Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Cores/Bus Width | Speed | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Operating Temperature | Security Features | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
IC MPU I.MX6Q 852MHZ 624FCBGA
|
pacchetto: 624-FBGA, FCBGA |
Azione6.352 |
|
4 Core, 32-Bit | 852MHZ | Multimedia; NEON? SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | -40°C ~ 125°C (TJ) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | 624-FBGA, FCBGA | 624-FCBGA (21x21) |
||
NXP |
IC MPU MPC83XX 400MHZ 740TBGA
|
pacchetto: 740-LBGA |
Azione5.552 |
|
1 Core, 32-Bit | 400MHz | Communications; QUICC Engine | DDR, DDR2 | No | - | 10/100/1000 Mbps (1) | - | USB 1.x (1) | 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | - | 740-LBGA | 740-TBGA (37.5x37.5) |
||
NXP |
IC MPU MPC83XX 400MHZ 672TBGA
|
pacchetto: 672-LBGA |
Azione4.592 |
|
1 Core, 32-Bit | 400MHz | - | DDR, DDR2 | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (2) | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 672-LBGA | 672-TBGA (35x35) |
||
NXP |
IC MPU I.MX6Q 1.0GHZ 624FCBGA
|
pacchetto: 624-FBGA, FCBGA |
Azione4.944 |
|
4 Core, 32-Bit | 1.0GHz | Multimedia; NEON? SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | -40°C ~ 125°C (TJ) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | 624-FBGA, FCBGA | 624-FCBGA (21x21) |
||
NXP |
IC MPU MPC83XX 400MHZ 740TBGA
|
pacchetto: 740-LBGA |
Azione4.320 |
|
1 Core, 32-Bit | 400MHz | Communications; QUICC Engine | DDR, DDR2 | No | - | 10/100/1000 Mbps (1) | - | USB 1.x (1) | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 740-LBGA | 740-TBGA (37.5x37.5) |
||
NXP |
IC MPU MPC83XX 400MHZ 672TBGA
|
pacchetto: 672-LBGA |
Azione3.600 |
|
1 Core, 32-Bit | 400MHz | Security; SEC | DDR | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (2) | 2.5V, 3.3V | -40°C ~ 105°C (TA) | Cryptography, Random Number Generator | 672-LBGA | 672-TBGA (35x35) |
||
NXP |
IC MPU I.MX6Q 1.0GHZ 624FCBGA
|
pacchetto: 624-FBGA, FCBGA |
Azione4.176 |
|
4 Core, 32-Bit | 1.0GHz | Multimedia; NEON? SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | -40°C ~ 125°C (TJ) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | 624-FBGA, FCBGA | 624-FCBGA (21x21) |
||
NXP |
IC MPU MPC83XX 533MHZ 689TEBGA
|
pacchetto: 689-BBGA Exposed Pad |
Azione4.432 |
|
1 Core, 32-Bit | 533MHz | Security; SEC 3.0 | DDR, DDR2 | No | - | 10/100/1000 Mbps (2) | SATA 3Gbps (2) | USB 2.0 + PHY (1) | 1.8V, 2.5V, 3.3V | -40°C ~ 125°C (TA) | Cryptography, Random Number Generator | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
||
NXP |
IC MPU Q OR IQ 1.2GHZ 689TEBGA
|
pacchetto: 689-BBGA Exposed Pad |
Azione4.032 |
|
1 Core, 32-Bit | 1.2GHz | - | DDR2, DDR3 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | - | 0°C ~ 125°C (TA) | - | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
||
NXP |
IC MPU MPC83XX 667MHZ 689TEBGA
|
pacchetto: 689-BBGA Exposed Pad |
Azione6.160 |
|
1 Core, 32-Bit | 667MHz | Security; SEC 3.0 | DDR, DDR2 | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1) | 1.8V, 2.5V, 3.3V | -40°C ~ 125°C (TA) | Cryptography, Random Number Generator | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
||
NXP |
IC MPU MPC83XX 667MHZ 689TEBGA
|
pacchetto: 689-BBGA Exposed Pad |
Azione6.792 |
|
1 Core, 32-Bit | 667MHz | Security; SEC 3.0 | DDR, DDR2 | No | - | 10/100/1000 Mbps (2) | SATA 3Gbps (2) | USB 2.0 + PHY (1) | 1.8V, 2.5V, 3.3V | -40°C ~ 125°C (TA) | Cryptography, Random Number Generator | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
||
NXP |
IC MPU Q OR IQ 800MHZ 689TEBGA
|
pacchetto: 689-BBGA Exposed Pad |
Azione3.840 |
|
1 Core, 32-Bit | 800MHz | Communications; QUICC Engine | DDR2, DDR3 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | - | 0°C ~ 125°C (TA) | - | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
||
NXP |
IC MPU I.MX6D 1.0GHZ 624FCBGA
|
pacchetto: 624-FBGA, FCBGA |
Azione2.768 |
|
2 Core, 32-Bit | 1.0GHz | Multimedia; NEON? SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | -40°C ~ 125°C (TJ) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | 624-FBGA, FCBGA | 624-FCBGA (21x21) |
||
NXP |
IC MPU Q OR IQ 1.055GHZ 689TBGA
|
pacchetto: 689-BBGA Exposed Pad |
Azione5.856 |
|
1 Core, 32-Bit | 1.055GHz | Security; SEC | DDR2, DDR3 | No | LCD | 10/100/1000 Mbps (2) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | - | 0°C ~ 105°C (TA) | Cryptography, Random Number Generator | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
||
NXP |
IC SOC 4CORE 1200MHZ 780FCBGA
|
pacchetto: 780-FBGA, FCBGA |
Azione5.920 |
|
4 Core, 64-Bit | 1.4GHz | - | DDR3L/4 | No | - | 1 Gbps (5) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | - | 0°C ~ 105°C (TA) | - | 780-FBGA, FCBGA | 780-FCPBGA (23x23) |
||
NXP |
IC SOC 2CORE 1200MHZ SW 780FCBGA
|
pacchetto: 780-FBGA, FCBGA |
Azione6.704 |
|
2 Core, 64-Bit | 1.4GHz | - | DDR3L/4 | No | - | 1 Gbps (12) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | - | 0°C ~ 105°C (TA) | Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage | 780-FBGA, FCBGA | 780-FCPBGA (23x23) |
||
NXP |
IC MPU MPC83XX 800MHZ 689TEBGA
|
pacchetto: 689-BBGA Exposed Pad |
Azione2.100 |
|
1 Core, 32-Bit | 800MHz | - | DDR, DDR2 | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1) | 1.8V, 2.5V, 3.3V | 0°C ~ 125°C (TA) | - | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
||
NXP |
IC MPU MPC83XX 800MHZ 689TEBGA
|
pacchetto: 689-BBGA Exposed Pad |
Azione4.208 |
|
1 Core, 32-Bit | 800MHz | - | DDR, DDR2 | No | - | 10/100/1000 Mbps (2) | SATA 3Gbps (2) | USB 2.0 + PHY (1) | 1.8V, 2.5V, 3.3V | 0°C ~ 125°C (TA) | - | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
||
NXP |
IC MPU Q OR IQ 800MHZ 689TEBGA
|
pacchetto: 689-BBGA Exposed Pad |
Azione6.640 |
|
2 Core, 32-Bit | 800MHz | Communications; QUICC Engine, Security; SEC 3.3 | DDR2, DDR3 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | - | -40°C ~ 105°C (TA) | Cryptography, Random Number Generator | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
||
NXP |
IC MPU MPC8XX 50MHZ 357BGA
|
pacchetto: 357-BBGA |
Azione6.156 |
|
1 Core, 32-Bit | 50MHz | Communications; CPM | DRAM | No | - | 10 Mbps (2) | - | - | 3.3V | 0°C ~ 95°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |
||
NXP |
IC MPU MPC8XX 50MHZ 357BGA
|
pacchetto: 357-BBGA |
Azione4.784 |
|
1 Core, 32-Bit | 50MHz | Communications; CPM | DRAM | No | - | 10 Mbps (2) | - | - | 3.3V | 0°C ~ 95°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |
||
NXP |
IC MPU I.MX6Q 1.0GHZ 624FCBGA
|
pacchetto: 624-FBGA, FCBGA |
Azione6.512 |
|
4 Core, 32-Bit | 1.0GHz | Multimedia; NEON? SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | -40°C ~ 125°C (TJ) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | 624-FBGA, FCBGA | 624-FCBGA (21x21) |
||
NXP |
IC MPU MPC8XX 133MHZ 357BGA
|
pacchetto: 357-BBGA |
Azione5.904 |
|
1 Core, 32-Bit | 133MHz | Communications; CPM | DRAM | No | - | 10 Mbps (1), 10/100 Mbps (1) | - | - | 3.3V | 0°C ~ 95°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |
||
NXP |
IC MPU MPC8XX 133MHZ 357BGA
|
pacchetto: 357-BBGA |
Azione4.992 |
|
1 Core, 32-Bit | 133MHz | Communications; CPM | DRAM | No | - | 10 Mbps (1), 10/100 Mbps (1) | - | - | 3.3V | 0°C ~ 95°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |
||
NXP |
IC MPU MPC8XX 100MHZ 357BGA
|
pacchetto: 357-BBGA |
Azione5.968 |
|
1 Core, 32-Bit | 100MHz | Communications; CPM | DRAM | No | - | 10 Mbps (1), 10/100 Mbps (1) | - | - | 3.3V | -40°C ~ 100°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |
||
NXP |
IC MPU MPC82XX 333MHZ 516BGA
|
pacchetto: 516-BBGA |
Azione10.224 |
|
1 Core, 32-Bit | 333MHz | Communications; RISC CPM | DRAM, SDRAM | No | - | 10/100 Mbps (3) | - | USB 2.0 (1) | 3.3V | 0°C ~ 105°C (TA) | - | 516-BBGA | 516-FPBGA (27x27) |
||
NXP |
IC MPU MPC82XX 266MHZ 352TBGA
|
pacchetto: 352-LBGA |
Azione15.984 |
|
1 Core, 32-Bit | 266MHz | - | SDRAM | No | - | - | - | - | 3.3V | 0°C ~ 105°C (TA) | - | 352-LBGA | 352-TBGA (35x35) |
||
NXP |
IC MPU MPC8XX 50MHZ 357BGA
|
pacchetto: 357-BBGA |
Azione6.492 |
|
1 Core, 32-Bit | 50MHz | Communications; CPM | DRAM | No | - | 10 Mbps (2) | - | - | 3.3V | 0°C ~ 95°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |