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Prodotti Xilinx Inc.

Record 7.167
Pagina  149/256
Immagine
Numero di parte
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Descrizione
pacchetto
Azione
Quantità
hot XC1701PC20C
Xilinx Inc.

IC PROM SER C-TEMP 1K 20-PLCC

  • Programmable Type: OTP
  • Memory Size: 1Mb
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Operating Temperature: 0°C ~ 70°C
  • Package / Case: 20-LCC (J-Lead)
  • Supplier Device Package: 20-PLCC (9x9)
pacchetto: 20-LCC (J-Lead)
Azione22.200
hot XC18V02PC44C
Xilinx Inc.

IC PROM SERIAL CONFIG 2M 44-PLCC

  • Programmable Type: In System Programmable
  • Memory Size: 2Mb
  • Voltage - Supply: 3 V ~ 3.6 V
  • Operating Temperature: 0°C ~ 70°C
  • Package / Case: 44-LCC (J-Lead)
  • Supplier Device Package: 44-PLCC (16.59x16.59)
pacchetto: 44-LCC (J-Lead)
Azione112.068
XCZU2EG-L1SBVA484I
Xilinx Inc.

IC FPGA 82 I/O 484FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 103K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-BBGA, FCBGA
  • Supplier Device Package: 484-FCBGA (19x19)
pacchetto: 484-BBGA, FCBGA
Azione7.488
hot XA3S400-4PQG208Q
Xilinx Inc.

IC FPGA 141 I/O 208QFP

  • Number of LABs/CLBs: 896
  • Number of Logic Elements/Cells: 8064
  • Total RAM Bits: 294912
  • Number of I/O: 141
  • Number of Gates: 400000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Package / Case: 208-BFQFP
  • Supplier Device Package: 208-PQFP (28x28)
pacchetto: 208-BFQFP
Azione7.504
hot XCV400E-7BG560C
Xilinx Inc.

IC FPGA 404 I/O 560MBGA

  • Number of LABs/CLBs: 2400
  • Number of Logic Elements/Cells: 10800
  • Total RAM Bits: 163840
  • Number of I/O: 404
  • Number of Gates: 569952
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 560-LBGA, Metal
  • Supplier Device Package: 560-MBGA (42.5x42.5)
pacchetto: 560-LBGA, Metal
Azione5.264
XC4036EX-4PG411C
Xilinx Inc.

IC FPGA 288 I/O 411CPGA

  • Number of LABs/CLBs: 1296
  • Number of Logic Elements/Cells: 3078
  • Total RAM Bits: 41472
  • Number of I/O: 288
  • Number of Gates: 36000
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Mounting Type: Through Hole
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 411-BCPGA
  • Supplier Device Package: 411-CPGA (52.3x52.3)
pacchetto: 411-BCPGA
Azione3.520
XC4010XL-3TQ176I
Xilinx Inc.

IC FPGA 145 I/O 176TQFP

  • Number of LABs/CLBs: 400
  • Number of Logic Elements/Cells: 950
  • Total RAM Bits: 12800
  • Number of I/O: 145
  • Number of Gates: 10000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 176-LQFP
  • Supplier Device Package: 176-TQFP (24x24)
pacchetto: 176-LQFP
Azione6.704
XC4003E-2VQ100I
Xilinx Inc.

IC FPGA 77 I/O 100VQFP

  • Number of LABs/CLBs: 100
  • Number of Logic Elements/Cells: 238
  • Total RAM Bits: 3200
  • Number of I/O: 77
  • Number of Gates: 3000
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 100-TQFP
  • Supplier Device Package: 100-VQFP (14x14)
pacchetto: 100-TQFP
Azione6.128
XC5210-5PQ240C
Xilinx Inc.

IC FPGA 196 I/O 240QFP

  • Number of LABs/CLBs: 324
  • Number of Logic Elements/Cells: 1296
  • Total RAM Bits: -
  • Number of I/O: 196
  • Number of Gates: 16000
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 240-BFQFP
  • Supplier Device Package: 240-PQFP (32x32)
pacchetto: 240-BFQFP
Azione5.312
hot XC4008E-3PQ160C
Xilinx Inc.

IC FPGA 129 I/O 160QFP

  • Number of LABs/CLBs: 324
  • Number of Logic Elements/Cells: 770
  • Total RAM Bits: 10368
  • Number of I/O: 129
  • Number of Gates: 8000
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 160-BQFP
  • Supplier Device Package: 160-PQFP (28x28)
pacchetto: 160-BQFP
Azione4.528
XC7VX1140T-G2FLG1926E
Xilinx Inc.

IC FPGA 720 I/O 1926FCBGA

  • Number of LABs/CLBs: 89000
  • Number of Logic Elements/Cells: 1139200
  • Total RAM Bits: 69304320
  • Number of I/O: 720
  • Number of Gates: -
  • Voltage - Supply: 0.97 V ~ 1.03 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1924-BBGA, FCBGA
  • Supplier Device Package: 1926-FCBGA (45x45)
pacchetto: 1924-BBGA, FCBGA
Azione2.576
XCKU3P-1FFVB676I
Xilinx Inc.

XCKU3P-1FFVB676I

  • Number of LABs/CLBs: 20340
  • Number of Logic Elements/Cells: 355950
  • Total RAM Bits: 26828800
  • Number of I/O: 280
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: -
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
pacchetto: -
Azione4.848
XC6VCX130T-1FFG484I
Xilinx Inc.

IC FPGA 240 I/O 484FCBGA

  • Number of LABs/CLBs: 10000
  • Number of Logic Elements/Cells: 128000
  • Total RAM Bits: 9732096
  • Number of I/O: 240
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
pacchetto: 484-BBGA
Azione2.448
XC7A200T-L1FFG1156I
Xilinx Inc.

IC FPGA ARTIX7 500 I/O 1156FCBGA

  • Number of LABs/CLBs: 16825
  • Number of Logic Elements/Cells: 215360
  • Total RAM Bits: 13455360
  • Number of I/O: 500
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
pacchetto: 1156-BBGA, FCBGA
Azione3.376
hot XC4VLX15-10FF668I
Xilinx Inc.

IC FPGA 320 I/O 668FCBGA

  • Number of LABs/CLBs: 1536
  • Number of Logic Elements/Cells: 13824
  • Total RAM Bits: 884736
  • Number of I/O: 320
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 668-BBGA, FCBGA
  • Supplier Device Package: 668-FCBGA (27x27)
pacchetto: 668-BBGA, FCBGA
Azione4.448
XC6SLX75T-N3FG484I
Xilinx Inc.

IC FPGA 268 I/O 484FBGA

  • Number of LABs/CLBs: 5831
  • Number of Logic Elements/Cells: 74637
  • Total RAM Bits: 3170304
  • Number of I/O: 268
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
pacchetto: 484-BBGA
Azione7.776
XC6SLX75-L1FGG676C
Xilinx Inc.

IC FPGA 408 I/O 676FBGA

  • Number of LABs/CLBs: 5831
  • Number of Logic Elements/Cells: 74637
  • Total RAM Bits: 3170304
  • Number of I/O: 408
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 676-BGA
  • Supplier Device Package: 676-FBGA (27x27)
pacchetto: 676-BGA
Azione4.368
XC6SLX75-N3FGG484I
Xilinx Inc.

IC FPGA 280 I/O 484FBGA

  • Number of LABs/CLBs: 5831
  • Number of Logic Elements/Cells: 74637
  • Total RAM Bits: 3170304
  • Number of I/O: 280
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
pacchetto: 484-BBGA
Azione4.432
XA3S400A-4FGG400I
Xilinx Inc.

IC FPGA 311 I/O 400FBGA

  • Number of LABs/CLBs: 896
  • Number of Logic Elements/Cells: 8064
  • Total RAM Bits: 368640
  • Number of I/O: 311
  • Number of Gates: 400000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 400-BGA
  • Supplier Device Package: 400-FBGA (21x21)
pacchetto: 400-BGA
Azione2.304
hot XC3S700AN-5FGG484C
Xilinx Inc.

IC FPGA 372 I/O 484FBGA

  • Number of LABs/CLBs: 1472
  • Number of Logic Elements/Cells: 13248
  • Total RAM Bits: 368640
  • Number of I/O: 372
  • Number of Gates: 700000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
pacchetto: 484-BBGA
Azione5.664
XA7A35T-1CSG324I
Xilinx Inc.

IC FPGA 210 I/O 324BGA

  • Number of LABs/CLBs: 2600
  • Number of Logic Elements/Cells: 33280
  • Total RAM Bits: 1843200
  • Number of I/O: 210
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 324-LFBGA, CSPBGA
  • Supplier Device Package: 324-CSPBGA (15x15)
pacchetto: 324-LFBGA, CSPBGA
Azione5.120
hot XC3S200A-4FGG320I
Xilinx Inc.

IC FPGA 248 I/O 320FBGA

  • Number of LABs/CLBs: 448
  • Number of Logic Elements/Cells: 4032
  • Total RAM Bits: 294912
  • Number of I/O: 248
  • Number of Gates: 200000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 320-BGA
  • Supplier Device Package: 320-FBGA (19x19)
pacchetto: 320-BGA
Azione18.408
XC2S100-6TQG144C
Xilinx Inc.

IC FPGA 92 I/O 144TQFP

  • Number of LABs/CLBs: 600
  • Number of Logic Elements/Cells: 2700
  • Total RAM Bits: 40960
  • Number of I/O: 92
  • Number of Gates: 100000
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
pacchetto: 144-LQFP
Azione5.808
hot XC3S100E-5CPG132C
Xilinx Inc.

IC FPGA 83 I/O 132CSBGA

  • Number of LABs/CLBs: 240
  • Number of Logic Elements/Cells: 2160
  • Total RAM Bits: 73728
  • Number of I/O: 83
  • Number of Gates: 100000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 132-TFBGA, CSPBGA
  • Supplier Device Package: 132-CSPBGA (8x8)
pacchetto: 132-TFBGA, CSPBGA
Azione28.308
hot XC95108-15PCG84C
Xilinx Inc.

IC CPLD 108MC 15NS 84PLCC

  • Programmable Type: In System Programmable (min 10K program/erase cycles)
  • Delay Time tpd(1) Max: 15.0ns
  • Voltage Supply - Internal: 4.75 V ~ 5.25 V
  • Number of Logic Elements/Blocks: 6
  • Number of Macrocells: 108
  • Number of Gates: 2400
  • Number of I/O: 69
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 84-LCC (J-Lead)
  • Supplier Device Package: 84-PLCC (29.31x29.31)
pacchetto: 84-LCC (J-Lead)
Azione6.576
hot XC2C384-10FTG256C
Xilinx Inc.

IC CPLD 384MC 9.2NS 256FBGA

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 9.2ns
  • Voltage Supply - Internal: 1.7 V ~ 1.9 V
  • Number of Logic Elements/Blocks: 24
  • Number of Macrocells: 384
  • Number of Gates: 9000
  • Number of I/O: 212
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
pacchetto: 256-LBGA
Azione6.368
XCR3128XL-7VQ100I
Xilinx Inc.

IC CPLD 128MC 7NS 100VQFP

  • Programmable Type: In System Programmable (min 1K program/erase cycles)
  • Delay Time tpd(1) Max: 7.0ns
  • Voltage Supply - Internal: 3 V ~ 3.6 V
  • Number of Logic Elements/Blocks: 8
  • Number of Macrocells: 128
  • Number of Gates: 3000
  • Number of I/O: 84
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 100-TQFP
  • Supplier Device Package: 100-VQFP (14x14)
pacchetto: 100-TQFP
Azione3.456
XCVU11P-1FLGA2577E
Xilinx Inc.

IC FPGA VIRTEX-UP 2577FCBGA

  • Number of LABs/CLBs: 162000
  • Number of Logic Elements/Cells: 2835000
  • Total RAM Bits: 396150400
  • Number of I/O: 448
  • Number of Gates: -
  • Voltage - Supply: 0.825 V ~ 0.876 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 2577-BBGA, FCBGA
  • Supplier Device Package: 2577-FCBGA (52.5x52.5)
pacchetto: 2577-BBGA, FCBGA
Azione3.392