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Prodotti Xilinx Inc. - Embedded - FPGA (Field Programmable Gate Array)

Record 5.652
Pagina  185/202
Immagine
Numero di parte
Produttore
Descrizione
pacchetto
Azione
Quantità
Number of Logic Elements/Cells
Total RAM Bits
Number of I/O
Number of Gates
Voltage - Supply
Mounting Type
Operating Temperature
Package / Case
Supplier Device Package
hot XCV812E-6BG560C
Xilinx Inc.

IC FPGA 404 I/O 560MBGA

  • Number of LABs/CLBs: 4704
  • Number of Logic Elements/Cells: 21168
  • Total RAM Bits: 1146880
  • Number of I/O: 404
  • Number of Gates: 254016
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 560-LBGA, Metal
  • Supplier Device Package: 560-MBGA (42.5x42.5)
pacchetto: 560-LBGA, Metal
Azione5.184
21168
1146880
404
254016
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
560-LBGA, Metal
560-MBGA (42.5x42.5)
XCV800-6HQ240C
Xilinx Inc.

IC FPGA 166 I/O 240HQFP

  • Number of LABs/CLBs: 4704
  • Number of Logic Elements/Cells: 21168
  • Total RAM Bits: 114688
  • Number of I/O: 166
  • Number of Gates: 888439
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 240-BFQFP Exposed Pad
  • Supplier Device Package: 240-PQFP (32x32)
pacchetto: 240-BFQFP Exposed Pad
Azione5.600
21168
114688
166
888439
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
240-BFQFP Exposed Pad
240-PQFP (32x32)
hot XCV800-6FG680C
Xilinx Inc.

IC FPGA 512 I/O 680FBGA

  • Number of LABs/CLBs: 4704
  • Number of Logic Elements/Cells: 21168
  • Total RAM Bits: 114688
  • Number of I/O: 512
  • Number of Gates: 888439
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 680-LBGA Exposed Pad
  • Supplier Device Package: 680-FTEBGA (40x40)
pacchetto: 680-LBGA Exposed Pad
Azione6.464
21168
114688
512
888439
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
680-LBGA Exposed Pad
680-FTEBGA (40x40)
XCV800-6FG676C
Xilinx Inc.

IC FPGA 444 I/O 676FBGA

  • Number of LABs/CLBs: 4704
  • Number of Logic Elements/Cells: 21168
  • Total RAM Bits: 114688
  • Number of I/O: 444
  • Number of Gates: 888439
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
pacchetto: 676-BBGA, FCBGA
Azione6.688
21168
114688
444
888439
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
676-BBGA, FCBGA
676-FCBGA (27x27)
hot XCV800-6BG560C
Xilinx Inc.

IC FPGA 404 I/O 560MBGA

  • Number of LABs/CLBs: 4704
  • Number of Logic Elements/Cells: 21168
  • Total RAM Bits: 114688
  • Number of I/O: 404
  • Number of Gates: 888439
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 560-LBGA, Metal
  • Supplier Device Package: 560-MBGA (42.5x42.5)
pacchetto: 560-LBGA, Metal
Azione5.680
21168
114688
404
888439
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
560-LBGA, Metal
560-MBGA (42.5x42.5)
hot XCV800-6BG432C
Xilinx Inc.

IC FPGA 316 I/O 432MBGA

  • Number of LABs/CLBs: 4704
  • Number of Logic Elements/Cells: 21168
  • Total RAM Bits: 114688
  • Number of I/O: 316
  • Number of Gates: 888439
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 432-LBGA, Metal
  • Supplier Device Package: 432-MBGA (40x40)
pacchetto: 432-LBGA, Metal
Azione3.984
21168
114688
316
888439
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
432-LBGA, Metal
432-MBGA (40x40)
hot XCV800-5HQ240I
Xilinx Inc.

IC FPGA 166 I/O 240HQFP

  • Number of LABs/CLBs: 4704
  • Number of Logic Elements/Cells: 21168
  • Total RAM Bits: 114688
  • Number of I/O: 166
  • Number of Gates: 888439
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 240-BFQFP Exposed Pad
  • Supplier Device Package: 240-PQFP (32x32)
pacchetto: 240-BFQFP Exposed Pad
Azione4.256
21168
114688
166
888439
2.375 V ~ 2.625 V
Surface Mount
-40°C ~ 100°C (TJ)
240-BFQFP Exposed Pad
240-PQFP (32x32)
hot XCV800-5HQ240C
Xilinx Inc.

IC FPGA 166 I/O 240HQFP

  • Number of LABs/CLBs: 4704
  • Number of Logic Elements/Cells: 21168
  • Total RAM Bits: 114688
  • Number of I/O: 166
  • Number of Gates: 888439
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 240-BFQFP Exposed Pad
  • Supplier Device Package: 240-PQFP (32x32)
pacchetto: 240-BFQFP Exposed Pad
Azione22.200
21168
114688
166
888439
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
240-BFQFP Exposed Pad
240-PQFP (32x32)
XCV800-5FG680I
Xilinx Inc.

IC FPGA 512 I/O 680FBGA

  • Number of LABs/CLBs: 4704
  • Number of Logic Elements/Cells: 21168
  • Total RAM Bits: 114688
  • Number of I/O: 512
  • Number of Gates: 888439
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 680-LBGA Exposed Pad
  • Supplier Device Package: 680-FTEBGA (40x40)
pacchetto: 680-LBGA Exposed Pad
Azione4.784
21168
114688
512
888439
2.375 V ~ 2.625 V
Surface Mount
-40°C ~ 100°C (TJ)
680-LBGA Exposed Pad
680-FTEBGA (40x40)
XCV800-5FG680C
Xilinx Inc.

IC FPGA 512 I/O 680FBGA

  • Number of LABs/CLBs: 4704
  • Number of Logic Elements/Cells: 21168
  • Total RAM Bits: 114688
  • Number of I/O: 512
  • Number of Gates: 888439
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 680-LBGA Exposed Pad
  • Supplier Device Package: 680-FTEBGA (40x40)
pacchetto: 680-LBGA Exposed Pad
Azione3.648
21168
114688
512
888439
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
680-LBGA Exposed Pad
680-FTEBGA (40x40)
hot XCV800-5FG676I
Xilinx Inc.

IC FPGA 444 I/O 676FBGA

  • Number of LABs/CLBs: 4704
  • Number of Logic Elements/Cells: 21168
  • Total RAM Bits: 114688
  • Number of I/O: 444
  • Number of Gates: 888439
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
pacchetto: 676-BBGA, FCBGA
Azione7.808
21168
114688
444
888439
2.375 V ~ 2.625 V
Surface Mount
-40°C ~ 100°C (TJ)
676-BBGA, FCBGA
676-FCBGA (27x27)
XCV800-5FG676C
Xilinx Inc.

IC FPGA 444 I/O 676FBGA

  • Number of LABs/CLBs: 4704
  • Number of Logic Elements/Cells: 21168
  • Total RAM Bits: 114688
  • Number of I/O: 444
  • Number of Gates: 888439
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
pacchetto: 676-BBGA, FCBGA
Azione5.600
21168
114688
444
888439
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
676-BBGA, FCBGA
676-FCBGA (27x27)
hot XCV800-5BG560I
Xilinx Inc.

IC FPGA 404 I/O 560MBGA

  • Number of LABs/CLBs: 4704
  • Number of Logic Elements/Cells: 21168
  • Total RAM Bits: 114688
  • Number of I/O: 404
  • Number of Gates: 888439
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 560-LBGA, Metal
  • Supplier Device Package: 560-MBGA (42.5x42.5)
pacchetto: 560-LBGA, Metal
Azione5.056
21168
114688
404
888439
2.375 V ~ 2.625 V
Surface Mount
-40°C ~ 100°C (TJ)
560-LBGA, Metal
560-MBGA (42.5x42.5)
hot XCV800-5BG560C
Xilinx Inc.

IC FPGA 404 I/O 560MBGA

  • Number of LABs/CLBs: 4704
  • Number of Logic Elements/Cells: 21168
  • Total RAM Bits: 114688
  • Number of I/O: 404
  • Number of Gates: 888439
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 560-LBGA, Metal
  • Supplier Device Package: 560-MBGA (42.5x42.5)
pacchetto: 560-LBGA, Metal
Azione4.784
21168
114688
404
888439
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
560-LBGA, Metal
560-MBGA (42.5x42.5)
XCV800-5BG432I
Xilinx Inc.

IC FPGA 316 I/O 432MBGA

  • Number of LABs/CLBs: 4704
  • Number of Logic Elements/Cells: 21168
  • Total RAM Bits: 114688
  • Number of I/O: 316
  • Number of Gates: 888439
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 432-LBGA, Metal
  • Supplier Device Package: 432-MBGA (40x40)
pacchetto: 432-LBGA, Metal
Azione3.408
21168
114688
316
888439
2.375 V ~ 2.625 V
Surface Mount
-40°C ~ 100°C (TJ)
432-LBGA, Metal
432-MBGA (40x40)
hot XCV800-5BG432C
Xilinx Inc.

IC FPGA 316 I/O 432MBGA

  • Number of LABs/CLBs: 4704
  • Number of Logic Elements/Cells: 21168
  • Total RAM Bits: 114688
  • Number of I/O: 316
  • Number of Gates: 888439
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 432-LBGA, Metal
  • Supplier Device Package: 432-MBGA (40x40)
pacchetto: 432-LBGA, Metal
Azione8.928
21168
114688
316
888439
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
432-LBGA, Metal
432-MBGA (40x40)
hot XCV800-4HQ240I
Xilinx Inc.

IC FPGA 166 I/O 240HQFP

  • Number of LABs/CLBs: 4704
  • Number of Logic Elements/Cells: 21168
  • Total RAM Bits: 114688
  • Number of I/O: 166
  • Number of Gates: 888439
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 240-BFQFP Exposed Pad
  • Supplier Device Package: 240-PQFP (32x32)
pacchetto: 240-BFQFP Exposed Pad
Azione5.664
21168
114688
166
888439
2.375 V ~ 2.625 V
Surface Mount
-40°C ~ 100°C (TJ)
240-BFQFP Exposed Pad
240-PQFP (32x32)
hot XCV800-4HQ240C
Xilinx Inc.

IC FPGA 166 I/O 240HQFP

  • Number of LABs/CLBs: 4704
  • Number of Logic Elements/Cells: 21168
  • Total RAM Bits: 114688
  • Number of I/O: 166
  • Number of Gates: 888439
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 240-BFQFP Exposed Pad
  • Supplier Device Package: 240-PQFP (32x32)
pacchetto: 240-BFQFP Exposed Pad
Azione6.176
21168
114688
166
888439
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
240-BFQFP Exposed Pad
240-PQFP (32x32)
XCV800-4FG680I
Xilinx Inc.

IC FPGA 512 I/O 680FBGA

  • Number of LABs/CLBs: 4704
  • Number of Logic Elements/Cells: 21168
  • Total RAM Bits: 114688
  • Number of I/O: 512
  • Number of Gates: 888439
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 680-LBGA Exposed Pad
  • Supplier Device Package: 680-FTEBGA (40x40)
pacchetto: 680-LBGA Exposed Pad
Azione7.584
21168
114688
512
888439
2.375 V ~ 2.625 V
Surface Mount
-40°C ~ 100°C (TJ)
680-LBGA Exposed Pad
680-FTEBGA (40x40)
XCV800-4FG680C
Xilinx Inc.

IC FPGA 512 I/O 680FBGA

  • Number of LABs/CLBs: 4704
  • Number of Logic Elements/Cells: 21168
  • Total RAM Bits: 114688
  • Number of I/O: 512
  • Number of Gates: 888439
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 680-LBGA Exposed Pad
  • Supplier Device Package: 680-FTEBGA (40x40)
pacchetto: 680-LBGA Exposed Pad
Azione2.080
21168
114688
512
888439
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
680-LBGA Exposed Pad
680-FTEBGA (40x40)
XCV800-4FG676I
Xilinx Inc.

IC FPGA 444 I/O 676FBGA

  • Number of LABs/CLBs: 4704
  • Number of Logic Elements/Cells: 21168
  • Total RAM Bits: 114688
  • Number of I/O: 444
  • Number of Gates: 888439
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
pacchetto: 676-BBGA, FCBGA
Azione3.232
21168
114688
444
888439
2.375 V ~ 2.625 V
Surface Mount
-40°C ~ 100°C (TJ)
676-BBGA, FCBGA
676-FCBGA (27x27)
hot XCV800-4FG676C
Xilinx Inc.

IC FPGA 444 I/O 676FBGA

  • Number of LABs/CLBs: 4704
  • Number of Logic Elements/Cells: 21168
  • Total RAM Bits: 114688
  • Number of I/O: 444
  • Number of Gates: 888439
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
pacchetto: 676-BBGA, FCBGA
Azione5.104
21168
114688
444
888439
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
676-BBGA, FCBGA
676-FCBGA (27x27)
XCV800-4BG560I
Xilinx Inc.

IC FPGA 404 I/O 560MBGA

  • Number of LABs/CLBs: 4704
  • Number of Logic Elements/Cells: 21168
  • Total RAM Bits: 114688
  • Number of I/O: 404
  • Number of Gates: 888439
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 560-LBGA, Metal
  • Supplier Device Package: 560-MBGA (42.5x42.5)
pacchetto: 560-LBGA, Metal
Azione3.408
21168
114688
404
888439
2.375 V ~ 2.625 V
Surface Mount
-40°C ~ 100°C (TJ)
560-LBGA, Metal
560-MBGA (42.5x42.5)
hot XCV800-4BG560C
Xilinx Inc.

IC FPGA 404 I/O 560MBGA

  • Number of LABs/CLBs: 4704
  • Number of Logic Elements/Cells: 21168
  • Total RAM Bits: 114688
  • Number of I/O: 404
  • Number of Gates: 888439
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 560-LBGA, Metal
  • Supplier Device Package: 560-MBGA (42.5x42.5)
pacchetto: 560-LBGA, Metal
Azione9.180
21168
114688
404
888439
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
560-LBGA, Metal
560-MBGA (42.5x42.5)
hot XCV800-4BG432I
Xilinx Inc.

IC FPGA 316 I/O 432MBGA

  • Number of LABs/CLBs: 4704
  • Number of Logic Elements/Cells: 21168
  • Total RAM Bits: 114688
  • Number of I/O: 316
  • Number of Gates: 888439
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 432-LBGA, Metal
  • Supplier Device Package: 432-MBGA (40x40)
pacchetto: 432-LBGA, Metal
Azione3.888
21168
114688
316
888439
2.375 V ~ 2.625 V
Surface Mount
-40°C ~ 100°C (TJ)
432-LBGA, Metal
432-MBGA (40x40)
hot XCV800-4BG432C
Xilinx Inc.

IC FPGA 316 I/O 432MBGA

  • Number of LABs/CLBs: 4704
  • Number of Logic Elements/Cells: 21168
  • Total RAM Bits: 114688
  • Number of I/O: 316
  • Number of Gates: 888439
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 432-LBGA, Metal
  • Supplier Device Package: 432-MBGA (40x40)
pacchetto: 432-LBGA, Metal
Azione9.696
21168
114688
316
888439
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
432-LBGA, Metal
432-MBGA (40x40)
XCV600E-8HQ240C
Xilinx Inc.

IC FPGA 158 I/O 240HQFP

  • Number of LABs/CLBs: 3456
  • Number of Logic Elements/Cells: 15552
  • Total RAM Bits: 294912
  • Number of I/O: 158
  • Number of Gates: 985882
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 240-BFQFP Exposed Pad
  • Supplier Device Package: 240-PQFP (32x32)
pacchetto: 240-BFQFP Exposed Pad
Azione3.984
15552
294912
158
985882
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
240-BFQFP Exposed Pad
240-PQFP (32x32)
XCV600E-8FG900C
Xilinx Inc.

IC FPGA 512 I/O 900FBGA

  • Number of LABs/CLBs: 3456
  • Number of Logic Elements/Cells: 15552
  • Total RAM Bits: 294912
  • Number of I/O: 512
  • Number of Gates: 985882
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 900-BBGA
  • Supplier Device Package: 900-FBGA (31x31)
pacchetto: 900-BBGA
Azione5.424
15552
294912
512
985882
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
900-BBGA
900-FBGA (31x31)