

Intel

IC CONFIG DEVICE 16MBIT 8SOIC

• Programmable Type: In System Programmable
• Memory Size: 16Mb
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

pacchetto: 8-SOIC (0.154", 3.90mm Width)

EPF10K50RC240-3N

Intel

IC FPGA 189 I/O 240RQFP

• Number of LABs/CLBs: 360
• Number of Logic Elements/Cells: 2880
• Total RAM Bits: 20480
• Number of I/O: 189
• Number of Gates: 116000
• Voltage - Supply: 4.75 V ~ 5.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 70°C (TA)
• Package / Case: 240-BFQFP Exposed Pad
• Supplier Device Package: 240-RQFP (32x32)

pacchetto: 240-BFQFP Exposed Pad

EP1SGX10DF672C7N

Intel

IC FPGA 362 I/O 672FBGA

• Number of LABs/CLBs: 1057
• Number of Logic Elements/Cells: 10570
• Total RAM Bits: 920448
• Number of I/O: 362
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 672-BBGA, FCBGA
• Supplier Device Package: 672-FBGA (27x27)

pacchetto: 672-BBGA, FCBGA

EP1S40F780C7N

Intel

IC FPGA 615 I/O 780FBGA

• Number of LABs/CLBs: 4125
• Number of Logic Elements/Cells: 41250
• Total RAM Bits: 3423744
• Number of I/O: 615
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 780-BBGA, FCBGA
• Supplier Device Package: 780-FBGA (29x29)

pacchetto: 780-BBGA, FCBGA

EP4SE820H35C3

Intel

IC FPGA 744 I/O 1152HBGA

• Number of LABs/CLBs: 32522
• Number of Logic Elements/Cells: 813050
• Total RAM Bits: 34093056
• Number of I/O: 744
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-HBGA, FC (42.5x42.5)

pacchetto: 1152-BBGA, FCBGA

5CGXFC4C6U19A7N

Intel

IC FPGA 224 I/O 484UBGA

• Number of LABs/CLBs: 18868
• Number of Logic Elements/Cells: 50000
• Total RAM Bits: 2862080
• Number of I/O: 224
• Number of Gates: -
• Voltage - Supply: 1.07 V ~ 1.13 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 125°C (TJ)
• Package / Case: 484-FBGA
• Supplier Device Package: 484-UBGA (19x19)

pacchetto: 484-FBGA

5CEBA7F27C8N

Intel

IC FPGA 336 I/O 672FBGA

• Number of LABs/CLBs: 56480
• Number of Logic Elements/Cells: 149500
• Total RAM Bits: 7880704
• Number of I/O: 336
• Number of Gates: -
• Voltage - Supply: 1.07 V ~ 1.13 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 672-BGA
• Supplier Device Package: 672-FBGA (27x27)

pacchetto: 672-BGA

EP1C12F324C7

Intel

IC FPGA 249 I/O 324FBGA

• Number of LABs/CLBs: 1206
• Number of Logic Elements/Cells: 12060
• Total RAM Bits: 239616
• Number of I/O: 249
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 324-BGA
• Supplier Device Package: 324-FBGA (19x19)

pacchetto: 324-BGA

EP2C8T144I8

Intel

IC FPGA 85 I/O 144TQFP

• Number of LABs/CLBs: 516
• Number of Logic Elements/Cells: 8256
• Total RAM Bits: 165888
• Number of I/O: 85
• Number of Gates: -
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 144-LQFP
• Supplier Device Package: 144-TQFP (20x20)

pacchetto: 144-LQFP

EP2C8Q208C8N

Intel

IC FPGA 138 I/O 208QFP

• Number of LABs/CLBs: 516
• Number of Logic Elements/Cells: 8256
• Total RAM Bits: 165888
• Number of I/O: 138
• Number of Gates: -
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 208-BFQFP
• Supplier Device Package: 208-PQFP (28x28)

pacchetto: 208-BFQFP

EPM7128SQC100-7FN

Intel

IC CPLD 128MC 7.5NS 100QFP

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 7.5ns
• Voltage Supply - Internal: 4.75 V ~ 5.25 V
• Number of Logic Elements/Blocks: 8
• Number of Macrocells: 128
• Number of Gates: 2500
• Number of I/O: 84
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-BQFP
• Supplier Device Package: 100-PQFP (20x14)

pacchetto: 100-BQFP

EPM7128STC100-7N

Intel

IC CPLD 128MC 7.5NS 100TQFP

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 7.5ns
• Voltage Supply - Internal: 4.75 V ~ 5.25 V
• Number of Logic Elements/Blocks: 8
• Number of Macrocells: 128
• Number of Gates: 2500
• Number of I/O: 84
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-TQFP
• Supplier Device Package: 100-TQFP (14x14)

pacchetto: 100-TQFP

DCF1020FA7

Intel

IC DAISY CHAIN SAMPLE

• Type: -
• Applications: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

pacchetto: -

EP3SL70F780I3G

Intel

IC FPGA 488 I/O 780FBGA

• Number of LABs/CLBs: 2700
• Number of Logic Elements/Cells: 67500
• Total RAM Bits: 2699264
• Number of I/O: 488
• Number of Gates: -
• Voltage - Supply: 0.86V ~ 1.15V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 780-BBGA, FCBGA
• Supplier Device Package: 780-FBGA (29x29)

pacchetto: 780-BBGA, FCBGA

5AGXMA7G4F35I5G

Intel

IC FPGA 544 I/O 1152FBGA

• Number of LABs/CLBs: 11460
• Number of Logic Elements/Cells: 242000
• Total RAM Bits: 15470592
• Number of I/O: 544
• Number of Gates: -
• Voltage - Supply: 1.07V ~ 1.13V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

pacchetto: 1152-BBGA, FCBGA

5AGXMA5D6F27C6G

Intel

IC FPGA 336 I/O 672FBGA

• Number of LABs/CLBs: 8962
• Number of Logic Elements/Cells: 190000
• Total RAM Bits: 13284352
• Number of I/O: 336
• Number of Gates: -
• Voltage - Supply: 1.07V ~ 1.13V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 672-BBGA, FCBGA
• Supplier Device Package: 672-FBGA (27x27)

pacchetto: 672-BBGA, FCBGA

5SGXMA3K3F40C4WN

Intel

IC FPGA 600 I/O 1517FBGA

• Number of LABs/CLBs: 128300
• Number of Logic Elements/Cells: 340000
• Total RAM Bits: 19456000
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA (40x40)

pacchetto: -

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5SGXMA7N3F45C2NCV

Intel

IC FPGA 840 I/O 1932FBGA

• Number of LABs/CLBs: 234720
• Number of Logic Elements/Cells: 622000
• Total RAM Bits: 51200000
• Number of I/O: 840
• Number of Gates: -
• Voltage - Supply: 0.87V ~ 0.93V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1932-BBGA, FCBGA
• Supplier Device Package: 1932-FBGA, FC (45x45)

pacchetto: -

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PCLXT16726JA

Intel

LXT16727 DEMUX

• Type: -
• Circuit: -
• Independent Circuits: -
• Current - Output High, Low: -
• Voltage Supply Source: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

pacchetto: -

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5SGXMA7K3F35C4G

Intel

IC FPGA 432 I/O 1152FBGA

• Number of LABs/CLBs: 234720
• Number of Logic Elements/Cells: 622000
• Total RAM Bits: 51200000
• Number of I/O: 432
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

pacchetto: -

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5SGXMA4H1F35I2G

Intel

IC FPGA 600 I/O 1152FBGA

• Number of LABs/CLBs: 158500
• Number of Logic Elements/Cells: 420000
• Total RAM Bits: 37888000
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.87V ~ 0.93V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

pacchetto: -

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5SGXMA3K3F35I3WN

Intel

IC FPGA 600 I/O 1152FBGA

• Number of LABs/CLBs: 128300
• Number of Logic Elements/Cells: 340000
• Total RAM Bits: 19456000
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

pacchetto: -

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FH8065301729602S-R1W4

Intel

IC MPU N2830 2.16GHZ 1170FCBGA

• Core Processor: Intel® Celeron® Processor N2830
• Number of Cores/Bus Width: 2 Core, 64-Bit
• Speed: 2.16GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR3L
• Graphics Acceleration: Yes
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: USB 2.0 (1), USB 3.0 (1)
• Voltage - I/O: 0.4V, 1.14V
• Operating Temperature: 100°C (TC)
• Security Features: AES, SecureKey
• Package / Case: 1170-BGA, FCBGA
• Supplier Device Package: 1170-FCBGA (25x27)

pacchetto: -

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AGFA014R24C3I3E

Intel

IC FPGA AGILEX-F 2340FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 1.4M Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

pacchetto: -

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KU82307-25

Intel

DMA CONTROLLER, CMOS, PQFP132

• Protocol: -
• Function: Controller
• Interface: Bus
• Standards: -
• Voltage - Supply: 4.75V ~ 5.25V
• Current - Supply: 180mA
• Operating Temperature: 0°C ~ 70°C (TC)
• Package / Case: 132-QFP Bumpered
• Supplier Device Package: 132-QFP

pacchetto: -

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