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Prodotti Xilinx Inc.

Record 7.167
Pagina  102/256
Immagine
Numero di parte
Produttore
Descrizione
pacchetto
Azione
Quantità
hot XC17S40PD8I
Xilinx Inc.

IC PROM PROG I-TEMP 5V 8-DIP

  • Programmable Type: OTP
  • Memory Size: 400kb
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: 8-DIP (0.300", 7.62mm)
  • Supplier Device Package: 8-PDIP
pacchetto: 8-DIP (0.300", 7.62mm)
Azione3.472
hot XC17S100AVO8I
Xilinx Inc.

IC PROM SER 10K 8-SOIC

  • Programmable Type: OTP
  • Memory Size: 1Mb
  • Voltage - Supply: 3 V ~ 3.6 V
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: 8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 8-TSOP
pacchetto: 8-SOIC (0.154", 3.90mm Width)
Azione126.300
hot XC18V01PCG20C
Xilinx Inc.

IC PROM SERIAL CONFIG 1M 20-PLCC

  • Programmable Type: In System Programmable
  • Memory Size: 1Mb
  • Voltage - Supply: 3 V ~ 3.6 V
  • Operating Temperature: 0°C ~ 70°C
  • Package / Case: 20-LCC (J-Lead)
  • Supplier Device Package: 20-PLCC (9x9)
pacchetto: 20-LCC (J-Lead)
Azione4.256
XCZU11EG-2FFVF1517E
Xilinx Inc.

IC FPGA 464 I/O 1517FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 653K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
pacchetto: 1517-BBGA, FCBGA
Azione7.152
XCZU6CG-2FFVB1156E
Xilinx Inc.

XCZU6CG-2FFVB1156E

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 533MHz, 1.3GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 469K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
pacchetto: 1156-BBGA, FCBGA
Azione2.608
XCZU4EV-1FBVB900I
Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 192K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
pacchetto: 900-BBGA, FCBGA
Azione5.792
XCZU3CG-L2SBVA484E
Xilinx Inc.

IC FPGA 82 I/O 484FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 533MHz, 1.3GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 154K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 484-BBGA, FCBGA
  • Supplier Device Package: 484-FCBGA (19x19)
pacchetto: 484-BBGA, FCBGA
Azione6.608
XC7Z030-1FFG676I
Xilinx Inc.

IC SOC CORTEX-A9 KINTEX7 676FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 667MHz
  • Primary Attributes: Kintex?-7 FPGA, 125K Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
pacchetto: 676-BBGA, FCBGA
Azione5.072
hot XA2S200E-6FT256I
Xilinx Inc.

IC FPGA 182 I/O 256FTBGA

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 57344
  • Number of I/O: 182
  • Number of Gates: 200000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
pacchetto: 256-LBGA
Azione6.672
XC5VFX200T-1FFG1738CES
Xilinx Inc.

IC FPGA 960 I/O 1738FCBGA

  • Number of LABs/CLBs: 15360
  • Number of Logic Elements/Cells: 196608
  • Total RAM Bits: 16809984
  • Number of I/O: 960
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1738-BBGA, FCBGA
  • Supplier Device Package: 1738-FCBGA (42.5x42.5)
pacchetto: 1738-BBGA, FCBGA
Azione3.120
hot XC4013XL-3PQ160C
Xilinx Inc.

IC FPGA 129 I/O 160QFP

  • Number of LABs/CLBs: 576
  • Number of Logic Elements/Cells: 1368
  • Total RAM Bits: 18432
  • Number of I/O: 129
  • Number of Gates: 13000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 160-BQFP
  • Supplier Device Package: 160-PQFP (28x28)
pacchetto: 160-BQFP
Azione4.128
XC2VP100-6FFG1696C
Xilinx Inc.

IC FPGA 1164 I/O 1696FCBGA

  • Number of LABs/CLBs: 11024
  • Number of Logic Elements/Cells: 99216
  • Total RAM Bits: 8183808
  • Number of I/O: 1164
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1696-BBGA, FCBGA
  • Supplier Device Package: 1696-FCBGA (42.5x42.5)
pacchetto: 1696-BBGA, FCBGA
Azione4.672
hot XC7K325T-2FF676I
Xilinx Inc.

IC FPGA 400 I/O 676FCBGA

  • Number of LABs/CLBs: 25475
  • Number of Logic Elements/Cells: 326080
  • Total RAM Bits: 16404480
  • Number of I/O: 400
  • Number of Gates: -
  • Voltage - Supply: 0.97 V ~ 1.03 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
pacchetto: 676-BBGA, FCBGA
Azione6.828
XC2VP30-7FFG896C
Xilinx Inc.

IC FPGA 556 I/O 896FCBGA

  • Number of LABs/CLBs: 3424
  • Number of Logic Elements/Cells: 30816
  • Total RAM Bits: 2506752
  • Number of I/O: 556
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 896-BBGA, FCBGA
  • Supplier Device Package: 896-FCBGA (31x31)
pacchetto: 896-BBGA, FCBGA
Azione5.376
hot XC5VLX50-1FFG676I
Xilinx Inc.

IC FPGA 440 I/O 676FCBGA

  • Number of LABs/CLBs: 3600
  • Number of Logic Elements/Cells: 46080
  • Total RAM Bits: 1769472
  • Number of I/O: 440
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
pacchetto: 676-BBGA, FCBGA
Azione17.736
XQ4VFX60-DIE4058
Xilinx Inc.

IC FPGA VIRTEX-4 FX 60K DIE

  • Number of LABs/CLBs: 6320
  • Number of Logic Elements/Cells: 56880
  • Total RAM Bits: 4276224
  • Number of I/O: -
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -
  • Package / Case: Die
  • Supplier Device Package: Die
pacchetto: Die
Azione6.304
XC5VLX30-2FF324I
Xilinx Inc.

IC FPGA 220 I/O 324FBGA

  • Number of LABs/CLBs: 2400
  • Number of Logic Elements/Cells: 30720
  • Total RAM Bits: 1179648
  • Number of I/O: 220
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 324-BBGA, FCBGA
  • Supplier Device Package: 324-FCBGA (19x19)
pacchetto: 324-BBGA, FCBGA
Azione4.576
hot XC4VLX25-11SFG363I
Xilinx Inc.

IC FPGA 240 I/O 363FCBGA

  • Number of LABs/CLBs: 2688
  • Number of Logic Elements/Cells: 24192
  • Total RAM Bits: 1327104
  • Number of I/O: 240
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 363-FBGA, FCBGA
  • Supplier Device Package: 363-FCBGA (17x17)
pacchetto: 363-FBGA, FCBGA
Azione3.376
XC2VP7-5FFG896I
Xilinx Inc.

IC FPGA 396 I/O 896FCBGA

  • Number of LABs/CLBs: 1232
  • Number of Logic Elements/Cells: 11088
  • Total RAM Bits: 811008
  • Number of I/O: 396
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 896-BBGA, FCBGA
  • Supplier Device Package: 896-FCBGA (31x31)
pacchetto: 896-BBGA, FCBGA
Azione4.464
XC7A50T-3CSG325E
Xilinx Inc.

IC FPGA 150 I/O 325CSBGA

  • Number of LABs/CLBs: 4075
  • Number of Logic Elements/Cells: 52160
  • Total RAM Bits: 2764800
  • Number of I/O: 150
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 324-LFBGA, CSPBGA
  • Supplier Device Package: 325-CSBGA (15x15)
pacchetto: 324-LFBGA, CSPBGA
Azione6.224
hot XC3S1400A-5FGG676C
Xilinx Inc.

IC FPGA 502 I/O 676FBGA

  • Number of LABs/CLBs: 2816
  • Number of Logic Elements/Cells: 25344
  • Total RAM Bits: 589824
  • Number of I/O: 502
  • Number of Gates: 1400000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 676-BGA
  • Supplier Device Package: 676-FBGA (27x27)
pacchetto: 676-BGA
Azione6.012
XC7A35T-3FGG484E
Xilinx Inc.

IC FPGA 250 I/O 484FCBGA

  • Number of LABs/CLBs: 2600
  • Number of Logic Elements/Cells: 33208
  • Total RAM Bits: 1843200
  • Number of I/O: 250
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
pacchetto: 484-BBGA
Azione3.152
XC3S100E-4CP132C
Xilinx Inc.

IC FPGA 83 I/O 132CSBGA

  • Number of LABs/CLBs: 240
  • Number of Logic Elements/Cells: 2160
  • Total RAM Bits: 73728
  • Number of I/O: 83
  • Number of Gates: 100000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 132-TFBGA, CSPBGA
  • Supplier Device Package: 132-CSPBGA (8x8)
pacchetto: 132-TFBGA, CSPBGA
Azione5.840
XC95288XV-10TQ144C
Xilinx Inc.

IC CPLD 288MC 10NS 144TQFP

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 10.0ns
  • Voltage Supply - Internal: 2.37 V ~ 2.62 V
  • Number of Logic Elements/Blocks: 16
  • Number of Macrocells: 288
  • Number of Gates: 6400
  • Number of I/O: 117
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
pacchetto: 144-LQFP
Azione6.288
XC7S100-1FGGA484I
Xilinx Inc.

XC7S100-1FGGA484I

  • Number of LABs/CLBs: 8000
  • Number of Logic Elements/Cells: 102400
  • Total RAM Bits: 4423680
  • Number of I/O: 338
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-BBGA, FCBGA
  • Supplier Device Package: 484-FCBGA (23x23)
pacchetto: 484-BBGA, FCBGA
Azione7.088
XCVU13P-3FLGA2577E
Xilinx Inc.

XCVU13P-3FLGA2577E

  • Number of LABs/CLBs: 216000
  • Number of Logic Elements/Cells: 3780000
  • Total RAM Bits: 514867200
  • Number of I/O: 448
  • Number of Gates: -
  • Voltage - Supply: 0.873 V ~ 0.927 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 2577-BBGA, FCBGA
  • Supplier Device Package: 2577-FCBGA (52.5x52.5)
pacchetto: 2577-BBGA, FCBGA
Azione4.400
XCVU11P-2FLGC2104I
Xilinx Inc.

IC FPGA VIRTEX-UP 2104FCBGA

  • Number of LABs/CLBs: 162000
  • Number of Logic Elements/Cells: 2835000
  • Total RAM Bits: 396150400
  • Number of I/O: 416
  • Number of Gates: -
  • Voltage - Supply: 0.825 V ~ 0.876 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 2104-BBGA, FCBGA
  • Supplier Device Package: 2104-FCBGA (47.5x47.5)
pacchetto: 2104-BBGA, FCBGA
Azione4.592
XCVU080-H1FFVB1760E
Xilinx Inc.

IC FPGA VIRTEX-U 1760FCBGA

  • Number of LABs/CLBs: 55714
  • Number of Logic Elements/Cells: 975000
  • Total RAM Bits: 51200000
  • Number of I/O: 702
  • Number of Gates: -
  • Voltage - Supply: 0.922 V ~ 1.030 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FCBGA (42.5x42.5)
pacchetto: 1760-BBGA, FCBGA
Azione3.712