Pagina 172 - Prodotti Xilinx Inc. - Embedded - FPGA (Field Programmable Gate Array) | Heisener Electronics
Contattaci
SalesDept@heisener.com 86-755-83210559-827
Accesso/Registrati
Language Translation

* Please refer to the English Version as our Official Version.

BOM
Carrello 0

Prodotti Xilinx Inc. - Embedded - FPGA (Field Programmable Gate Array)

Record 5.652
Pagina  172/202
Immagine
Numero di parte
Produttore
Descrizione
pacchetto
Azione
Quantità
Number of Logic Elements/Cells
Total RAM Bits
Number of I/O
Number of Gates
Voltage - Supply
Mounting Type
Operating Temperature
Package / Case
Supplier Device Package
XCV1000E-7HQ240I
Xilinx Inc.

IC FPGA 158 I/O 240HQFP

  • Number of LABs/CLBs: 6144
  • Number of Logic Elements/Cells: 27648
  • Total RAM Bits: 393216
  • Number of I/O: 158
  • Number of Gates: 1569178
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 240-BFQFP Exposed Pad
  • Supplier Device Package: 240-PQFP (32x32)
pacchetto: 240-BFQFP Exposed Pad
Azione2.912
27648
393216
158
1569178
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
240-BFQFP Exposed Pad
240-PQFP (32x32)
XCV1000E-7HQ240C
Xilinx Inc.

IC FPGA 158 I/O 240HQFP

  • Number of LABs/CLBs: 6144
  • Number of Logic Elements/Cells: 27648
  • Total RAM Bits: 393216
  • Number of I/O: 158
  • Number of Gates: 1569178
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 240-BFQFP Exposed Pad
  • Supplier Device Package: 240-PQFP (32x32)
pacchetto: 240-BFQFP Exposed Pad
Azione4.608
27648
393216
158
1569178
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
240-BFQFP Exposed Pad
240-PQFP (32x32)
XCV1000E-7FG900I
Xilinx Inc.

IC FPGA 660 I/O 900FGBA

  • Number of LABs/CLBs: 6144
  • Number of Logic Elements/Cells: 27648
  • Total RAM Bits: 393216
  • Number of I/O: 660
  • Number of Gates: 1569178
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA
  • Supplier Device Package: 900-FBGA (31x31)
pacchetto: 900-BBGA
Azione4.016
27648
393216
660
1569178
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
900-BBGA
900-FBGA (31x31)
XCV1000E-7FG900C
Xilinx Inc.

IC FPGA 660 I/O 900FGBA

  • Number of LABs/CLBs: 6144
  • Number of Logic Elements/Cells: 27648
  • Total RAM Bits: 393216
  • Number of I/O: 660
  • Number of Gates: 1569178
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 900-BBGA
  • Supplier Device Package: 900-FBGA (31x31)
pacchetto: 900-BBGA
Azione5.328
27648
393216
660
1569178
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
900-BBGA
900-FBGA (31x31)
XCV1000E-7FG860I
Xilinx Inc.

IC FPGA 660 I/O 860FGBA

  • Number of LABs/CLBs: 6144
  • Number of Logic Elements/Cells: 27648
  • Total RAM Bits: 393216
  • Number of I/O: 660
  • Number of Gates: 1569178
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 860-BGA
  • Supplier Device Package: 860-FBGA (42.5x42.5)
pacchetto: 860-BGA
Azione5.936
27648
393216
660
1569178
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
860-BGA
860-FBGA (42.5x42.5)
XCV1000E-7FG860C
Xilinx Inc.

IC FPGA 660 I/O 860FGBA

  • Number of LABs/CLBs: 6144
  • Number of Logic Elements/Cells: 27648
  • Total RAM Bits: 393216
  • Number of I/O: 660
  • Number of Gates: 1569178
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 860-BGA
  • Supplier Device Package: 860-FBGA (42.5x42.5)
pacchetto: 860-BGA
Azione4.144
27648
393216
660
1569178
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
860-BGA
860-FBGA (42.5x42.5)
hot XCV1000E-7FG680I
Xilinx Inc.

IC FPGA 512 I/O 680FBGA

  • Number of LABs/CLBs: 6144
  • Number of Logic Elements/Cells: 27648
  • Total RAM Bits: 393216
  • Number of I/O: 512
  • Number of Gates: 1569178
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 680-LBGA Exposed Pad
  • Supplier Device Package: 680-FTEBGA (40x40)
pacchetto: 680-LBGA Exposed Pad
Azione6.276
27648
393216
512
1569178
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
680-LBGA Exposed Pad
680-FTEBGA (40x40)
hot XCV1000E-7FG680C
Xilinx Inc.

IC FPGA 512 I/O 680FBGA

  • Number of LABs/CLBs: 6144
  • Number of Logic Elements/Cells: 27648
  • Total RAM Bits: 393216
  • Number of I/O: 512
  • Number of Gates: 1569178
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 680-LBGA Exposed Pad
  • Supplier Device Package: 680-FTEBGA (40x40)
pacchetto: 680-LBGA Exposed Pad
Azione5.824
27648
393216
512
1569178
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
680-LBGA Exposed Pad
680-FTEBGA (40x40)
XCV1000E-7FG1156I
Xilinx Inc.

IC FPGA 660 I/O 1156FBGA

  • Number of LABs/CLBs: 6144
  • Number of Logic Elements/Cells: 27648
  • Total RAM Bits: 393216
  • Number of I/O: 660
  • Number of Gates: 1569178
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA
  • Supplier Device Package: 1156-FBGA (35x35)
pacchetto: 1156-BBGA
Azione7.488
27648
393216
660
1569178
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
1156-BBGA
1156-FBGA (35x35)
XCV1000E-7FG1156C
Xilinx Inc.

IC FPGA 660 I/O 1156FBGA

  • Number of LABs/CLBs: 6144
  • Number of Logic Elements/Cells: 27648
  • Total RAM Bits: 393216
  • Number of I/O: 660
  • Number of Gates: 1569178
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1156-BBGA
  • Supplier Device Package: 1156-FBGA (35x35)
pacchetto: 1156-BBGA
Azione3.024
27648
393216
660
1569178
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
1156-BBGA
1156-FBGA (35x35)
XCV1000E-7BG560I
Xilinx Inc.

IC FPGA 404 I/O 560MBGA

  • Number of LABs/CLBs: 6144
  • Number of Logic Elements/Cells: 27648
  • Total RAM Bits: 393216
  • Number of I/O: 404
  • Number of Gates: 1569178
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 560-LBGA, Metal
  • Supplier Device Package: 560-MBGA (42.5x42.5)
pacchetto: 560-LBGA, Metal
Azione6.032
27648
393216
404
1569178
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
560-LBGA, Metal
560-MBGA (42.5x42.5)
XCV1000E-7BG560C
Xilinx Inc.

IC FPGA 404 I/O 560MBGA

  • Number of LABs/CLBs: 6144
  • Number of Logic Elements/Cells: 27648
  • Total RAM Bits: 393216
  • Number of I/O: 404
  • Number of Gates: 1569178
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 560-LBGA, Metal
  • Supplier Device Package: 560-MBGA (42.5x42.5)
pacchetto: 560-LBGA, Metal
Azione4.800
27648
393216
404
1569178
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
560-LBGA, Metal
560-MBGA (42.5x42.5)
XCV1000E-6HQ240I
Xilinx Inc.

IC FPGA 158 I/O 240HQFP

  • Number of LABs/CLBs: 6144
  • Number of Logic Elements/Cells: 27648
  • Total RAM Bits: 393216
  • Number of I/O: 158
  • Number of Gates: 1569178
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 240-BFQFP Exposed Pad
  • Supplier Device Package: 240-PQFP (32x32)
pacchetto: 240-BFQFP Exposed Pad
Azione5.216
27648
393216
158
1569178
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
240-BFQFP Exposed Pad
240-PQFP (32x32)
hot XCV1000E-6HQ240C
Xilinx Inc.

IC FPGA 158 I/O 240HQFP

  • Number of LABs/CLBs: 6144
  • Number of Logic Elements/Cells: 27648
  • Total RAM Bits: 393216
  • Number of I/O: 158
  • Number of Gates: 1569178
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 240-BFQFP Exposed Pad
  • Supplier Device Package: 240-PQFP (32x32)
pacchetto: 240-BFQFP Exposed Pad
Azione6.432
27648
393216
158
1569178
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
240-BFQFP Exposed Pad
240-PQFP (32x32)
XCV1000E-6FG900I
Xilinx Inc.

IC FPGA 660 I/O 900FGBA

  • Number of LABs/CLBs: 6144
  • Number of Logic Elements/Cells: 27648
  • Total RAM Bits: 393216
  • Number of I/O: 660
  • Number of Gates: 1569178
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA
  • Supplier Device Package: 900-FBGA (31x31)
pacchetto: 900-BBGA
Azione5.056
27648
393216
660
1569178
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
900-BBGA
900-FBGA (31x31)
XCV1000E-6FG900C
Xilinx Inc.

IC FPGA 660 I/O 900FGBA

  • Number of LABs/CLBs: 6144
  • Number of Logic Elements/Cells: 27648
  • Total RAM Bits: 393216
  • Number of I/O: 660
  • Number of Gates: 1569178
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 900-BBGA
  • Supplier Device Package: 900-FBGA (31x31)
pacchetto: 900-BBGA
Azione7.440
27648
393216
660
1569178
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
900-BBGA
900-FBGA (31x31)
XCV1000E-6FG860I
Xilinx Inc.

IC FPGA 660 I/O 860FGBA

  • Number of LABs/CLBs: 6144
  • Number of Logic Elements/Cells: 27648
  • Total RAM Bits: 393216
  • Number of I/O: 660
  • Number of Gates: 1569178
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 860-BGA
  • Supplier Device Package: 860-FBGA (42.5x42.5)
pacchetto: 860-BGA
Azione3.296
27648
393216
660
1569178
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
860-BGA
860-FBGA (42.5x42.5)
hot XCV1000E-6FG860C
Xilinx Inc.

IC FPGA 660 I/O 860FGBA

  • Number of LABs/CLBs: 6144
  • Number of Logic Elements/Cells: 27648
  • Total RAM Bits: 393216
  • Number of I/O: 660
  • Number of Gates: 1569178
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 860-BGA
  • Supplier Device Package: 860-FBGA (42.5x42.5)
pacchetto: 860-BGA
Azione4.032
27648
393216
660
1569178
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
860-BGA
860-FBGA (42.5x42.5)
hot XCV1000E-6FG680I
Xilinx Inc.

IC FPGA 512 I/O 680FBGA

  • Number of LABs/CLBs: 6144
  • Number of Logic Elements/Cells: 27648
  • Total RAM Bits: 393216
  • Number of I/O: 512
  • Number of Gates: 1569178
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 680-LBGA Exposed Pad
  • Supplier Device Package: 680-FTEBGA (40x40)
pacchetto: 680-LBGA Exposed Pad
Azione4.048
27648
393216
512
1569178
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
680-LBGA Exposed Pad
680-FTEBGA (40x40)
hot XCV1000E-6FG680C
Xilinx Inc.

IC FPGA 512 I/O 680FBGA

  • Number of LABs/CLBs: 6144
  • Number of Logic Elements/Cells: 27648
  • Total RAM Bits: 393216
  • Number of I/O: 512
  • Number of Gates: 1569178
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 680-LBGA Exposed Pad
  • Supplier Device Package: 680-FTEBGA (40x40)
pacchetto: 680-LBGA Exposed Pad
Azione9.312
27648
393216
512
1569178
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
680-LBGA Exposed Pad
680-FTEBGA (40x40)
XCV1000E-6FG1156I
Xilinx Inc.

IC FPGA 660 I/O 1156FBGA

  • Number of LABs/CLBs: 6144
  • Number of Logic Elements/Cells: 27648
  • Total RAM Bits: 393216
  • Number of I/O: 660
  • Number of Gates: 1569178
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA
  • Supplier Device Package: 1156-FBGA (35x35)
pacchetto: 1156-BBGA
Azione7.008
27648
393216
660
1569178
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
1156-BBGA
1156-FBGA (35x35)
hot XCV1000E-6FG1156C
Xilinx Inc.

IC FPGA 660 I/O 1156FBGA

  • Number of LABs/CLBs: 6144
  • Number of Logic Elements/Cells: 27648
  • Total RAM Bits: 393216
  • Number of I/O: 660
  • Number of Gates: 1569178
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1156-BBGA
  • Supplier Device Package: 1156-FBGA (35x35)
pacchetto: 1156-BBGA
Azione5.488
27648
393216
660
1569178
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
1156-BBGA
1156-FBGA (35x35)
XCV1000E-6BG560I
Xilinx Inc.

IC FPGA 404 I/O 560MBGA

  • Number of LABs/CLBs: 6144
  • Number of Logic Elements/Cells: 27648
  • Total RAM Bits: 393216
  • Number of I/O: 404
  • Number of Gates: 1569178
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 560-LBGA, Metal
  • Supplier Device Package: 560-MBGA (42.5x42.5)
pacchetto: 560-LBGA, Metal
Azione2.240
27648
393216
404
1569178
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
560-LBGA, Metal
560-MBGA (42.5x42.5)
hot XCV1000E-6BG560C
Xilinx Inc.

IC FPGA 404 I/O 560MBGA

  • Number of LABs/CLBs: 6144
  • Number of Logic Elements/Cells: 27648
  • Total RAM Bits: 393216
  • Number of I/O: 404
  • Number of Gates: 1569178
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 560-LBGA, Metal
  • Supplier Device Package: 560-MBGA (42.5x42.5)
pacchetto: 560-LBGA, Metal
Azione3.680
27648
393216
404
1569178
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
560-LBGA, Metal
560-MBGA (42.5x42.5)
hot XCV1000-6FG680C
Xilinx Inc.

IC FPGA 512 I/O 680FBGA

  • Number of LABs/CLBs: 6144
  • Number of Logic Elements/Cells: 27648
  • Total RAM Bits: 131072
  • Number of I/O: 512
  • Number of Gates: 1124022
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 680-LBGA Exposed Pad
  • Supplier Device Package: 680-FTEBGA (40x40)
pacchetto: 680-LBGA Exposed Pad
Azione4.304
27648
131072
512
1124022
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
680-LBGA Exposed Pad
680-FTEBGA (40x40)
XCV1000-6BG560C
Xilinx Inc.

IC FPGA 404 I/O 560MBGA

  • Number of LABs/CLBs: 6144
  • Number of Logic Elements/Cells: 27648
  • Total RAM Bits: 131072
  • Number of I/O: 404
  • Number of Gates: 1124022
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 560-LBGA, Metal
  • Supplier Device Package: 560-MBGA (42.5x42.5)
pacchetto: 560-LBGA, Metal
Azione6.416
27648
131072
404
1124022
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
560-LBGA, Metal
560-MBGA (42.5x42.5)
XCV1000-5FG680I
Xilinx Inc.

IC FPGA 512 I/O 680FBGA

  • Number of LABs/CLBs: 6144
  • Number of Logic Elements/Cells: 27648
  • Total RAM Bits: 131072
  • Number of I/O: 512
  • Number of Gates: 1124022
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 680-LBGA Exposed Pad
  • Supplier Device Package: 680-FTEBGA (40x40)
pacchetto: 680-LBGA Exposed Pad
Azione4.080
27648
131072
512
1124022
2.375 V ~ 2.625 V
Surface Mount
-40°C ~ 100°C (TJ)
680-LBGA Exposed Pad
680-FTEBGA (40x40)
hot XCV1000-5FG680C
Xilinx Inc.

IC FPGA 512 I/O 680FBGA

  • Number of LABs/CLBs: 6144
  • Number of Logic Elements/Cells: 27648
  • Total RAM Bits: 131072
  • Number of I/O: 512
  • Number of Gates: 1124022
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 680-LBGA Exposed Pad
  • Supplier Device Package: 680-FTEBGA (40x40)
pacchetto: 680-LBGA Exposed Pad
Azione6.396
27648
131072
512
1124022
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
680-LBGA Exposed Pad
680-FTEBGA (40x40)