Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:2 625MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.240 |
|
1 | 1:2 | Yes/Yes | PECL | HSTL | 625MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:2 625MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.384 |
|
1 | 1:2 | Yes/Yes | HSTL | HSTL | 625MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:2 625MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione3.312 |
|
1 | 1:2 | Yes/Yes | HSTL | HSTL | 625MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:9 3GHZ 32TQFP
|
pacchetto: 32-LQFP |
Azione2.816 |
|
1 | 1:9 | Yes/Yes | LVCMOS, LVPECL | LVPECL | 3GHz | 2.375 V ~ 3.465 V | 0°C ~ 110°C | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:9 3GHZ 32TQFP
|
pacchetto: 32-LQFP |
Azione5.168 |
|
1 | 1:9 | Yes/Yes | LVCMOS, LVPECL | LVPECL | 3GHz | 2.375 V ~ 3.465 V | 0°C ~ 110°C | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:15 3GHZ 52PTQFP
|
pacchetto: 52-LQFP Exposed Pad |
Azione6.320 |
|
1 | 2:15 | Yes/Yes | ECL, PECL | LVPECL | 3GHz | 2.375 V ~ 3.465 V | -40°C ~ 110°C | Surface Mount | 52-LQFP Exposed Pad | 52-PTQFP (10x10) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:15 3GHZ 52PTQFP
|
pacchetto: 52-LQFP Exposed Pad |
Azione2.656 |
|
1 | 2:15 | Yes/Yes | ECL, PECL | LVPECL | 3GHz | 2.375 V ~ 3.465 V | -40°C ~ 110°C | Surface Mount | 52-LQFP Exposed Pad | 52-PTQFP (10x10) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:20 2GHZ 52PTQFP
|
pacchetto: 52-LQFP Exposed Pad |
Azione4.432 |
|
1 | 2:20 | Yes/Yes | ECL, HSTL, PECL | LVPECL | 2GHz | 2.375 V ~ 3.465 V | -40°C ~ 110°C | Surface Mount | 52-LQFP Exposed Pad | 52-PTQFP (10x10) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:20 2GHZ 52PTQFP
|
pacchetto: 52-LQFP Exposed Pad |
Azione5.744 |
|
1 | 2:20 | Yes/Yes | ECL, HSTL, PECL | LVPECL | 2GHz | 2.375 V ~ 3.465 V | -40°C ~ 110°C | Surface Mount | 52-LQFP Exposed Pad | 52-PTQFP (10x10) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:10 1GHZ 52PTQFP
|
pacchetto: 52-LQFP Exposed Pad |
Azione5.536 |
|
2 | 1:10 | Yes/Yes | ECL, PECL | LVPECL | 1GHz | 2.375 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 52-LQFP Exposed Pad | 52-PTQFP (10x10) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:10 1GHZ 52PTQFP
|
pacchetto: 52-LQFP Exposed Pad |
Azione3.584 |
|
2 | 1:10 | Yes/Yes | ECL, PECL | LVPECL | 1GHz | 2.375 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 52-LQFP Exposed Pad | 52-PTQFP (10x10) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:5 3GHZ 32TQFP
|
pacchetto: 32-LQFP |
Azione6.880 |
|
2 | 1:5 | Yes/Yes | ECL, PECL | ECL, PECL | 3GHz | 2.375 V ~ 3.465 V | 0°C ~ 110°C | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:5 3GHZ 32TQFP
|
pacchetto: 32-LQFP |
Azione4.944 |
|
2 | 1:5 | Yes/Yes | ECL, PECL | ECL, PECL | 3GHz | 2.375 V ~ 3.465 V | 0°C ~ 110°C | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 2GHZ 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione4.224 |
|
1 | 2:4 | Yes/Yes | HSTL, LVPECL | LVPECL | 2GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 2GHZ 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione3.904 |
|
1 | 2:4 | Yes/Yes | HSTL, LVPECL | LVPECL | 2GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:10 2.7GHZ 32TQFP
|
pacchetto: 32-LQFP |
Azione23.100 |
|
1 | 2:10 | Yes/Yes | ECL, HSTL, PECL | ECL, PECL | 2.7GHz | 2.375 V ~ 3.465 V | -40°C ~ 110°C | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:10 2.7GHZ 32TQFP
|
pacchetto: 32-LQFP |
Azione24.000 |
|
1 | 2:10 | Yes/Yes | ECL, HSTL, PECL | ECL, PECL | 2.7GHz | 2.375 V ~ 3.465 V | -40°C ~ 110°C | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:10 2.7GHZ 32TQFP
|
pacchetto: 32-LQFP |
Azione36.288 |
|
1 | 2:10 | Yes/Yes | ECL, HSTL, PECL | ECL, PECL | 2.7GHz | 2.375 V ~ 3.465 V | -40°C ~ 110°C | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTIPLX 2:1 3GHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione6.864 |
|
2 | 2:1 | Yes/Yes | ECL, LVDS, PECL | ECL, LVDS, PECL | 3GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTIPLX 2:1 3GHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione5.808 |
|
2 | 2:1 | Yes/Yes | ECL, LVDS, PECL | ECL, LVDS, PECL | 3GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTIPLXR 2:1 3GHZ 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione6.560 |
|
2 | 2:1 | Yes/Yes | ECL, LVDS, PECL | ECL, LVDS, PECL | 3GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTIPLXR 2:1 3GHZ 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione5.952 |
|
2 | 2:1 | Yes/Yes | ECL, LVDS, PECL | ECL, LVDS, PECL | 3GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTIPLX 2:1 3GHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione3.600 |
|
2 | 2:1 | Yes/Yes | ECL, LVDS, PECL | ECL, LVDS, PECL | 3GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:5 2GHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione12.948 |
|
1 | 2:5 | Yes/Yes | ECL, HSTL, LVDS, PECL | ECL, PECL | 2GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:5 2GHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione3.728 |
|
1 | 2:5 | Yes/Yes | ECL, HSTL, LVDS, PECL | ECL, PECL | 2GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:5 2GHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione6.816 |
|
1 | 2:5 | Yes/Yes | ECL, HSTL, LVDS, PECL | ECL, PECL | 2GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:2 3GHZ 8TSSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione4.864 |
|
1 | 1:2 | Yes/Yes | ECL | LVPECL | 3GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:2 3GHZ 8TSSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione12.696 |
|
1 | 1:2 | Yes/Yes | ECL | LVPECL | 3GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-TSSOP |