Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Logic Elements/Cells | Total RAM Bits | Number of I/O | Number of Gates | Voltage - Supply | Mounting Type | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Xilinx Inc. |
IC FPGA 160 I/O 208QFP
|
pacchetto: 208-BFQFP |
Azione7.520 |
|
1368 | 18432 | 160 | 13000 | 3 V ~ 3.6 V | Surface Mount | -40°C ~ 100°C (TJ) | 208-BFQFP | 208-PQFP (28x28) |
||
Xilinx Inc. |
IC FPGA 160 I/O 208QFP
|
pacchetto: 208-BFQFP |
Azione4.912 |
|
1368 | 18432 | 160 | 13000 | 3 V ~ 3.6 V | Surface Mount | 0°C ~ 85°C (TJ) | 208-BFQFP | 208-PQFP (28x28) |
||
Xilinx Inc. |
IC FPGA 129 I/O 160QFP
|
pacchetto: 160-BQFP |
Azione7.792 |
|
1368 | 18432 | 129 | 13000 | 3 V ~ 3.6 V | Surface Mount | -40°C ~ 100°C (TJ) | 160-BQFP | 160-PQFP (28x28) |
||
Xilinx Inc. |
IC FPGA 129 I/O 160QFP
|
pacchetto: 160-BQFP |
Azione6.032 |
|
1368 | 18432 | 129 | 13000 | 3 V ~ 3.6 V | Surface Mount | 0°C ~ 85°C (TJ) | 160-BQFP | 160-PQFP (28x28) |
||
Xilinx Inc. |
IC FPGA 145 I/O 176HTQFP
|
pacchetto: 176-LQFP Exposed Pad |
Azione5.664 |
|
1368 | 18432 | 145 | 13000 | 3 V ~ 3.6 V | Surface Mount | -40°C ~ 100°C (TJ) | 176-LQFP Exposed Pad | 176-TQFP (24x24) |
||
Xilinx Inc. |
IC FPGA 145 I/O 176HTQFP
|
pacchetto: 176-LQFP Exposed Pad |
Azione5.312 |
|
1368 | 18432 | 145 | 13000 | 3 V ~ 3.6 V | Surface Mount | 0°C ~ 85°C (TJ) | 176-LQFP Exposed Pad | 176-TQFP (24x24) |
||
Xilinx Inc. |
IC FPGA 113 I/O 144HQFP
|
pacchetto: 144-LQFP Exposed Pad |
Azione5.040 |
|
1368 | 18432 | 113 | 13000 | 3 V ~ 3.6 V | Surface Mount | -40°C ~ 100°C (TJ) | 144-LQFP Exposed Pad | 144-TQFP (20x20) |
||
Xilinx Inc. |
IC FPGA 113 I/O 144HQFP
|
pacchetto: 144-LQFP Exposed Pad |
Azione4.608 |
|
1368 | 18432 | 113 | 13000 | 3 V ~ 3.6 V | Surface Mount | 0°C ~ 85°C (TJ) | 144-LQFP Exposed Pad | 144-TQFP (20x20) |
||
Xilinx Inc. |
IC FPGA 192 I/O 256BGA
|
pacchetto: 256-BBGA |
Azione2.016 |
|
1368 | 18432 | 192 | 13000 | 3 V ~ 3.6 V | Surface Mount | -40°C ~ 100°C (TJ) | 256-BBGA | 256-PBGA (27x27) |
||
Xilinx Inc. |
IC FPGA 192 I/O 256BGA
|
pacchetto: 256-BBGA |
Azione18.180 |
|
1368 | 18432 | 192 | 13000 | 3 V ~ 3.6 V | Surface Mount | 0°C ~ 85°C (TJ) | 256-BBGA | 256-PBGA (27x27) |
||
Xilinx Inc. |
IC FPGA 192 I/O 240QFP
|
pacchetto: 240-BFQFP |
Azione7.280 |
|
1368 | 18432 | 192 | 13000 | 3 V ~ 3.6 V | Surface Mount | 0°C ~ 85°C (TJ) | 240-BFQFP | 240-PQFP (32x32) |
||
Xilinx Inc. |
IC FPGA 160 I/O 208QFP
|
pacchetto: 208-BFQFP |
Azione5.024 |
|
1368 | 18432 | 160 | 13000 | 3 V ~ 3.6 V | Surface Mount | 0°C ~ 85°C (TJ) | 208-BFQFP | 208-PQFP (28x28) |
||
Xilinx Inc. |
IC FPGA 129 I/O 160QFP
|
pacchetto: 160-BQFP |
Azione5.136 |
|
1368 | 18432 | 129 | 13000 | 3 V ~ 3.6 V | Surface Mount | 0°C ~ 85°C (TJ) | 160-BQFP | 160-PQFP (28x28) |
||
Xilinx Inc. |
IC FPGA 145 I/O 176HTQFP
|
pacchetto: 176-LQFP Exposed Pad |
Azione4.896 |
|
1368 | 18432 | 145 | 13000 | 3 V ~ 3.6 V | Surface Mount | 0°C ~ 85°C (TJ) | 176-LQFP Exposed Pad | 176-TQFP (24x24) |
||
Xilinx Inc. |
IC FPGA 113 I/O 144HQFP
|
pacchetto: 144-LQFP Exposed Pad |
Azione6.352 |
|
1368 | 18432 | 113 | 13000 | 3 V ~ 3.6 V | Surface Mount | 0°C ~ 85°C (TJ) | 144-LQFP Exposed Pad | 144-TQFP (20x20) |
||
Xilinx Inc. |
IC FPGA 192 I/O 256BGA
|
pacchetto: 256-BBGA |
Azione5.744 |
|
1368 | 18432 | 192 | 13000 | 3 V ~ 3.6 V | Surface Mount | 0°C ~ 85°C (TJ) | 256-BBGA | 256-PBGA (27x27) |
||
Xilinx Inc. |
IC FPGA 192 I/O 240QFP
|
pacchetto: 240-BFQFP |
Azione5.952 |
|
1368 | 18432 | 192 | 13000 | 4.5 V ~ 5.5 V | Surface Mount | -40°C ~ 100°C (TJ) | 240-BFQFP | 240-PQFP (32x32) |
||
Xilinx Inc. |
IC FPGA 192 I/O 240QFP
|
pacchetto: 240-BFQFP |
Azione5.664 |
|
1368 | 18432 | 192 | 13000 | 4.75 V ~ 5.25 V | Surface Mount | 0°C ~ 85°C (TJ) | 240-BFQFP | 240-PQFP (32x32) |
||
Xilinx Inc. |
IC FPGA 160 I/O 208QFP
|
pacchetto: 208-BFQFP |
Azione7.680 |
|
1368 | 18432 | 160 | 13000 | 4.5 V ~ 5.5 V | Surface Mount | -40°C ~ 100°C (TJ) | 208-BFQFP | 208-PQFP (28x28) |
||
Xilinx Inc. |
IC FPGA 129 I/O 160QFP
|
pacchetto: 160-BQFP |
Azione15.312 |
|
1368 | 18432 | 129 | 13000 | 4.5 V ~ 5.5 V | Surface Mount | -40°C ~ 100°C (TJ) | 160-BQFP | 160-PQFP (28x28) |
||
Xilinx Inc. |
IC FPGA 192 I/O 223CPGA
|
pacchetto: 223-BCPGA |
Azione6.708 |
|
1368 | 18432 | 192 | 13000 | 4.5 V ~ 5.5 V | Through Hole | -40°C ~ 100°C (TJ) | 223-BCPGA | 223-CPGA (47.25x47.25) |
||
Xilinx Inc. |
IC FPGA 192 I/O 223CPGA
|
pacchetto: 223-BCPGA |
Azione5.648 |
|
1368 | 18432 | 192 | 13000 | 4.75 V ~ 5.25 V | Through Hole | 0°C ~ 85°C (TJ) | 223-BCPGA | 223-CPGA (47.25x47.25) |
||
Xilinx Inc. |
IC FPGA 192 I/O 240HQFP
|
pacchetto: 240-BFQFP Exposed Pad |
Azione5.856 |
|
1368 | 18432 | 192 | 13000 | 4.5 V ~ 5.5 V | Surface Mount | -40°C ~ 100°C (TJ) | 240-BFQFP Exposed Pad | 240-PQFP (32x32) |
||
Xilinx Inc. |
IC FPGA 192 I/O 240HQFP
|
pacchetto: 240-BFQFP Exposed Pad |
Azione5.520 |
|
1368 | 18432 | 192 | 13000 | 4.75 V ~ 5.25 V | Surface Mount | 0°C ~ 85°C (TJ) | 240-BFQFP Exposed Pad | 240-PQFP (32x32) |
||
Xilinx Inc. |
IC FPGA 160 I/O 208HQFP
|
pacchetto: 208-BFQFP Exposed Pad |
Azione4.016 |
|
1368 | 18432 | 160 | 13000 | 4.5 V ~ 5.5 V | Surface Mount | -40°C ~ 100°C (TJ) | 208-BFQFP Exposed Pad | 208-PQFP (28x28) |
||
Xilinx Inc. |
IC FPGA 160 I/O 208HQFP
|
pacchetto: 208-BFQFP Exposed Pad |
Azione7.568 |
|
1368 | 18432 | 160 | 13000 | 4.75 V ~ 5.25 V | Surface Mount | 0°C ~ 85°C (TJ) | 208-BFQFP Exposed Pad | 208-PQFP (28x28) |
||
Xilinx Inc. |
IC FPGA 192 I/O 225BGA
|
pacchetto: 225-BBGA |
Azione4.112 |
|
1368 | 18432 | 192 | 13000 | 4.5 V ~ 5.5 V | Surface Mount | -40°C ~ 100°C (TJ) | 225-BBGA | 225-PBGA (27x27) |
||
Xilinx Inc. |
IC FPGA 192 I/O 225BGA
|
pacchetto: 225-BBGA |
Azione7.168 |
|
1368 | 18432 | 192 | 13000 | 4.75 V ~ 5.25 V | Surface Mount | 0°C ~ 85°C (TJ) | 225-BBGA | 225-PBGA (27x27) |