Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Diodes Incorporated |
IC CLK BUFFER 1:20 400MHZ 80AQFN
|
pacchetto: - |
Azione9.000 |
|
1 | 1:20 | Yes/Yes | CMOS, HCSL | HCSL | 400 MHz | 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 80-VFQFN Dual Rows, Exposed Pad | 80-aQFN (6x6) |
||
Diodes Incorporated |
IC CLK BUF 1:2 133.46MHZ 24TQFN
|
pacchetto: - |
Azione10.500 |
|
1 | 1:2 | Yes/Yes | CMOS, HCSL | HCSL | 133.46 MHz | 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 24-VFQFN Exposed Pad | 24-TQFN (4x4) |
||
Diodes Incorporated |
IC CLK BUFFER 1:20 400MHZ 80AQFN
|
pacchetto: - |
Azione9.000 |
|
1 | 1:20 | Yes/Yes | CMOS, HCSL | HCSL | 400 MHz | 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 80-VFQFN Dual Rows, Exposed Pad | 80-aQFN (6x6) |
||
Diodes Incorporated |
IC CLK BUF 1:6 133.33MHZ 40TQFN
|
pacchetto: - |
Azione31.887 |
|
1 | 1:6 | Yes/Yes | HCSL | HCSL | 133.33 MHz | 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 40-WFQFN Exposed Pad | 40-TQFN (5x5) |
||
Diodes Incorporated |
IC CLK BUFFER 1:2 200MHZ 24TQFN
|
pacchetto: - |
Request a Quote |
|
1 | 1:2 | Yes/Yes | CMOS, HCSL | HCSL | 200 MHz | 1.7V ~ 1.9V | -40°C ~ 85°C (TA) | Surface Mount | 24-VFQFN Exposed Pad | 24-TQFN (4x4) |
||
Diodes Incorporated |
IC CLK BUFFER 1:4 160MHZ 8SOIC
|
pacchetto: - |
Request a Quote |
|
1 | 1:4 | No/No | LVCMOS, LVTTL | LVCMOS, LVTTL | 160 MHz | 1.425V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Diodes Incorporated |
IC CLK BUFFER 1:20 200MHZ 72TQFN
|
pacchetto: - |
Azione15.576 |
|
1 | 1:20 | Yes/Yes | HCSL | HCSL | 200 MHz | 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 72-VFQFN Exposed Pad | 72-TQFN (10x10) |
||
Diodes Incorporated |
IC CLK BUFFER 3:5 1.5GHZ 32TQFN
|
pacchetto: - |
Azione9.636 |
|
1 | 3:5 | Yes/Yes | Differential or Single-Ended | HCSL, LVCMOS, LVDS, LVPECL | 1.5 GHz | 2.375V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 32-VFQFN Exposed Pad | 32-TQFN (5x5) |
||
Diodes Incorporated |
IC CLK BUFFER 1:4 200MHZ 8SOIC
|
pacchetto: - |
Azione26.883 |
|
1 | 1:4 | No/No | 3-State | 3-State | 200 MHz | 1.425V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Diodes Incorporated |
IC CLK BUF 1:2 133.33MHZ 24TQFN
|
pacchetto: - |
Azione27.348 |
|
1 | 1:2 | Yes/Yes | CMOS | HCSL | 133.33 MHz | 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 24-VFQFN Exposed Pad | 24-TQFN (4x4) |
||
Diodes Incorporated |
IC CLK BUFFER 1:6 400MHZ 40TQFN
|
pacchetto: - |
Azione10.500 |
|
1 | 1:6 | Yes/Yes | HCSL | HCSL | 400 MHz | 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 40-WFQFN Exposed Pad | 40-TQFN (5x5) |
||
Diodes Incorporated |
IC CLK BUFFER 1:4 160MHZ 8SOIC
|
pacchetto: - |
Azione18.801 |
|
1 | 1:4 | No/No | 3-State | 3-State | 160 MHz | 1.425V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Diodes Incorporated |
IC CLK BUF 1:6 133.33MHZ 40TQFN
|
pacchetto: - |
Azione49.158 |
|
1 | 1:6 | Yes/Yes | HCSL | HCSL | 133.33 MHz | 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 40-WFQFN Exposed Pad | 40-TQFN (5x5) |
||
Diodes Incorporated |
IC CLK BUFFER 1:4 400MHZ 32TQFN
|
pacchetto: - |
Azione7.500 |
|
1 | 1:4 | Yes/Yes | HCSL | HCSL | 400 MHz | 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 32-VFQFN Exposed Pad | 32-TQFN (5x5) |
||
Diodes Incorporated |
CLOCK BUFFER W-QFN5050-32 T&R 2.
|
pacchetto: - |
Azione6.735 |
|
1 | 3:4 | Yes/Yes | LVCMOS, LVDS, Crystal | LVCMOS, LVDS | 1.5 GHz | 2.375V ~ 3.465V | -40°C ~ 125°C (TA) | Surface Mount | 32-WFQFN Exposed Pad | 32-WQFN (5x5) |
||
Diodes Incorporated |
IC CLK BUF 1:4 133.46MHZ 32TQFN
|
pacchetto: - |
Azione7.500 |
|
1 | 1:4 | Yes/Yes | CMOS, HCSL | HCSL | 133.46 MHz | 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 32-VFQFN Exposed Pad | 32-TQFN (5x5) |
||
Diodes Incorporated |
IC CLK BUFFER 1:5 200MHZ 40TQFN
|
pacchetto: - |
Azione7.410 |
|
1 | 1:5 | Yes/Yes | CMOS, HCSL | HCSL | 200 MHz | 1.7V ~ 1.9V | -40°C ~ 85°C (TA) | Surface Mount | 40-WFQFN Exposed Pad | 40-TQFN (5x5) |
||
Diodes Incorporated |
CLOCK BUFFER V-QFN9090-64 T&R 3K
|
pacchetto: - |
Request a Quote |
|
1 | 1:12 | Yes/Yes | HCSL | HCSL | 400 MHz | 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 64-VFQFN Exposed Pad | 64-TQFN (9x9) |
||
Diodes Incorporated |
IC CLK BUF 1:4 133.33MHZ 32TQFN
|
pacchetto: - |
Azione31.392 |
|
1 | 1:4 | Yes/Yes | HCSL | HCSL | 133.33 MHz | 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 32-VFQFN Exposed Pad | 32-TQFN (5x5) |
||
Diodes Incorporated |
IC CLK BUFFER 1:6 400MHZ 40TQFN
|
pacchetto: - |
Azione10.500 |
|
1 | 1:6 | Yes/Yes | HCSL | HCSL | 400 MHz | 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 40-WFQFN Exposed Pad | 40-TQFN (5x5) |
||
Diodes Incorporated |
IC CLK BUFFER 1:2 1.5GHZ 16TQFN
|
pacchetto: - |
Azione1.455 |
|
1 | 1:2 | Yes/Yes | CML, HCSL, LVDS, LVPECL | LVPECL | 1.5 GHz | 2.375V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 16-WFQFN Exposed Pad | 16-TQFN (3x3) |
||
Diodes Incorporated |
IC CLK BUFFER 1:6 200MHZ 40TQFN
|
pacchetto: - |
Request a Quote |
|
1 | 1:6 | Yes/Yes | CMOS, HCSL | HCSL | 200 MHz | 1.7V ~ 1.9V | -40°C ~ 85°C (TA) | Surface Mount | 40-WFQFN Exposed Pad | 40-TQFN (3x6) |
||
Diodes Incorporated |
IC CLK BUF 1:8 133.46MHZ 48TQFN
|
pacchetto: - |
Request a Quote |
|
1 | 1:8 | Yes/Yes | CMOS, HCSL | HCSL | 133.46 MHz | 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | 48-TQFN (6x6) |
||
Diodes Incorporated |
IC CLK BUFFER 1:12 400MHZ 64TQFN
|
pacchetto: - |
Azione9.000 |
|
1 | 1:12 | Yes/Yes | HCSL | HCSL | 400 MHz | 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 64-VFQFN Exposed Pad | 64-TQFN (9x9) |
||
Diodes Incorporated |
IC CLK BUFFER 1:2 250MHZ 8SOIC
|
pacchetto: - |
Request a Quote |
|
1 | 1:2 | No/No | LVCMOS, LVTTL | LVCMOS, LVTTL | 250 MHz | 2.375V ~ 2.625V, 3.135V ~ 3.465V | -40°C ~ 105°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Diodes Incorporated |
CLOCK BUFFER V-QFN6060-48 T&R 3K
|
pacchetto: - |
Request a Quote |
|
1 | 1:8 | Yes/Yes | HCSL | HCSL | 400 MHz | 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | 48-TQFN (6x6) |
||
Diodes Incorporated |
IC CLK BUF 1:6 133.46MHZ 40TQFN
|
pacchetto: - |
Request a Quote |
|
1 | 1:6 | Yes/Yes | CMOS, HCSL | HCSL | 133.46 MHz | 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 40-WFQFN Exposed Pad | 40-TQFN (5x5) |
||
Diodes Incorporated |
IC CLK BUFFER 1:20 400MHZ 80AQFN
|
pacchetto: - |
Azione25.527 |
|
1 | 1:20 | Yes/Yes | CMOS, HCSL | HCSL | 400 MHz | 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 80-VFQFN Dual Rows, Exposed Pad | 80-aQFN (6x6) |