Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Analog Devices Inc. |
IC CLK BUFFER 1:2 14GHZ 16SMD
|
pacchetto: 16-VFCQFN Exposed Pad |
Azione5.824 |
|
1 | 1:2 | Yes/Yes | CML | CML | 14GHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFCQFN Exposed Pad | 16-CSMT (3x3) |
||
Analog Devices Inc. |
IC CLK BUFFER 1:2 14GHZ 16SMD
|
pacchetto: 16-VFCQFN Exposed Pad |
Azione4.384 |
|
1 | 1:2 | Yes/Yes | CML | CML | 14GHz | -3 V ~ -3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFCQFN Exposed Pad | 16-CSMT (3x3) |
||
Analog Devices Inc. |
IC CLOCK BUFFER 1:2 16SMT
|
pacchetto: 16-VFQFN Exposed Pad |
Azione8.892 |
|
1 | 1:2 | Yes/Yes | CML | CML | 14GHz | -3 V ~ -3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-SMT (3x3) |
||
Analog Devices Inc. |
IC CLK BUFFER 1:5 1.2GHZ 48LFCSP
|
pacchetto: 48-VFQFN Exposed Pad, CSP |
Azione5.440 |
|
1 | 1:5 | Yes/Yes | Clock | LVCMOS, LVDS, LVPECL | 1.2GHz | 3.135 V ~ 3.465 V | -55°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad, CSP | 48-LFCSP-VQ (7x7) |
||
Analog Devices Inc. |
IC CLK BUFFER 1:5 1.2GHZ 48LFCSP
|
pacchetto: 48-VFQFN Exposed Pad, CSP |
Azione7.808 |
|
1 | 1:5 | Yes/Yes | Clock | LVCMOS, LVDS, LVPECL | 1.2GHz | 3.135 V ~ 3.465 V | -55°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad, CSP | 48-LFCSP-VQ (7x7) |
||
Analog Devices Inc. |
IC CLK BUFFER 1:1 7.5GHZ 16LFCSP
|
pacchetto: 16-VFQFN Exposed Pad, CSP |
Azione2.100 |
|
2 | 1:1 | Yes/Yes | Clock | ECL, NECL, PECL | 7.5GHz | 2.375 V ~ 3.63 V | -40°C ~ 125°C | Surface Mount | 16-VFQFN Exposed Pad, CSP | 16-LFCSP-VQ (3x3) |
||
Analog Devices Inc. |
IC CLOCK BUFFER 2:8 3.5GHZ 40QFN
|
pacchetto: 28-VFQFN Exposed Pad |
Azione2.160 |
|
1 | 2:8 | Yes/Yes | CML, LVDS, LVPECL | LVDS, LVPECL | 3.5GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 28-VFQFN Exposed Pad | 28-LFCSP (5x5) |
||
Analog Devices Inc. |
IC CLK BUFFER 2:10 1.1GHZ 32LQFP
|
pacchetto: 32-LQFP |
Azione5.488 |
|
1 | 2:10 | Yes/Yes | LVDS | LVDS | 1.1GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
Analog Devices Inc. |
IC CLK BUF 2:12 4.8GHZ 40LFCSP
|
pacchetto: 40-VFQFN Exposed Pad, CSP |
Azione15.936 |
|
1 | 2:12 | Yes/Yes | CMOS, LVDS, LVPECL | LVPECL | 4.8GHz | 2.97 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad, CSP | 40-LFCSP-VQ (6x6) |
||
Analog Devices Inc. |
IC CLK BUFFER 2:5 1.2GHZ 48LFCSP
|
pacchetto: 48-VFQFN Exposed Pad, CSP |
Azione6.876 |
|
1 | 2:5 | Yes/Yes | Clock | CMOS, LVDS, LVPECL | 1.2GHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad, CSP | 48-LFCSP-VQ (7x7) |
||
Analog Devices Inc. |
IC CLK BUFFER 1:1 7.5GHZ 16LFCSP
|
pacchetto: 16-VFQFN Exposed Pad, CSP |
Azione3.872 |
|
2 | 1:1 | Yes/Yes | Clock | ECL, NECL, PECL | 7.5GHz | 2.375 V ~ 3.63 V | -40°C ~ 125°C | Surface Mount | 16-VFQFN Exposed Pad, CSP | 16-LFCSP-VQ (3x3) |
||
Analog Devices Inc. |
IC CLK BUFF 1:4 1.65GHZ 24LFCSP
|
pacchetto: 24-WFQFN Exposed Pad, CSP |
Azione5.712 |
|
1 | 1:4 | Yes/Yes | CMOS | CMOS, HSTL, LVDS | 1.2GHz | 2.375 V ~ 2.625 V | -55°C ~ 105°C | Surface Mount | 24-WFQFN Exposed Pad, CSP | 24-LFCSP-WQ (4x4) |
||
Analog Devices Inc. |
IC CLK BUF 2:10 4.8GHZ 40LFCSP
|
pacchetto: 40-VFQFN Exposed Pad, CSP |
Azione7.504 |
|
1 | 2:10 | Yes/Yes | CML, CMOS, LVDS, LVPECL | LVPECL | 4.8GHz | 2.97 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad, CSP | 40-LFCSP-VQ (6x6) |
||
Analog Devices Inc. |
IC CLK BUFFER 1:3 1.6GHZ 32LFCSP
|
pacchetto: 32-VFQFN Exposed Pad, CSP |
Azione13.740 |
|
1 | 1:3 | Yes/Yes | Clock | CMOS, LVDS, LVPECL | 1.6GHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, CSP | 32-LFCSP-VQ (5x5) |
||
Analog Devices Inc. |
IC CLK BUFFER 2:10 1.1GHZ 32LQFP
|
pacchetto: 32-LQFP |
Azione2.256 |
|
1 | 2:10 | Yes/Yes | LVDS | LVDS | 1.1GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
Analog Devices Inc. |
IC CLK BUFFER 2:8 4.8GHZ 32LFCSP
|
pacchetto: 32-VFQFN Exposed Pad, CSP |
Azione2.320 |
|
1 | 2:8 | Yes/Yes | CML, CMOS, LVDS, LVPECL | LVPECL | 4.8GHz | 2.97 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, CSP | 32-LFCSP-VQ (5x5) |
||
Analog Devices Inc. |
IC CLK BUF 2:10 1.1GHZ 32LFCSP
|
pacchetto: 32-WFQFN Exposed Pad, CSP |
Azione132.624 |
|
1 | 2:10 | Yes/Yes | LVDS | LVDS | 1.1GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 32-WFQFN Exposed Pad, CSP | 32-LFCSP-WQ (5x5) |
||
Analog Devices Inc. |
IC CLK BUFFER 1:6 4.8GHZ 24LFCSP
|
pacchetto: 24-VFQFN Exposed Pad, CSP |
Azione34.224 |
|
1 | 1:6 | Yes/Yes | CML, CMOS, LVDS, LVPECL | LVPECL | 4.8GHz | 2.97 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad, CSP | 24-LFCSP-VQ (4x4) |
||
Analog Devices Inc. |
IC CLK BUFF 1:4 1.65GHZ 24LFCSP
|
pacchetto: 24-WFQFN Exposed Pad, CSP |
Azione7.216 |
|
1 | 1:4 | Yes/Yes | CMOS | CMOS, HSTL, LVDS | 1.65GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 24-WFQFN Exposed Pad, CSP | 24-LFCSP-WQ (4x4) |
||
Analog Devices Inc. |
IC CLK BUFFER 1:6 1.2GHZ 24LFCSP
|
pacchetto: 24-VFQFN Exposed Pad, CSP |
Azione3.184 |
|
1 | 1:6 | Yes/Yes | CML, CMOS, HSTL, LVDS, LVPECL | CMOS, LVDS | 1.2GHz | 1.71 V ~ 1.89 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad, CSP | 24-LFCSP-VQ (4x4) |
||
Analog Devices Inc. |
IC CLK BUFF 1:4 1.65GHZ 24LFCSP
|
pacchetto: 24-WFQFN Exposed Pad, CSP |
Azione3.328 |
|
1 | 1:4 | Yes/Yes | CMOS | CMOS, HSTL, LVDS | 1.2GHz | 2.375 V ~ 2.625 V | -55°C ~ 105°C | Surface Mount | 24-WFQFN Exposed Pad, CSP | 24-LFCSP-WQ (4x4) |
||
Analog Devices Inc. |
IC CLK BUFF 1:4 1.65GHZ 24LFCSP
|
pacchetto: 24-WFQFN Exposed Pad, CSP |
Azione4.384 |
|
1 | 1:4 | Yes/Yes | CMOS | CMOS, HSTL, LVDS | 1.65GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 24-WFQFN Exposed Pad, CSP | 24-LFCSP-WQ (4x4) |
||
Analog Devices Inc. |
IC CLK BUFFER 1:1 7.5GHZ 16LFCSP
|
pacchetto: 16-VFQFN Exposed Pad, CSP |
Azione5.328 |
|
1 | 1:1 | Yes/Yes | CML, CMOS, LVDS, LVPECL, LVTTL | HVDS | 7.5GHz | 2.97 V ~ 3.63 V | -40°C ~ 125°C | Surface Mount | 16-VFQFN Exposed Pad, CSP | 16-LFCSP-VQ (3x3) |
||
Analog Devices Inc. |
IC CLK BUFFER 1:4 7GHZ 16LFCSP
|
pacchetto: 16-WFQFN Exposed Pad, CSP |
Azione9.468 |
|
1 | 1:4 | Yes/Yes | CML, CMOS, LVDS, LVPECL | ECL, LVPECL | 7GHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-WFQFN Exposed Pad, CSP | 16-LFCSP-WQ (3x3) |
||
Analog Devices Inc. |
IC CLK BUFFER 1:1 25KHZ 24DIP
|
pacchetto: 24-DIP (0.500", 12.70mm), 4 Leads |
Azione14.184 |
|
1 | 1:1 | No/No | Clock | Clock | 25kHz | 14.25 V ~ 15.75 V | -40°C ~ 85°C | Through Hole | 24-DIP (0.500", 12.70mm), 4 Leads | 24-DIP |
||
Analog Devices Inc. |
IC CLK BUFFER 1:1 7.5GHZ 16LFCSP
|
pacchetto: 16-VFQFN Exposed Pad, CSP |
Azione6.592 |
|
1 | 1:1 | Yes/Yes | CML, CMOS, LVDS, LVPECL, LVTTL | HVDS | 7.5GHz | 2.97 V ~ 3.63 V | -40°C ~ 125°C | Surface Mount | 16-VFQFN Exposed Pad, CSP | 16-LFCSP-VQ (3x3) |
||
Analog Devices Inc. |
IC CLK BUFFER 1:1 25KHZ
|
pacchetto: 13-SIP (4 Staggered Leads) |
Azione5.872 |
|
1 | 1:1 | No/No | Clock | Clock | 25kHz | 14.25 V ~ 15.75 V | -40°C ~ 85°C | Through Hole | 13-SIP (4 Staggered Leads) | - |
||
Analog Devices Inc. |
IC CLK BUFFER 2:5 1.2GHZ 48LFCSP
|
pacchetto: 48-VFQFN Exposed Pad, CSP |
Azione30.984 |
|
1 | 2:5 | Yes/Yes | Clock | CMOS, LVDS, LVPECL | 1.2GHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad, CSP | 48-LFCSP-VQ (7x7) |