Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Logic Elements/Cells | Total RAM Bits | Number of I/O | Number of Gates | Voltage - Supply | Mounting Type | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Xilinx Inc. |
IC FPGA 256 I/O 352MBGA
|
pacchetto: 352-LBGA, Metal |
Azione4.432 |
|
2432 | 32768 | 256 | 28000 | 3 V ~ 3.6 V | Surface Mount | 0°C ~ 85°C (TJ) | 352-LBGA, Metal | 352-MBGA (35x35) |
||
Xilinx Inc. |
IC FPGA 205 I/O 256BGA
|
pacchetto: 256-BBGA |
Azione6.288 |
|
2432 | 32768 | 205 | 28000 | 3 V ~ 3.6 V | Surface Mount | -40°C ~ 100°C (TJ) | 256-BBGA | 256-PBGA (27x27) |
||
Xilinx Inc. |
IC FPGA 205 I/O 256BGA
|
pacchetto: 256-BBGA |
Azione4.128 |
|
2432 | 32768 | 205 | 28000 | 3 V ~ 3.6 V | Surface Mount | 0°C ~ 85°C (TJ) | 256-BBGA | 256-PBGA (27x27) |
||
Xilinx Inc. |
IC FPGA 256 I/O 304HQFP
|
pacchetto: 304-BFQFP Exposed Pad |
Azione4.768 |
|
2432 | 32768 | 256 | 28000 | 3 V ~ 3.6 V | Surface Mount | 0°C ~ 85°C (TJ) | 304-BFQFP Exposed Pad | 304-PQFP (40x40) |
||
Xilinx Inc. |
IC FPGA 193 I/O 240HQFP
|
pacchetto: 240-BFQFP Exposed Pad |
Azione2.336 |
|
2432 | 32768 | 193 | 28000 | 3 V ~ 3.6 V | Surface Mount | 0°C ~ 85°C (TJ) | 240-BFQFP Exposed Pad | 240-PQFP (32x32) |
||
Xilinx Inc. |
IC FPGA 160 I/O 208HQFP
|
pacchetto: 208-BFQFP Exposed Pad |
Azione7.936 |
|
2432 | 32768 | 160 | 28000 | 3 V ~ 3.6 V | Surface Mount | 0°C ~ 85°C (TJ) | 208-BFQFP Exposed Pad | 208-PQFP (28x28) |
||
Xilinx Inc. |
IC FPGA 129 I/O 160HQFP
|
pacchetto: 160-BQFP Exposed Pad |
Azione6.480 |
|
2432 | 32768 | 129 | 28000 | 3 V ~ 3.6 V | Surface Mount | 0°C ~ 85°C (TJ) | 160-BQFP Exposed Pad | 160-PQFP (28x28) |
||
Xilinx Inc. |
IC FPGA 256 I/O 352MBGA
|
pacchetto: 352-LBGA, Metal |
Azione4.288 |
|
2432 | 32768 | 256 | 28000 | 3 V ~ 3.6 V | Surface Mount | 0°C ~ 85°C (TJ) | 352-LBGA, Metal | 352-MBGA (35x35) |
||
Xilinx Inc. |
IC FPGA 205 I/O 256BGA
|
pacchetto: 256-BBGA |
Azione5.312 |
|
2432 | 32768 | 205 | 28000 | 3 V ~ 3.6 V | Surface Mount | 0°C ~ 85°C (TJ) | 256-BBGA | 256-PBGA (27x27) |
||
Xilinx Inc. |
IC FPGA 256 I/O 299CPGA
|
pacchetto: 299-BCPGA |
Azione3.136 |
|
2432 | 32768 | 256 | 25000 | 4.5 V ~ 5.5 V | Through Hole | -40°C ~ 100°C (TJ) | 299-BCPGA | 299-CPGA (52.3x52.3) |
||
Xilinx Inc. |
IC FPGA 256 I/O 299CPGA
|
pacchetto: 299-BCPGA |
Azione3.568 |
|
2432 | 32768 | 256 | 25000 | 4.75 V ~ 5.25 V | Through Hole | 0°C ~ 85°C (TJ) | 299-BCPGA | 299-CPGA (52.3x52.3) |
||
Xilinx Inc. |
IC FPGA 192 I/O 223CPGA
|
pacchetto: 223-BCPGA |
Azione5.776 |
|
2432 | 32768 | 192 | 25000 | 4.5 V ~ 5.5 V | Through Hole | -40°C ~ 100°C (TJ) | 223-BCPGA | 223-CPGA (47.25x47.25) |
||
Xilinx Inc. |
IC FPGA 192 I/O 223CPGA
|
pacchetto: 223-BCPGA |
Azione5.136 |
|
2432 | 32768 | 192 | 25000 | 4.75 V ~ 5.25 V | Through Hole | 0°C ~ 85°C (TJ) | 223-BCPGA | 223-CPGA (47.25x47.25) |
||
Xilinx Inc. |
IC FPGA 256 I/O 304HQFP
|
pacchetto: 304-BFQFP Exposed Pad |
Azione6.368 |
|
2432 | 32768 | 256 | 25000 | 4.5 V ~ 5.5 V | Surface Mount | -40°C ~ 100°C (TJ) | 304-BFQFP Exposed Pad | 304-PQFP (40x40) |
||
Xilinx Inc. |
IC FPGA 256 I/O 304HQFP
|
pacchetto: 304-BFQFP Exposed Pad |
Azione5.552 |
|
2432 | 32768 | 256 | 25000 | 4.75 V ~ 5.25 V | Surface Mount | 0°C ~ 85°C (TJ) | 304-BFQFP Exposed Pad | 304-PQFP (40x40) |
||
Xilinx Inc. |
IC FPGA 193 I/O 240HQFP
|
pacchetto: 240-BFQFP Exposed Pad |
Azione3.312 |
|
2432 | 32768 | 193 | 25000 | 4.5 V ~ 5.5 V | Surface Mount | -40°C ~ 100°C (TJ) | 240-BFQFP Exposed Pad | 240-PQFP (32x32) |
||
Xilinx Inc. |
IC FPGA 193 I/O 240HQFP
|
pacchetto: 240-BFQFP Exposed Pad |
Azione3.808 |
|
2432 | 32768 | 193 | 25000 | 4.75 V ~ 5.25 V | Surface Mount | 0°C ~ 85°C (TJ) | 240-BFQFP Exposed Pad | 240-PQFP (32x32) |
||
Xilinx Inc. |
IC FPGA 256 I/O 299CPGA
|
pacchetto: 299-BCPGA |
Azione6.720 |
|
2432 | 32768 | 256 | 25000 | 4.5 V ~ 5.5 V | Through Hole | -40°C ~ 100°C (TJ) | 299-BCPGA | 299-CPGA (52.3x52.3) |
||
Xilinx Inc. |
IC FPGA 256 I/O 299CPGA
|
pacchetto: 299-BCPGA |
Azione6.256 |
|
2432 | 32768 | 256 | 25000 | 4.75 V ~ 5.25 V | Through Hole | 0°C ~ 85°C (TJ) | 299-BCPGA | 299-CPGA (52.3x52.3) |
||
Xilinx Inc. |
IC FPGA 192 I/O 223CPGA
|
pacchetto: 223-BCPGA |
Azione6.240 |
|
2432 | 32768 | 192 | 25000 | 4.5 V ~ 5.5 V | Through Hole | -40°C ~ 100°C (TJ) | 223-BCPGA | 223-CPGA (47.25x47.25) |
||
Xilinx Inc. |
IC FPGA 192 I/O 223CPGA
|
pacchetto: 223-BCPGA |
Azione7.840 |
|
2432 | 32768 | 192 | 25000 | 4.75 V ~ 5.25 V | Through Hole | 0°C ~ 85°C (TJ) | 223-BCPGA | 223-CPGA (47.25x47.25) |
||
Xilinx Inc. |
IC FPGA 256 I/O 304HQFP
|
pacchetto: 304-BFQFP Exposed Pad |
Azione2.048 |
|
2432 | 32768 | 256 | 25000 | 4.5 V ~ 5.5 V | Surface Mount | -40°C ~ 100°C (TJ) | 304-BFQFP Exposed Pad | 304-PQFP (40x40) |
||
Xilinx Inc. |
IC FPGA 256 I/O 304HQFP
|
pacchetto: 304-BFQFP Exposed Pad |
Azione7.424 |
|
2432 | 32768 | 256 | 25000 | 4.75 V ~ 5.25 V | Surface Mount | 0°C ~ 85°C (TJ) | 304-BFQFP Exposed Pad | 304-PQFP (40x40) |
||
Xilinx Inc. |
IC FPGA 193 I/O 240QFP
|
pacchetto: 240-BFQFP Exposed Pad |
Azione5.424 |
|
2432 | 32768 | 193 | 25000 | 4.5 V ~ 5.5 V | Surface Mount | -40°C ~ 100°C (TJ) | 240-BFQFP Exposed Pad | 240-PQFP (32x32) |
||
Xilinx Inc. |
IC FPGA 256 I/O 299CPGA
|
pacchetto: 299-BCPGA |
Azione4.176 |
|
2432 | 32768 | 256 | 25000 | 4.75 V ~ 5.25 V | Through Hole | 0°C ~ 85°C (TJ) | 299-BCPGA | 299-CPGA (52.3x52.3) |
||
Xilinx Inc. |
IC FPGA 192 I/O 223CPGA
|
pacchetto: 223-BCPGA |
Azione6.480 |
|
2432 | 32768 | 192 | 25000 | 4.75 V ~ 5.25 V | Through Hole | 0°C ~ 85°C (TJ) | 223-BCPGA | 223-CPGA (47.25x47.25) |
||
Xilinx Inc. |
IC FPGA 256 I/O 304HQFP
|
pacchetto: 304-BFQFP Exposed Pad |
Azione6.256 |
|
2432 | 32768 | 256 | 25000 | 4.75 V ~ 5.25 V | Surface Mount | 0°C ~ 85°C (TJ) | 304-BFQFP Exposed Pad | 304-PQFP (40x40) |
||
Xilinx Inc. |
IC FPGA 192 I/O 240QFP
|
pacchetto: 240-BFQFP |
Azione4.992 |
|
1862 | 25088 | 192 | 20000 | 3 V ~ 3.6 V | Surface Mount | -40°C ~ 100°C (TJ) | 240-BFQFP | 240-PQFP (32x32) |