Prodotti NXP

PBSS2540E,115

NXP

TRANS NPN 40V 0.5A SC75

• Transistor Type: NPN
• Current - Collector (Ic) (Max): 500mA
• Voltage - Collector Emitter Breakdown (Max): 40V
• Vce Saturation (Max) @ Ib, Ic: 250mV @ 50mA, 500mA
• Current - Collector Cutoff (Max): 100nA (ICBO)
• DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 100mA, 2V
• Power - Max: 250mW
• Frequency - Transition: 450MHz
• Operating Temperature: 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SC-75, SOT-416
• Supplier Device Package: SC-75

pacchetto: SC-75, SOT-416

PZM11NB2A,115

NXP

DIODE ZENER 11V 220MW SMT3

• Voltage - Zener (Nom) (Vz): 11V
• Tolerance: ±2%
• Power - Max: 220mW
• Impedance (Max) (Zzt): 10 Ohms
• Current - Reverse Leakage @ Vr: 100nA @ 8V
• Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: SMT3; MPAK

pacchetto: TO-236-3, SC-59, SOT-23-3

SC16C654BIEC,528

NXP

IC QUAD UART 64BYTE 64LFBGA

• Features: -
• Number of Channels: 4, QUART
• FIFO's: 64 Byte
• Protocol: -
• Data Rate (Max): 5Mbps
• Voltage - Supply: 2.5V, 3.3V, 5V
• With Auto Flow Control: Yes
• With IrDA Encoder/Decoder: Yes
• With False Start Bit Detection: Yes
• With Modem Control: Yes
• Mounting Type: Surface Mount
• Package / Case: 64-LFBGA
• Supplier Device Package: 64-LFBGA (6x6)

pacchetto: 64-LFBGA

SC16IS752IBS,128

NXP

IC UART DUAL I2C/SPI 32-HVQFN

• Protocol: RS232, RS485
• Function: Controller
• Interface: I2C, SPI, UART
• Standards: -
• Voltage - Supply: 2.5V, 3.3V
• Current - Supply: 2mA
• Operating Temperature: -40°C ~ 95°C
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-HVQFN (5x5)

pacchetto: 32-VFQFN Exposed Pad

MC8640THX1067NE

NXP

IC MPU MPC86XX 1.067GHZ 994BGA

• Core Processor: PowerPC e600
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.067GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 994-BCBGA, FCCBGA
• Supplier Device Package: 994-FCCBGA (33x33)

pacchetto: 994-BCBGA, FCCBGA

MPC8358ZUAGDG

NXP

IC MPU MPC83XX 400MHZ 740TBGA

• Core Processor: PowerPC e300
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 400MHz
• Co-Processors/DSP: Communications; QUICC Engine
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (1)
• SATA: -
• USB: USB 1.x (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 740-LBGA
• Supplier Device Package: 740-TBGA (37.5x37.5)

pacchetto: 740-LBGA

MPC8280CVVQLDA

NXP

IC MPU MPC82XX 333MHZ 408TBGA

• Core Processor: PowerPC G2_LE
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 333MHz
• Co-Processors/DSP: Communications; RISC CPM
• RAM Controllers: DRAM, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100 Mbps (3)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 480-LBGA
• Supplier Device Package: 408-TBGA (37.5x37.5)

pacchetto: 480-LBGA

SPC5673KFF0VMM1

NXP

IC MCU 32BIT 1MB FLASH 257MAPBGA

• Core Processor: e200z7d
• Core Size: 32-Bit
• Speed: 150MHz
• Connectivity: CAN, EBI/EMI, Ethernet, FlexRay, I2C, LIN, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: -
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 256K x 8
• Voltage - Supply (Vcc/Vdd): 1.14 V ~ 1.32 V
• Data Converters: A/D 22x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 257-LFBGA
• Supplier Device Package: 257-MAPBGA (14x14)

pacchetto: 257-LFBGA

MC68HC908SR12CB

NXP

IC MCU 8BIT 12KB FLASH 42PSDIP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: I2C, SCI
• Peripherals: LVD, POR, PWM, Temp Sensor
• Number of I/O: 29
• Program Memory Size: 12KB (12K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 11x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 42-SDIP (0.600", 15.24mm)
• Supplier Device Package: 42-PSDIP

pacchetto: 42-SDIP (0.600", 15.24mm)

MMC2113CFCVF33

NXP

IC MCU 32BIT 128KB FLASH 196BGA

• Core Processor: M210
• Core Size: 32-Bit
• Speed: 33MHz
• Connectivity: EBI/EMI, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 104
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 196-LBGA
• Supplier Device Package: 196-MAPBGA (15x15)

pacchetto: 196-LBGA

MK64FN1M0CAJ12R

NXP

IC MCU 32BIT 1MB FLASH 142WLCSP

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 100
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 41x16b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 142-UFBGA, WLCSP
• Supplier Device Package: 142-WLCSP (4.83x5.58)

pacchetto: 142-UFBGA, WLCSP

MK10DN512ZVMC10

NXP

IC MCU 32BIT 512KB FLASH 121BGA

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 90
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 42x16b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 121-LFBGA
• Supplier Device Package: 121-MAPBGA (8x8)

pacchetto: 121-LFBGA

MC56F8367MPYE

NXP

IC MCU 16BIT 512KB FLASH 160LQFP

• Core Processor: 56800E
• Core Size: 16-Bit
• Speed: 60MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI
• Peripherals: POR, PWM, Temp Sensor, WDT
• Number of I/O: 76
• Program Memory Size: 512KB (256K x 16)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 18K x 16
• Voltage - Supply (Vcc/Vdd): 2.25 V ~ 3.6 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 160-LQFP
• Supplier Device Package: 160-LQFP (24x24)

pacchetto: 160-LQFP

MM912F634BV1AER2

NXP

IC MCU 16BIT 32KB FLASH 48LQFP

• Applications: Automotive
• Core Processor: S12
• Program Memory Type: FLASH (32 KB)
• Controller Series: HCS12
• RAM Size: 2K x 8
• Interface: LIN, SCI
• Number of I/O: 9
• Voltage - Supply: 2.25 V ~ 5.5 V
• Operating Temperature: -40°C ~ 105°C
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-LQFP-EP (7x7)

pacchetto: 48-LQFP Exposed Pad

SPAKDSP321VL240

NXP

IC DSP 24BIT 240MHZ 196-MAPBGA

• Type: Fixed Point
• Interface: Host Interface, SSI, SCI
• Clock Rate: 240MHz
• Non-Volatile Memory: ROM (576 B)
• On-Chip RAM: 576kB
• Voltage - I/O: 3.30V
• Voltage - Core: 1.60V
• Operating Temperature: -40°C ~ 105°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 196-BGA
• Supplier Device Package: 196-MAPBGA (15x15)

pacchetto: 196-BGA

KTY82/250,215

NXP

IC TMEP SENSOR SOT23

• Resistance in Ohms @ 25°C: 2k
• Resistance Tolerance: -
• Operating Temperature: -55°C ~ 150°C
• Power - Max: -
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: TO-236AB (SOT23)

pacchetto: TO-236-3, SC-59, SOT-23-3

SX1534PKVWT1

NXP

ACCELEROMETER

• Type: -
• Axis: -
• Acceleration Range: -
• Sensitivity (LSB/g): -
• Sensitivity (mV/g): -
• Bandwidth: -
• Output Type: -
• Voltage - Supply: -
• Features: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

pacchetto: -

MMA6222EGR2

NXP

ACCELEROMETER 20G ANALOG 20SOIC

• Type: Analog
• Axis: X, Y
• Acceleration Range: ±20g
• Sensitivity (LSB/g): -
• Sensitivity (mV/g): 23.40mV/V/g
• Bandwidth: 3kHz
• Output Type: Analog Voltage
• Voltage - Supply: 3.15 V ~ 5.25 V
• Features: -
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SOIC

pacchetto: 20-SOIC (0.295", 7.50mm Width)

MFRX85201HD/D4110:

NXP

MOD SECURITY READER CUST 48HLQFN

• Type: RFID Reader
• Frequency: 13.56MHz
• Standards: ISO 14443, MIFARE
• Interface: -
• Voltage - Supply: 3.3 V ~ 5 V
• Operating Temperature: -25°C ~ 85°C
• Package / Case: 48-LFQFN Exposed Pad
• Supplier Device Package: 48-HLQFN (7x7)

pacchetto: 48-LFQFN Exposed Pad

PN5120A0HN1/C1,157

NXP

IC TRANSMISSION MOD 32-HVQFN

• Type: RFID Reader/Transponder
• Frequency: 13.56MHz
• Standards: FeliCa, ISO 14443, MIFARE, NFC
• Interface: I2C, SPI, UART
• Voltage - Supply: 2.5 V ~ 3.6 V
• Operating Temperature: -40°C ~ 90°C
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-HVQFN (5x5)

pacchetto: 32-VFQFN Exposed Pad

BGA3031X

NXP

IC MMIC 20HVQFN

• Frequency: 5MHz ~ 85MHz
• P1dB: -
• Gain: 34dB
• Noise Figure: 3.5dB
• RF Type: CATV
• Voltage - Supply: 5V
• Current - Supply: 325mA
• Test Frequency: -
• Package / Case: 20-VQFN Exposed Pad
• Supplier Device Package: 20-HVQFN (5x5)

pacchetto: 20-VQFN Exposed Pad

BGA6489,135

NXP

IC MMIC AMPLIFIER SOT89

• Frequency: 500MHz ~ 3.5GHz
• P1dB: 17dBm (50.1mW)
• Gain: 16dB
• Noise Figure: 3.3dB
• RF Type: PCS, CDPD, Broadcast Television
• Voltage - Supply: 5.1 V ~ 6 V
• Current - Supply: 78mA ~ 150mA
• Test Frequency: 1.95GHz
• Package / Case: TO-243AA
• Supplier Device Package: SOT-89-3

pacchetto: TO-243AA

MCIMX6S6AVM08AD

NXP

I.MX6SOLO ROM PERF ENHAN

• Core Processor: ARM® Cortex®-A9
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 800MHz
• Co-Processors/DSP: Multimedia; NEON™ SIMD
• RAM Controllers: LPDDR2, LVDDR3, DDR3
• Graphics Acceleration: Yes
• Display & Interface Controllers: Keypad, LCD
• Ethernet: 10/100/1000 Mbps (1)
• SATA: -
• USB: USB 2.0 + PHY (4)
• Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
• Operating Temperature: -40°C ~ 125°C (TJ)
• Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
• Package / Case: 624-LFBGA
• Supplier Device Package: 624-MAPBGA (21x21)

pacchetto: 624-LFBGA

PS32V234CMN1AVUB

NXP

PRE-QUAL ISP GPU NO CSE1GHZ

• Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4
• Number of Cores/Bus Width: 4 Core, 64-Bit/1 Core, 32-Bit
• Speed: 1.0GHz, 133MHz
• Co-Processors/DSP: Multimedia; NEON™ MPE
• RAM Controllers: LPDDR2, DDR3, DDR3L
• Graphics Acceleration: Yes
• Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, MIPICSI2, VIU
• Ethernet: 1 Gbps
• SATA: -
• USB: -
• Voltage - I/O: 1.0V, 1.8V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
• Package / Case: 621-FBGA, FCBGA
• Supplier Device Package: 621-FCPBGA (17x17)

pacchetto: 621-FBGA, FCBGA

SPC5606BF1VLU6

NXP

NXP 32-BIT MCU POWER ARCH CORE

• Core Processor: e200z0h
• Core Size: 32-Bit
• Speed: 64MHz
• Connectivity: CANbus, I²C, LINbus, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 149
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 80K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 29x10b, 5x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 176-LQFP
• Supplier Device Package: 176-LQFP (24x24)

pacchetto: 176-LQFP

TJA1128CTK-1Z

NXP

LIN MINI SYSTEM BASIS CHIP WITH

• Applications: System Basis Chip
• Interface: SPI
• Voltage - Supply: 3V ~ 28V
• Package / Case: 14-VDFN Exposed Pad
• Supplier Device Package: 14-HVSON (3x4.5)
• Mounting Type: Surface Mount

pacchetto: -

MC33FS8435G0ESR2

NXP

SAFETY POWER MANAGEMENT IC, QFN5

• Applications: System Basis Chip
• Current - Supply: 15mA
• Voltage - Supply: 60V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 56-VFQFN Exposed Pad
• Supplier Device Package: 56-HVQFN (8x8)

pacchetto: -

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SAF775CHV-N208Q-AY

NXP

CAR RADIO TUNER & AUDIO DSP

• Type: Audio, Car Signal Processor
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: 176-LQFP Exposed Pad
• Supplier Device Package: 176-HLQFP (24x24)

pacchetto: -

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