Prodotti Xilinx Inc.

XC17S200AVOG8C

Xilinx Inc.

IC PROM SERIAL 200K 8-SOIC

• Programmable Type: OTP
• Memory Size: 2Mb
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-TSOP

pacchetto: 8-SOIC (0.154", 3.90mm Width)

XC2V6000-4FF1517I

Xilinx Inc.

IC FPGA 1104 I/O 1517FCBGA

• Number of LABs/CLBs: 8448
• Number of Logic Elements/Cells: -
• Total RAM Bits: 2654208
• Number of I/O: 1104
• Number of Gates: 6000000
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FCBGA (40x40)

pacchetto: 1517-BBGA, FCBGA

XC2V1500-4FGG676C

Xilinx Inc.

IC FPGA 392 I/O 676FBGA

• Number of LABs/CLBs: 1920
• Number of Logic Elements/Cells: -
• Total RAM Bits: 884736
• Number of I/O: 392
• Number of Gates: 1500000
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 676-BGA
• Supplier Device Package: 676-FBGA (27x27)

pacchetto: 676-BGA

XCV1600E-7BG560C

Xilinx Inc.

IC FPGA 404 I/O 560MBGA

• Number of LABs/CLBs: 7776
• Number of Logic Elements/Cells: 34992
• Total RAM Bits: 589824
• Number of I/O: 404
• Number of Gates: 2188742
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 560-LBGA, Metal
• Supplier Device Package: 560-MBGA (42.5x42.5)

pacchetto: 560-LBGA, Metal

XC4052XL-3BG560I

Xilinx Inc.

IC FPGA 352 I/O 560MBGA

• Number of LABs/CLBs: 1936
• Number of Logic Elements/Cells: 4598
• Total RAM Bits: 61952
• Number of I/O: 352
• Number of Gates: 52000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 560-LBGA, Metal
• Supplier Device Package: 560-MBGA (42.5x42.5)

pacchetto: 560-LBGA, Metal

XC4028XL-3BG352I

Xilinx Inc.

IC FPGA 256 I/O 352MBGA

• Number of LABs/CLBs: 1024
• Number of Logic Elements/Cells: 2432
• Total RAM Bits: 32768
• Number of I/O: 256
• Number of Gates: 28000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 352-LBGA, Metal
• Supplier Device Package: 352-MBGA (35x35)

pacchetto: 352-LBGA, Metal

XC4020E-3PG223I

Xilinx Inc.

IC FPGA 192 I/O 223CPGA

• Number of LABs/CLBs: 784
• Number of Logic Elements/Cells: 1862
• Total RAM Bits: 25088
• Number of I/O: 192
• Number of Gates: 20000
• Voltage - Supply: 4.5 V ~ 5.5 V
• Mounting Type: Through Hole
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 223-BCPGA
• Supplier Device Package: 223-CPGA (47.25x47.25)

pacchetto: 223-BCPGA

XC4006E-4PC84I

Xilinx Inc.

IC FPGA 61 I/O 84PLCC

• Number of LABs/CLBs: 256
• Number of Logic Elements/Cells: 608
• Total RAM Bits: 8192
• Number of I/O: 61
• Number of Gates: 6000
• Voltage - Supply: 4.5 V ~ 5.5 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 84-LCC (J-Lead)
• Supplier Device Package: 84-PLCC (29.31x29.31)

pacchetto: 84-LCC (J-Lead)

XC4005XL-3PC84I

Xilinx Inc.

IC FPGA 61 I/O 84PLCC

• Number of LABs/CLBs: 196
• Number of Logic Elements/Cells: 466
• Total RAM Bits: 6272
• Number of I/O: 61
• Number of Gates: 5000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 84-LCC (J-Lead)
• Supplier Device Package: 84-PLCC (29.31x29.31)

pacchetto: 84-LCC (J-Lead)

XC4005XL-2TQ144I

Xilinx Inc.

IC FPGA 112 I/O 144TQFP

• Number of LABs/CLBs: 196
• Number of Logic Elements/Cells: 466
• Total RAM Bits: 6272
• Number of I/O: 112
• Number of Gates: 5000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 144-LQFP
• Supplier Device Package: 144-TQFP (20x20)

pacchetto: 144-LQFP

XC5210-6PQ160C

Xilinx Inc.

IC FPGA 133 I/O 160QFP

• Number of LABs/CLBs: 324
• Number of Logic Elements/Cells: 1296
• Total RAM Bits: -
• Number of I/O: 133
• Number of Gates: 16000
• Voltage - Supply: 4.75 V ~ 5.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 160-BQFP
• Supplier Device Package: 160-PQFP (28x28)

pacchetto: 160-BQFP

XCKU085-3FLVF1924E

Xilinx Inc.

IC FPGA 624 I/O 1924FCBGA

• Number of LABs/CLBs: 62190
• Number of Logic Elements/Cells: 1088325
• Total RAM Bits: 58265600
• Number of I/O: 624
• Number of Gates: -
• Voltage - Supply: 0.970 V ~ 1.030 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1924-BBGA, FCBGA
• Supplier Device Package: 1924-FCBGA (45x45)

pacchetto: 1924-BBGA, FCBGA

XQ4VFX100-11FF1152I

Xilinx Inc.

IC FPGA VIRTEX-4FX 1152FFBGA

• Number of LABs/CLBs: 10544
• Number of Logic Elements/Cells: 94896
• Total RAM Bits: 6930432
• Number of I/O: 576
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-CFCBGA (35x35)

pacchetto: 1152-BBGA, FCBGA

XQL4VFX100-9FF1152I4095

Xilinx Inc.

IC FPGA VIRTEX-4FX 100K 1152BGA

• Number of LABs/CLBs: 10544
• Number of Logic Elements/Cells: 94896
• Total RAM Bits: 6930432
• Number of I/O: 576
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-CFCBGA (35x35)

pacchetto: 1152-BBGA, FCBGA

XC6VLX240T-2FF1156C

Xilinx Inc.

IC FPGA 600 I/O 1156FCBGA

• Number of LABs/CLBs: 18840
• Number of Logic Elements/Cells: 241152
• Total RAM Bits: 15335424
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1156-FCBGA (35x35)

pacchetto: 1156-BBGA, FCBGA

XCKU040-1FBVA900I

Xilinx Inc.

IC FPGA 468 I/O 900FCBGA

• Number of LABs/CLBs: 30300
• Number of Logic Elements/Cells: 530250
• Total RAM Bits: 21606000
• Number of I/O: 468
• Number of Gates: -
• Voltage - Supply: 0.922 V ~ 0.979 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 900-BBGA, FCBGA
• Supplier Device Package: 900-FCBGA (31x31)

pacchetto: 900-BBGA, FCBGA

XC5VFX70T-2FFG1136C

Xilinx Inc.

IC FPGA 640 I/O 1136FCBGA

• Number of LABs/CLBs: 5600
• Number of Logic Elements/Cells: 71680
• Total RAM Bits: 5455872
• Number of I/O: 640
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1136-BBGA, FCBGA
• Supplier Device Package: 1136-FCBGA (35x35)

pacchetto: 1136-BBGA, FCBGA

XC6SLX45T-N3CSG484I

Xilinx Inc.

IC FPGA 296 I/O 484CSBGA

• Number of LABs/CLBs: 3411
• Number of Logic Elements/Cells: 43661
• Total RAM Bits: 2138112
• Number of I/O: 296
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-FBGA, CSPBGA
• Supplier Device Package: 484-CSPBGA (19x19)

pacchetto: 484-FBGA, CSPBGA

XC6SLX45-2FGG676I

Xilinx Inc.

IC FPGA 358 I/O 676FBGA

• Number of LABs/CLBs: 3411
• Number of Logic Elements/Cells: 43661
• Total RAM Bits: 2138112
• Number of I/O: 358
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 676-BGA
• Supplier Device Package: 676-FBGA (27x27)

pacchetto: 676-BGA

XC7A35T-1FG484I

Xilinx Inc.

IC FPGA 250 I/O 484FCBGA

• Number of LABs/CLBs: 2600
• Number of Logic Elements/Cells: 33208
• Total RAM Bits: 1843200
• Number of I/O: 250
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-BBGA
• Supplier Device Package: 484-FBGA (23x23)

pacchetto: 484-BBGA

XC3S250E-5PQ208C

Xilinx Inc.

IC FPGA 158 I/O 208QFP

• Number of LABs/CLBs: 612
• Number of Logic Elements/Cells: 5508
• Total RAM Bits: 221184
• Number of I/O: 158
• Number of Gates: 250000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 208-BFQFP
• Supplier Device Package: 208-PQFP (28x28)

pacchetto: 208-BFQFP

XC6SLX75-2FGG484C

Xilinx Inc.

IC FPGA 280 I/O 484FBGA

• Number of LABs/CLBs: 5831
• Number of Logic Elements/Cells: 74637
• Total RAM Bits: 3170304
• Number of I/O: 280
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 484-BBGA
• Supplier Device Package: 484-FBGA (23x23)

pacchetto: 484-BBGA

XC2C512-10PQG208I

Xilinx Inc.

IC CPLD 512MC 9.2NS 208QFP

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 9.2ns
• Voltage Supply - Internal: 1.7 V ~ 1.9 V
• Number of Logic Elements/Blocks: 32
• Number of Macrocells: 512
• Number of Gates: 12000
• Number of I/O: 173
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 208-BFQFP
• Supplier Device Package: 208-PQFP (28x28)

pacchetto: 208-BFQFP

XCR3256XL-10FT256C

Xilinx Inc.

IC CPLD 256MC 9NS 256BGA

• Programmable Type: In System Programmable (min 1K program/erase cycles)
• Delay Time tpd(1) Max: 9.1ns
• Voltage Supply - Internal: 3 V ~ 3.6 V
• Number of Logic Elements/Blocks: 16
• Number of Macrocells: 256
• Number of Gates: 6000
• Number of I/O: 164
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 256-LBGA
• Supplier Device Package: 256-FTBGA (17x17)

pacchetto: 256-LBGA

XC95144XL-7CSG144C

Xilinx Inc.

IC CPLD 144MC 7.5NS 144CSBGA

• Programmable Type: In System Programmable (min 10K program/erase cycles)
• Delay Time tpd(1) Max: 7.5ns
• Voltage Supply - Internal: 3 V ~ 3.6 V
• Number of Logic Elements/Blocks: 8
• Number of Macrocells: 144
• Number of Gates: 3200
• Number of I/O: 117
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 144-TFBGA, CSPBGA
• Supplier Device Package: 144-LCSBGA (12x12)

pacchetto: 144-TFBGA, CSPBGA

XC2C64A-7CPG56C

Xilinx Inc.

IC CPLD 64MC 6.7NS 56BGA

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 6.7ns
• Voltage Supply - Internal: 1.7 V ~ 1.9 V
• Number of Logic Elements/Blocks: 4
• Number of Macrocells: 64
• Number of Gates: 1500
• Number of I/O: 45
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 56-LFBGA, CSPBGA
• Supplier Device Package: 56-CSBGA (6x6)

pacchetto: 56-LFBGA, CSPBGA

XAZU3EG-L1SFVC784I

Xilinx Inc.

XAZU3EG-L1SFVC784I

• Architecture: -
• Core Processor: -
• Flash Size: -
• RAM Size: -
• Peripherals: -
• Connectivity: -
• Speed: -
• Primary Attributes: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

pacchetto: -

XC7S50-2FTGB196C

Xilinx Inc.

XC7S50-2FTGB196C

• Number of LABs/CLBs: 4075
• Number of Logic Elements/Cells: 52160
• Total RAM Bits: 2764800
• Number of I/O: 100
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 196-LBGA, CSPBGA
• Supplier Device Package: 196-CSBGA (15x15)

pacchetto: 196-LBGA, CSPBGA