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Prodotti Xilinx Inc. - Embedded - FPGA (Field Programmable Gate Array)

Record 5.652
Pagina  177/202
Immagine
Numero di parte
Produttore
Descrizione
pacchetto
Azione
Quantità
Number of Logic Elements/Cells
Total RAM Bits
Number of I/O
Number of Gates
Voltage - Supply
Mounting Type
Operating Temperature
Package / Case
Supplier Device Package
XCV200E-7PQ240I
Xilinx Inc.

IC FPGA 158 I/O 240QFP

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 114688
  • Number of I/O: 158
  • Number of Gates: 306393
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 240-BFQFP
  • Supplier Device Package: 240-PQFP (32x32)
pacchetto: 240-BFQFP
Azione3.728
5292
114688
158
306393
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
240-BFQFP
240-PQFP (32x32)
XCV200E-7PQ240C
Xilinx Inc.

IC FPGA 158 I/O 240QFP

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 114688
  • Number of I/O: 158
  • Number of Gates: 306393
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 240-BFQFP
  • Supplier Device Package: 240-PQFP (32x32)
pacchetto: 240-BFQFP
Azione3.200
5292
114688
158
306393
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
240-BFQFP
240-PQFP (32x32)
XCV200E-7FG456I
Xilinx Inc.

IC FPGA 284 I/O 456FBGA

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 114688
  • Number of I/O: 284
  • Number of Gates: 306393
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 456-BBGA
  • Supplier Device Package: 456-FBGA (23x23)
pacchetto: 456-BBGA
Azione4.656
5292
114688
284
306393
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
456-BBGA
456-FBGA (23x23)
hot XCV200E-7FG456C
Xilinx Inc.

IC FPGA 284 I/O 456FBGA

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 114688
  • Number of I/O: 284
  • Number of Gates: 306393
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 456-BBGA
  • Supplier Device Package: 456-FBGA (23x23)
pacchetto: 456-BBGA
Azione6.368
5292
114688
284
306393
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
456-BBGA
456-FBGA (23x23)
hot XCV200E-7FG256I
Xilinx Inc.

IC FPGA 176 I/O 256FBGA

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 114688
  • Number of I/O: 176
  • Number of Gates: 306393
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
pacchetto: 256-BGA
Azione9.612
5292
114688
176
306393
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
256-BGA
256-FBGA (17x17)
hot XCV200E-7FG256C
Xilinx Inc.

IC FPGA 176 I/O 256FBGA

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 114688
  • Number of I/O: 176
  • Number of Gates: 306393
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
pacchetto: 256-BGA
Azione13.764
5292
114688
176
306393
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
256-BGA
256-FBGA (17x17)
XCV200E-7CS144I
Xilinx Inc.

IC FPGA 94 I/O 144CSBGA

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 114688
  • Number of I/O: 94
  • Number of Gates: 306393
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 144-TFBGA, CSPBGA
  • Supplier Device Package: 144-LCSBGA (12x12)
pacchetto: 144-TFBGA, CSPBGA
Azione2.880
5292
114688
94
306393
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
144-TFBGA, CSPBGA
144-LCSBGA (12x12)
XCV200E-7CS144C
Xilinx Inc.

IC FPGA 94 I/O 144CSBGA

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 114688
  • Number of I/O: 94
  • Number of Gates: 306393
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 144-TFBGA, CSPBGA
  • Supplier Device Package: 144-LCSBGA (12x12)
pacchetto: 144-TFBGA, CSPBGA
Azione5.600
5292
114688
94
306393
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
144-TFBGA, CSPBGA
144-LCSBGA (12x12)
XCV200E-7BG352I
Xilinx Inc.

IC FPGA 260 I/O 352MBGA

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 114688
  • Number of I/O: 260
  • Number of Gates: 306393
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 352-LBGA, Metal
  • Supplier Device Package: 352-MBGA (35x35)
pacchetto: 352-LBGA, Metal
Azione7.168
5292
114688
260
306393
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
352-LBGA, Metal
352-MBGA (35x35)
hot XCV200E-7BG352C
Xilinx Inc.

IC FPGA 260 I/O 352MBGA

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 114688
  • Number of I/O: 260
  • Number of Gates: 306393
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 352-LBGA, Metal
  • Supplier Device Package: 352-MBGA (35x35)
pacchetto: 352-LBGA, Metal
Azione6.288
5292
114688
260
306393
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
352-LBGA, Metal
352-MBGA (35x35)
XCV200E-6PQ240I
Xilinx Inc.

IC FPGA 158 I/O 240QFP

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 114688
  • Number of I/O: 158
  • Number of Gates: 306393
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 240-BFQFP
  • Supplier Device Package: 240-PQFP (32x32)
pacchetto: 240-BFQFP
Azione7.472
5292
114688
158
306393
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
240-BFQFP
240-PQFP (32x32)
hot XCV200E-6PQ240C
Xilinx Inc.

IC FPGA 158 I/O 240QFP

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 114688
  • Number of I/O: 158
  • Number of Gates: 306393
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 240-BFQFP
  • Supplier Device Package: 240-PQFP (32x32)
pacchetto: 240-BFQFP
Azione15.696
5292
114688
158
306393
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
240-BFQFP
240-PQFP (32x32)
hot XCV200E-6FG456I
Xilinx Inc.

IC FPGA 284 I/O 456FBGA

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 114688
  • Number of I/O: 284
  • Number of Gates: 306393
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 456-BBGA
  • Supplier Device Package: 456-FBGA (23x23)
pacchetto: 456-BBGA
Azione3.760
5292
114688
284
306393
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
456-BBGA
456-FBGA (23x23)
hot XCV200E-6FG456C
Xilinx Inc.

IC FPGA 284 I/O 456FBGA

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 114688
  • Number of I/O: 284
  • Number of Gates: 306393
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 456-BBGA
  • Supplier Device Package: 456-FBGA (23x23)
pacchetto: 456-BBGA
Azione12.552
5292
114688
284
306393
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
456-BBGA
456-FBGA (23x23)
hot XCV200E-6FG256I
Xilinx Inc.

IC FPGA 176 I/O 256FBGA

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 114688
  • Number of I/O: 176
  • Number of Gates: 306393
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
pacchetto: 256-BGA
Azione5.248
5292
114688
176
306393
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
256-BGA
256-FBGA (17x17)
hot XCV200E-6FG256C
Xilinx Inc.

IC FPGA 176 I/O 256FBGA

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 114688
  • Number of I/O: 176
  • Number of Gates: 306393
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
pacchetto: 256-BGA
Azione18.552
5292
114688
176
306393
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
256-BGA
256-FBGA (17x17)
XCV200E-6CS144I
Xilinx Inc.

IC FPGA 94 I/O 144CSBGA

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 114688
  • Number of I/O: 94
  • Number of Gates: 306393
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 144-TFBGA, CSPBGA
  • Supplier Device Package: 144-LCSBGA (12x12)
pacchetto: 144-TFBGA, CSPBGA
Azione4.800
5292
114688
94
306393
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
144-TFBGA, CSPBGA
144-LCSBGA (12x12)
XCV200E-6CS144C
Xilinx Inc.

IC FPGA 94 I/O 144CSBGA

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 114688
  • Number of I/O: 94
  • Number of Gates: 306393
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 144-TFBGA, CSPBGA
  • Supplier Device Package: 144-LCSBGA (12x12)
pacchetto: 144-TFBGA, CSPBGA
Azione7.728
5292
114688
94
306393
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
144-TFBGA, CSPBGA
144-LCSBGA (12x12)
hot XCV200E-6BG352C
Xilinx Inc.

IC FPGA 260 I/O 352MBGA

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 114688
  • Number of I/O: 260
  • Number of Gates: 306393
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 352-LBGA, Metal
  • Supplier Device Package: 352-MBGA (35x35)
pacchetto: 352-LBGA, Metal
Azione7.792
5292
114688
260
306393
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
352-LBGA, Metal
352-MBGA (35x35)
hot XCV2000E-8FG860C
Xilinx Inc.

IC FPGA 660 I/O 860FBGA

  • Number of LABs/CLBs: 9600
  • Number of Logic Elements/Cells: 43200
  • Total RAM Bits: 655360
  • Number of I/O: 660
  • Number of Gates: 2541952
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 860-BGA
  • Supplier Device Package: 860-FBGA (42.5x42.5)
pacchetto: 860-BGA
Azione3.616
43200
655360
660
2541952
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
860-BGA
860-FBGA (42.5x42.5)
XCV2000E-8FG680C
Xilinx Inc.

IC FPGA 512 I/O 680FBGA

  • Number of LABs/CLBs: 9600
  • Number of Logic Elements/Cells: 43200
  • Total RAM Bits: 655360
  • Number of I/O: 512
  • Number of Gates: 2541952
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 680-LBGA Exposed Pad
  • Supplier Device Package: 680-FTEBGA (40x40)
pacchetto: 680-LBGA Exposed Pad
Azione2.400
43200
655360
512
2541952
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
680-LBGA Exposed Pad
680-FTEBGA (40x40)
hot XCV2000E-8FG1156C
Xilinx Inc.

IC FPGA 804 I/O 1156FBGA

  • Number of LABs/CLBs: 9600
  • Number of Logic Elements/Cells: 43200
  • Total RAM Bits: 655360
  • Number of I/O: 804
  • Number of Gates: 2541952
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1156-BBGA
  • Supplier Device Package: 1156-FBGA (35x35)
pacchetto: 1156-BBGA
Azione7.360
43200
655360
804
2541952
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
1156-BBGA
1156-FBGA (35x35)
hot XCV2000E-8BG560C
Xilinx Inc.

IC FPGA 404 I/O 560MBGA

  • Number of LABs/CLBs: 9600
  • Number of Logic Elements/Cells: 43200
  • Total RAM Bits: 655360
  • Number of I/O: 404
  • Number of Gates: 2541952
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 560-LBGA, Metal
  • Supplier Device Package: 560-MBGA (42.5x42.5)
pacchetto: 560-LBGA, Metal
Azione7.136
43200
655360
404
2541952
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
560-LBGA, Metal
560-MBGA (42.5x42.5)
XCV2000E-7FG860I
Xilinx Inc.

IC FPGA 660 I/O 860FBGA

  • Number of LABs/CLBs: 9600
  • Number of Logic Elements/Cells: 43200
  • Total RAM Bits: 655360
  • Number of I/O: 660
  • Number of Gates: 2541952
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 860-BGA
  • Supplier Device Package: 860-FBGA (42.5x42.5)
pacchetto: 860-BGA
Azione6.528
43200
655360
660
2541952
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
860-BGA
860-FBGA (42.5x42.5)
XCV2000E-7FG860C
Xilinx Inc.

IC FPGA 660 I/O 860FBGA

  • Number of LABs/CLBs: 9600
  • Number of Logic Elements/Cells: 43200
  • Total RAM Bits: 655360
  • Number of I/O: 660
  • Number of Gates: 2541952
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 860-BGA
  • Supplier Device Package: 860-FBGA (42.5x42.5)
pacchetto: 860-BGA
Azione2.608
43200
655360
660
2541952
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
860-BGA
860-FBGA (42.5x42.5)
XCV2000E-7FG680I
Xilinx Inc.

IC FPGA 512 I/O 680FBGA

  • Number of LABs/CLBs: 9600
  • Number of Logic Elements/Cells: 43200
  • Total RAM Bits: 655360
  • Number of I/O: 512
  • Number of Gates: 2541952
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 680-LBGA Exposed Pad
  • Supplier Device Package: 680-FTEBGA (40x40)
pacchetto: 680-LBGA Exposed Pad
Azione4.432
43200
655360
512
2541952
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
680-LBGA Exposed Pad
680-FTEBGA (40x40)
hot XCV2000E-7FG680C
Xilinx Inc.

IC FPGA 512 I/O 680FBGA

  • Number of LABs/CLBs: 9600
  • Number of Logic Elements/Cells: 43200
  • Total RAM Bits: 655360
  • Number of I/O: 512
  • Number of Gates: 2541952
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 680-LBGA Exposed Pad
  • Supplier Device Package: 680-FTEBGA (40x40)
pacchetto: 680-LBGA Exposed Pad
Azione5.504
43200
655360
512
2541952
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
680-LBGA Exposed Pad
680-FTEBGA (40x40)
hot XCV2000E-7FG1156I
Xilinx Inc.

IC FPGA 804 I/O 1156FBGA

  • Number of LABs/CLBs: 9600
  • Number of Logic Elements/Cells: 43200
  • Total RAM Bits: 655360
  • Number of I/O: 804
  • Number of Gates: 2541952
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA
  • Supplier Device Package: 1156-FBGA (35x35)
pacchetto: 1156-BBGA
Azione10.164
43200
655360
804
2541952
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
1156-BBGA
1156-FBGA (35x35)