Pagina 11 - Prodotti Intel | Heisener Electronics
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Prodotti Intel

Record 9.824
Pagina  11/351
Immagine
Numero di parte
Produttore
Descrizione
pacchetto
Azione
Quantità
EP1S80B956C6N
Intel

IC FPGA 683 I/O 956BGA

  • Number of LABs/CLBs: 7904
  • Number of Logic Elements/Cells: 79040
  • Total RAM Bits: 7427520
  • Number of I/O: 683
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 956-BBGA
  • Supplier Device Package: 956-BGA (40x40)
pacchetto: 956-BBGA
Azione6.944
hot EPF10K30RC208-3
Intel

IC FPGA 147 I/O 208RQFP

  • Number of LABs/CLBs: 216
  • Number of Logic Elements/Cells: 1728
  • Total RAM Bits: 12288
  • Number of I/O: 147
  • Number of Gates: 69000
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Package / Case: 208-BFQFP Exposed Pad
  • Supplier Device Package: 208-RQFP (28x28)
pacchetto: 208-BFQFP Exposed Pad
Azione9.792
EP4SE820H35I3N
Intel

IC FPGA 744 I/O 1152HBGA

  • Number of LABs/CLBs: 32522
  • Number of Logic Elements/Cells: 813050
  • Total RAM Bits: 34093056
  • Number of I/O: 744
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-HBGA, FC (42.5x42.5)
pacchetto: 1152-BBGA, FCBGA
Azione5.792
5SGSED8N3F45C2N
Intel

IC FPGA 840 I/O 1932FBGA

  • Number of LABs/CLBs: 262400
  • Number of Logic Elements/Cells: 695000
  • Total RAM Bits: 60968960
  • Number of I/O: 840
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1932-BBGA, FCBGA
  • Supplier Device Package: 1932-FBGA, FC (45x45)
pacchetto: 1932-BBGA, FCBGA
Azione3.376
EP4SE820H35C4
Intel

IC FPGA 744 I/O 1152HBGA

  • Number of LABs/CLBs: 32522
  • Number of Logic Elements/Cells: 813050
  • Total RAM Bits: 34093056
  • Number of I/O: 744
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-HBGA, FC (42.5x42.5)
pacchetto: 1152-BBGA, FCBGA
Azione5.120
5SGSMD5H3F35I3LN
Intel

IC FPGA 552 I/O 1152FBGA

  • Number of LABs/CLBs: 172600
  • Number of Logic Elements/Cells: 457000
  • Total RAM Bits: 46769152
  • Number of I/O: 552
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
pacchetto: 1152-BBGA, FCBGA
Azione7.424
EP3SL200F1152C3N
Intel

IC FPGA 744 I/O 1152FBGA

  • Number of LABs/CLBs: 8000
  • Number of Logic Elements/Cells: 200000
  • Total RAM Bits: 10901504
  • Number of I/O: 744
  • Number of Gates: -
  • Voltage - Supply: 0.86 V ~ 1.15 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
pacchetto: 1152-BBGA, FCBGA
Azione5.760
5SGXMA3E2H29C1N
Intel

IC FPGA 360 I/O 780HBGA

  • Number of LABs/CLBs: 128300
  • Number of Logic Elements/Cells: 340000
  • Total RAM Bits: 23704576
  • Number of I/O: 360
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 780-BBGA, FCBGA
  • Supplier Device Package: 780-HBGA (33x33)
pacchetto: 780-BBGA, FCBGA
Azione2.384
5AGXFB7H4F35I3N
Intel

IC FPGA 544 I/O 1152FBGA

  • Number of LABs/CLBs: 23780
  • Number of Logic Elements/Cells: 504000
  • Total RAM Bits: 27695104
  • Number of I/O: 544
  • Number of Gates: -
  • Voltage - Supply: 1.12 V ~ 1.18 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA Exposed Pad
  • Supplier Device Package: 1152-FBGA (35x35)
pacchetto: 1152-BBGA, FCBGA Exposed Pad
Azione7.296
EP3CLS150F780C7
Intel

IC FPGA 413 I/O 780FBGA

  • Number of LABs/CLBs: 9428
  • Number of Logic Elements/Cells: 150848
  • Total RAM Bits: 6137856
  • Number of I/O: 413
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 780-BGA
  • Supplier Device Package: 780-FBGA (29x29)
pacchetto: 780-BGA
Azione3.904
5CEFA5U19C7N
Intel

IC FPGA 224 I/O 484UBGA

  • Number of LABs/CLBs: 29080
  • Number of Logic Elements/Cells: 77000
  • Total RAM Bits: 5001216
  • Number of I/O: 224
  • Number of Gates: -
  • Voltage - Supply: 1.07 V ~ 1.13 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-FBGA
  • Supplier Device Package: 484-UBGA (19x19)
pacchetto: 484-FBGA
Azione5.552
10M25DAF256A7G
Intel

256-PIN FBGA

  • Number of LABs/CLBs: 1563
  • Number of Logic Elements/Cells: 25000
  • Total RAM Bits: 691200
  • Number of I/O: 178
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FBGA (17x17)
pacchetto: 256-LBGA
Azione6.864
EP2C20Q240C8
Intel

IC FPGA 142 I/O 240QFP

  • Number of LABs/CLBs: 1172
  • Number of Logic Elements/Cells: 18752
  • Total RAM Bits: 239616
  • Number of I/O: 142
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 240-BFQFP
  • Supplier Device Package: 240-PQFP (32x32)
pacchetto: 240-BFQFP
Azione5.616
EP4CE30F29C8LN
Intel

IC FPGA 532 I/O 780FBGA

  • Number of LABs/CLBs: 1803
  • Number of Logic Elements/Cells: 28848
  • Total RAM Bits: 608256
  • Number of I/O: 532
  • Number of Gates: -
  • Voltage - Supply: 0.97 V ~ 1.03 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 780-BGA
  • Supplier Device Package: 780-FBGA (29x29)
pacchetto: 780-BGA
Azione4.768
EP4CGX15BF14C8N
Intel

IC FPGA 72 I/O 169FBGA

  • Number of LABs/CLBs: 900
  • Number of Logic Elements/Cells: 14400
  • Total RAM Bits: 552960
  • Number of I/O: 72
  • Number of Gates: -
  • Voltage - Supply: 1.16 V ~ 1.24 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 169-LBGA
  • Supplier Device Package: 169-FBGA (14x14)
pacchetto: 169-LBGA
Azione22.908
hot EPM7128SQC100-6N
Intel

IC CPLD 128MC 6NS 100QFP

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 6.0ns
  • Voltage Supply - Internal: 4.75 V ~ 5.25 V
  • Number of Logic Elements/Blocks: 8
  • Number of Macrocells: 128
  • Number of Gates: 2500
  • Number of I/O: 84
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 100-BQFP
  • Supplier Device Package: 100-PQFP (20x14)
pacchetto: 100-BQFP
Azione10.224
hot EPM1270T144C5N
Intel

IC CPLD 980MC 6.2NS 144TQFP

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 6.2ns
  • Voltage Supply - Internal: 2.5V, 3.3V
  • Number of Logic Elements/Blocks: 1270
  • Number of Macrocells: 980
  • Number of Gates: -
  • Number of I/O: 116
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
pacchetto: 144-LQFP
Azione8.460
5SGXMA7N3F40C2G
Intel

IC FPGA 600 I/O 1517FBGA

  • Number of LABs/CLBs: 234720
  • Number of Logic Elements/Cells: 622000
  • Total RAM Bits: 51200000
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.87V ~ 0.93V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
pacchetto: -
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5SGXMA4K1F40C2G
Intel

IC FPGA 600 I/O 1517FBGA

  • Number of LABs/CLBs: 158500
  • Number of Logic Elements/Cells: 420000
  • Total RAM Bits: 37888000
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.87V ~ 0.93V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
pacchetto: -
Request a Quote
5SGXMA3E1H29C2LG
Intel

IC FPGA 600 I/O 780HBGA

  • Number of LABs/CLBs: 128300
  • Number of Logic Elements/Cells: 340000
  • Total RAM Bits: 19456000
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 780-BBGA, FCBGA
  • Supplier Device Package: 780-HBGA (33x33)
pacchetto: -
Request a Quote
1SG210HN1F43I2VG
Intel

IC FPGA 688 I/O 1760FBGA

  • Number of LABs/CLBs: 262500
  • Number of Logic Elements/Cells: 2100000
  • Total RAM Bits: -
  • Number of I/O: 688
  • Number of Gates: -
  • Voltage - Supply: 0.77V ~ 0.97V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FBGA (42.5x42.5)
pacchetto: -
Request a Quote
AGID023R18A2E2V
Intel

IC FPGA AGILEX-I 1805FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 2.3M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
pacchetto: -
Request a Quote
5SGSMD4E3H29C2LG
Intel

IC FPGA 360 I/O 780HBGA

  • Number of LABs/CLBs: 135840
  • Number of Logic Elements/Cells: 360000
  • Total RAM Bits: 19456000
  • Number of I/O: 360
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 780-BBGA, FCBGA
  • Supplier Device Package: 780-HBGA (33x33)
pacchetto: -
Request a Quote
5SGXEA4K3F35I3LG
Intel

IC FPGA 432 I/O 1152FBGA

  • Number of LABs/CLBs: 158500
  • Number of Logic Elements/Cells: 420000
  • Total RAM Bits: 37888000
  • Number of I/O: 432
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
pacchetto: -
Request a Quote
5SEEBH40I4G
Intel

IC FPGA 696 I/O 1517HBGA

  • Number of LABs/CLBs: 359250
  • Number of Logic Elements/Cells: 952000
  • Total RAM Bits: 53248000
  • Number of I/O: 696
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-HBGA (45x45)
pacchetto: -
Request a Quote
1ST280EU1F50I1VGAS
Intel

IC FPGA 440 I/O 2397BGA

  • Number of LABs/CLBs: 350000
  • Number of Logic Elements/Cells: 2800000
  • Total RAM Bits: -
  • Number of I/O: 440
  • Number of Gates: -
  • Voltage - Supply: 0.77V ~ 0.97V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 2397-BBGA, FCBGA
  • Supplier Device Package: 2397-FBGA, FC (50x50)
pacchetto: -
Request a Quote
AGFA027R31C2I3V
Intel

IC FPGA AGILEX-F 3184FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 2.7M Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
pacchetto: -
Request a Quote
AGID019R31B2I2VB
Intel

IC FPGA AGILEX-I 3184BGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 1.9M Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 3184-BFBGA Exposed Pad
  • Supplier Device Package: 3184-BGA (56x45)
pacchetto: -
Request a Quote