Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Logic Elements/Cells | Total RAM Bits | Number of I/O | Number of Gates | Voltage - Supply | Mounting Type | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Xilinx Inc. |
IC FPGA 77 I/O 100VQFP
|
pacchetto: 100-TQFP |
Azione14.748 |
|
238 | 3200 | 77 | 5000 | 3 V ~ 3.6 V | Surface Mount | 0°C ~ 85°C (TJ) | 100-TQFP | 100-VQFP (14x14) |
||
Xilinx Inc. |
IC FPGA 61 I/O 84PLCC
|
pacchetto: 84-LCC (J-Lead) |
Azione17.712 |
|
238 | 3200 | 61 | 5000 | 3 V ~ 3.6 V | Surface Mount | 0°C ~ 85°C (TJ) | 84-LCC (J-Lead) | 84-PLCC (29.31x29.31) |
||
Xilinx Inc. |
IC FPGA 77 I/O 100VQFP
|
pacchetto: 100-TQFP |
Azione11.472 |
|
238 | 3200 | 77 | 5000 | 4.75 V ~ 5.25 V | Surface Mount | 0°C ~ 85°C (TJ) | 100-TQFP | 100-VQFP (14x14) |
||
Xilinx Inc. |
IC FPGA 61 I/O 84PLCC
|
pacchetto: 84-LCC (J-Lead) |
Azione6.400 |
|
238 | 3200 | 61 | 5000 | 4.75 V ~ 5.25 V | Surface Mount | 0°C ~ 85°C (TJ) | 84-LCC (J-Lead) | 84-PLCC (29.31x29.31) |
||
Xilinx Inc. |
IC FPGA 77 I/O 100VQFP
|
pacchetto: 100-TQFP |
Azione15.900 |
|
238 | 3200 | 77 | 5000 | 4.5 V ~ 5.5 V | Surface Mount | -40°C ~ 100°C (TJ) | 100-TQFP | 100-VQFP (14x14) |
||
Xilinx Inc. |
IC FPGA 77 I/O 100VQFP
|
pacchetto: 100-TQFP |
Azione5.952 |
|
238 | 3200 | 77 | 5000 | 4.75 V ~ 5.25 V | Surface Mount | 0°C ~ 85°C (TJ) | 100-TQFP | 100-VQFP (14x14) |
||
Xilinx Inc. |
IC FPGA 61 I/O 84PLCC
|
pacchetto: 84-LCC (J-Lead) |
Azione24.144 |
|
238 | 3200 | 61 | 5000 | 4.75 V ~ 5.25 V | Surface Mount | 0°C ~ 85°C (TJ) | 84-LCC (J-Lead) | 84-PLCC (29.31x29.31) |
||
Xilinx Inc. |
IC FPGA 448 I/O 560MBGA
|
pacchetto: 560-LBGA, Metal |
Azione5.920 |
|
7448 | 100352 | 448 | 85000 | 3 V ~ 3.6 V | Surface Mount | -40°C ~ 100°C (TJ) | 560-LBGA, Metal | 560-MBGA (42.5x42.5) |
||
Xilinx Inc. |
IC FPGA 448 I/O 560MBGA
|
pacchetto: 560-LBGA, Metal |
Azione7.472 |
|
7448 | 100352 | 448 | 85000 | 3 V ~ 3.6 V | Surface Mount | 0°C ~ 85°C (TJ) | 560-LBGA, Metal | 560-MBGA (42.5x42.5) |
||
Xilinx Inc. |
IC FPGA 352 I/O 432MBGA
|
pacchetto: 432-LBGA, Metal |
Azione7.632 |
|
7448 | 100352 | 352 | 85000 | 3 V ~ 3.6 V | Surface Mount | -40°C ~ 100°C (TJ) | 432-LBGA, Metal | 432-MBGA (40x40) |
||
Xilinx Inc. |
IC FPGA 352 I/O 432MBGA
|
pacchetto: 432-LBGA, Metal |
Azione7.200 |
|
7448 | 100352 | 352 | 85000 | 3 V ~ 3.6 V | Surface Mount | 0°C ~ 85°C (TJ) | 432-LBGA, Metal | 432-MBGA (40x40) |
||
Xilinx Inc. |
IC FPGA 448 I/O 560MBGA
|
pacchetto: 560-LBGA, Metal |
Azione4.656 |
|
7448 | 100352 | 448 | 85000 | 3 V ~ 3.6 V | Surface Mount | -40°C ~ 100°C (TJ) | 560-LBGA, Metal | 560-MBGA (42.5x42.5) |
||
Xilinx Inc. |
IC FPGA 448 I/O 560MBGA
|
pacchetto: 560-LBGA, Metal |
Azione4.368 |
|
7448 | 100352 | 448 | 85000 | 3 V ~ 3.6 V | Surface Mount | 0°C ~ 85°C (TJ) | 560-LBGA, Metal | 560-MBGA (42.5x42.5) |
||
Xilinx Inc. |
IC FPGA 352 I/O 432MBGA
|
pacchetto: 432-LBGA, Metal |
Azione7.536 |
|
7448 | 100352 | 352 | 85000 | 3 V ~ 3.6 V | Surface Mount | -40°C ~ 100°C (TJ) | 432-LBGA, Metal | 432-MBGA (40x40) |
||
Xilinx Inc. |
IC FPGA 352 I/O 432MBGA
|
pacchetto: 432-LBGA, Metal |
Azione2.752 |
|
7448 | 100352 | 352 | 85000 | 3 V ~ 3.6 V | Surface Mount | 0°C ~ 85°C (TJ) | 432-LBGA, Metal | 432-MBGA (40x40) |
||
Xilinx Inc. |
IC FPGA 448 I/O 560MBGA
|
pacchetto: 560-LBGA, Metal |
Azione6.288 |
|
7448 | 100352 | 448 | 85000 | 3 V ~ 3.6 V | Surface Mount | -40°C ~ 100°C (TJ) | 560-LBGA, Metal | 560-MBGA (42.5x42.5) |
||
Xilinx Inc. |
IC FPGA 448 I/O 560MBGA
|
pacchetto: 560-LBGA, Metal |
Azione6.048 |
|
7448 | 100352 | 448 | 85000 | 3 V ~ 3.6 V | Surface Mount | 0°C ~ 85°C (TJ) | 560-LBGA, Metal | 560-MBGA (42.5x42.5) |
||
Xilinx Inc. |
IC FPGA 352 I/O 432MBGA
|
pacchetto: 432-LBGA, Metal |
Azione7.648 |
|
7448 | 100352 | 352 | 85000 | 3 V ~ 3.6 V | Surface Mount | -40°C ~ 100°C (TJ) | 432-LBGA, Metal | 432-MBGA (40x40) |
||
Xilinx Inc. |
IC FPGA 352 I/O 432MBGA
|
pacchetto: 432-LBGA, Metal |
Azione7.376 |
|
7448 | 100352 | 352 | 85000 | 3 V ~ 3.6 V | Surface Mount | 0°C ~ 85°C (TJ) | 432-LBGA, Metal | 432-MBGA (40x40) |
||
Xilinx Inc. |
IC FPGA 448 I/O 560MBGA
|
pacchetto: 560-LBGA, Metal |
Azione3.264 |
|
7448 | 100352 | 448 | 85000 | 3 V ~ 3.6 V | Surface Mount | 0°C ~ 85°C (TJ) | 560-LBGA, Metal | 560-MBGA (42.5x42.5) |
||
Xilinx Inc. |
IC FPGA 352 I/O 432MBGA
|
pacchetto: 432-LBGA, Metal |
Azione4.976 |
|
7448 | 100352 | 352 | 85000 | 3 V ~ 3.6 V | Surface Mount | 0°C ~ 85°C (TJ) | 432-LBGA, Metal | 432-MBGA (40x40) |
||
Xilinx Inc. |
IC FPGA 256 I/O 304HQFP
|
pacchetto: 304-BFQFP Exposed Pad |
Azione3.312 |
|
5472 | 73728 | 256 | 62000 | 3 V ~ 3.6 V | Surface Mount | -40°C ~ 100°C (TJ) | 304-BFQFP Exposed Pad | 304-PQFP (40x40) |
||
Xilinx Inc. |
IC FPGA 256 I/O 304HQFP
|
pacchetto: 304-BFQFP Exposed Pad |
Azione3.232 |
|
5472 | 73728 | 256 | 62000 | 3 V ~ 3.6 V | Surface Mount | 0°C ~ 85°C (TJ) | 304-BFQFP Exposed Pad | 304-PQFP (40x40) |
||
Xilinx Inc. |
IC FPGA 193 I/O 240HQFP
|
pacchetto: 240-BFQFP Exposed Pad |
Azione4.496 |
|
5472 | 73728 | 193 | 62000 | 3 V ~ 3.6 V | Surface Mount | -40°C ~ 100°C (TJ) | 240-BFQFP Exposed Pad | 240-PQFP (32x32) |
||
Xilinx Inc. |
IC FPGA 193 I/O 240HQFP
|
pacchetto: 240-BFQFP Exposed Pad |
Azione10.344 |
|
5472 | 73728 | 193 | 62000 | 3 V ~ 3.6 V | Surface Mount | 0°C ~ 85°C (TJ) | 240-BFQFP Exposed Pad | 240-PQFP (32x32) |
||
Xilinx Inc. |
IC FPGA 384 I/O 560MBGA
|
pacchetto: 560-LBGA, Metal |
Azione4.080 |
|
5472 | 73728 | 384 | 62000 | 3 V ~ 3.6 V | Surface Mount | -40°C ~ 100°C (TJ) | 560-LBGA, Metal | 560-MBGA (42.5x42.5) |
||
Xilinx Inc. |
IC FPGA 384 I/O 560MBGA
|
pacchetto: 560-LBGA, Metal |
Azione4.400 |
|
5472 | 73728 | 384 | 62000 | 3 V ~ 3.6 V | Surface Mount | 0°C ~ 85°C (TJ) | 560-LBGA, Metal | 560-MBGA (42.5x42.5) |
||
Xilinx Inc. |
IC FPGA 352 I/O 432MBGA
|
pacchetto: 432-LBGA, Metal |
Azione4.496 |
|
5472 | 73728 | 352 | 62000 | 3 V ~ 3.6 V | Surface Mount | -40°C ~ 100°C (TJ) | 432-LBGA, Metal | 432-MBGA (40x40) |