Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Cores/Bus Width | Speed | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Operating Temperature | Security Features | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
IC MPU MPC8XX 50MHZ 357BGA
|
pacchetto: 357-BBGA |
Azione9.480 |
|
1 Core, 32-Bit | 50MHz | Communications; CPM | DRAM | No | - | 10 Mbps (1), 10/100 Mbps (1) | - | - | 3.3V | 0°C ~ 95°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |
||
NXP |
IC MPU Q OR IQ 667MHZ 561TEBGA1
|
pacchetto: 561-FBGA |
Azione3.472 |
|
1 Core, 32-Bit | 667MHz | Security; SEC 3.3 | DDR3 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | - | -40°C ~ 125°C (TA) | Cryptography, Random Number Generator | 561-FBGA | 561-TEPBGA1 (23x23) |
||
NXP |
IC MPU MPC83XX 400MHZ 668BGA
|
pacchetto: 668-BBGA Exposed Pad |
Azione3.744 |
|
1 Core, 32-Bit | 400MHz | Communications; QUICC Engine | DDR, DDR2 | No | - | 10/100/1000 Mbps (1) | - | USB 1.x (1) | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 668-BBGA Exposed Pad | 668-PBGA-PGE (29x29) |
||
NXP |
IC MPU MPC83XX 266MHZ 668BGA
|
pacchetto: 668-BBGA Exposed Pad |
Azione4.592 |
|
1 Core, 32-Bit | 266MHz | Communications; QUICC Engine | DDR, DDR2 | No | - | 10/100/1000 Mbps (1) | - | USB 1.x (1) | 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | - | 668-BBGA Exposed Pad | 668-PBGA-PGE (29x29) |
||
NXP |
IC MPU Q OR IQ 800MHZ 689TEBGA
|
pacchetto: 689-BBGA Exposed Pad |
Azione6.480 |
|
1 Core, 32-Bit | 800MHz | - | DDR2, DDR3 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | - | 0°C ~ 125°C (TA) | - | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
||
NXP |
IC MPU Q OR IQ 800MHZ 520FCBGA
|
pacchetto: 520-FBGA, FCBGA |
Azione2.368 |
|
1 Core, 32-Bit | 800MHz | Signal Processing; SC3850 | DDR3, DDR3L | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 (1) | 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | - | 520-FBGA, FCBGA | 520-FCBGA (21x21) |
||
NXP |
IC MPU Q OR IQ 800MHZ 520FCBGA
|
pacchetto: 520-FBGA, FCBGA |
Azione7.152 |
|
1 Core, 32-Bit | 800MHz | Signal Processing; SC3850, Security; SEC 4.4 | DDR3, DDR3L | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 (1) | 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | Boot Security, Cryptography, Random Number Generator | 520-FBGA, FCBGA | 520-FCBGA (21x21) |
||
NXP |
IC MPU MPC8XX 66MHZ 357BGA
|
pacchetto: 357-BBGA |
Azione3.488 |
|
1 Core, 32-Bit | 66MHz | Communications; CPM, Security; SEC | DRAM | No | - | 10 Mbps (3), 10/100 Mbps (2) | - | USB 2.0 (1) | 3.3V | 0°C ~ 95°C (TA) | Cryptography | 357-BBGA | 357-PBGA (25x25) |
||
NXP |
IC MPU MPC8XX 66MHZ 357BGA
|
pacchetto: 357-BBGA |
Azione6.176 |
|
1 Core, 32-Bit | 66MHz | Communications; CPM, Security; SEC | DRAM | No | - | 10 Mbps (3), 10/100 Mbps (2) | - | USB 2.0 (1) | 3.3V | 0°C ~ 95°C (TA) | Cryptography | 357-BBGA | 357-PBGA (25x25) |
||
NXP |
IC MPU MPC83XX 400MHZ 689TEBGA
|
pacchetto: 689-BBGA Exposed Pad |
Azione2.512 |
|
1 Core, 32-Bit | 400MHz | - | DDR, DDR2 | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1) | 1.8V, 2.5V, 3.3V | 0°C ~ 125°C (TA) | - | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
||
NXP |
IC MPU MPC83XX 400MHZ 689TEBGA
|
pacchetto: 689-BBGA Exposed Pad |
Azione3.856 |
|
1 Core, 32-Bit | 400MHz | - | DDR, DDR2 | No | - | 10/100/1000 Mbps (2) | SATA 3Gbps (2) | USB 2.0 + PHY (1) | 1.8V, 2.5V, 3.3V | 0°C ~ 125°C (TA) | - | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
||
NXP |
IC MPU I.MX51 600MHZ 529BGA
|
pacchetto: 529-LFBGA |
Azione2.512 |
|
1 Core, 32-Bit | 600MHz | Multimedia; NEON? SIMD | LPDDR, DDR2 | No | Keypad, LCD | 10/100 Mbps (1) | - | USB 2.0 (3), USB 2.0 + PHY (1) | 1.2V, 1.875V, 2.775V, 3.0V | -40°C ~ 95°C (TC) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | 529-LFBGA | 529-BGA Case 2017 (19x19) |
||
NXP |
IC MPU MPC83XX 266MHZ 620BGA
|
pacchetto: 620-BBGA Exposed Pad |
Azione6.144 |
|
1 Core, 32-Bit | 266MHz | - | DDR | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (2) | 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 620-BBGA Exposed Pad | 620-PBGA (29x29) |
||
NXP |
IC MPU MPC83XX 266MHZ 620BGA
|
pacchetto: 620-BBGA Exposed Pad |
Azione3.680 |
|
1 Core, 32-Bit | 266MHz | - | DDR | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (2) | 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 620-BBGA Exposed Pad | 620-PBGA (29x29) |
||
NXP |
IC MPU Q OR IQ 1.0GHZ 425TEBGA
|
pacchetto: 425-FBGA |
Azione4.080 |
|
1 Core, 32-Bit | 1.0GHz | - | DDR3, DDR3L | No | - | 10/100/1000 Mbps (3) | SATA 3Gbps (2) | USB 2.0 + PHY (1) | - | -40°C ~ 105°C (TA) | - | 425-FBGA | 425-TEPBGA I (19x19) |
||
NXP |
IC MPU MPC83XX 266MHZ 620BGA
|
pacchetto: 620-BBGA Exposed Pad |
Azione3.696 |
|
1 Core, 32-Bit | 266MHz | Security; SEC | DDR, DDR2 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | Cryptography, Random Number Generator | 620-BBGA Exposed Pad | 620-PBGA (29x29) |
||
NXP |
IC MPU MPC83XX 400MHZ 620BGA
|
pacchetto: 620-BBGA Exposed Pad |
Azione4.336 |
|
1 Core, 32-Bit | 400MHz | - | DDR, DDR2 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 620-BBGA Exposed Pad | 620-PBGA (29x29) |
||
NXP |
IC MPU MPC82XX 300MHZ 516BGA
|
pacchetto: 516-BBGA |
Azione29.184 |
|
1 Core, 32-Bit | 300MHz | Communications; RISC CPM, Security; SEC | DRAM, SDRAM | No | - | 10/100 Mbps (2) | - | USB 2.0 (1) | 3.3V | 0°C ~ 105°C (TA) | Cryptography, Random Number Generator | 516-BBGA | 516-FPBGA (27x27) |
||
NXP |
IC MPU MPC82XX 266MHZ 357BGA
|
pacchetto: 357-BBGA |
Azione35.688 |
|
1 Core, 32-Bit | 266MHz | - | SDRAM | No | - | - | - | - | 3.3V | 0°C ~ 105°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |
||
NXP |
IC MPU M683XX 16MHZ 132QFP
|
pacchetto: 132-BQFP Bumpered |
Azione4.272 |
|
1 Core, 8/16-Bit | 16MHz | Communications; RISC CPM | DRAM | No | - | - | - | - | 5.0V | 0°C ~ 70°C (TA) | - | 132-BQFP Bumpered | 132-PQFP (24.13x24.13) |
||
NXP |
IC MPU M683XX 16MHZ 132QFP
|
pacchetto: 132-BQFP Bumpered |
Azione4.256 |
|
1 Core, 8/16-Bit | 16MHz | Communications; RISC CPM | DRAM | No | - | - | - | - | 5.0V | 0°C ~ 70°C (TA) | - | 132-BQFP Bumpered | 132-PQFP (24.13x24.13) |
||
NXP |
IC MPU Q OR IQ 667MHZ 561TEBGA1
|
pacchetto: 561-FBGA |
Azione2.032 |
|
2 Core, 32-Bit | 667MHz | - | DDR3 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | - | 0°C ~ 125°C (TA) | - | 561-FBGA | 561-TEPBGA1 (23x23) |
||
NXP |
IC MPU Q OR IQ 800MHZ 689TEBGA
|
pacchetto: 689-BBGA Exposed Pad |
Azione6.608 |
|
2 Core, 32-Bit | 800MHz | - | DDR2, DDR3 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | 2.5V, 3.3V | 0°C ~ 125°C (TA) | - | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
||
NXP |
IC MPU M683XX 16MHZ 144QFP
|
pacchetto: 144-BQFP |
Azione7.360 |
|
1 Core, 32-Bit | 16MHz | - | DRAM | No | - | - | - | - | 5.0V | -40°C ~ 85°C (TA) | - | 144-BQFP | 144-QFP (28x28) |
||
NXP |
IC MPU M683XX 20MHZ 100LQFP
|
pacchetto: 100-LQFP |
Azione7.424 |
|
1 Core, 8/16-Bit | 20MHz | Communications; RISC CPM | DRAM | No | - | - | - | - | 3.3V | -40°C ~ 85°C (TA) | - | 100-LQFP | 100-LQFP (14x14) |
||
NXP |
IC MPU I.MX53 800MHZ 529TEBGA-2
|
pacchetto: 529-FBGA |
Azione2.272 |
|
1 Core, 32-Bit | 800MHz | Multimedia; NEON? SIMD | LPDDR2, DDR2, DDR3 | Yes | Keypad, LCD | 10/100 Mbps (1) | SATA 1.5Gbps (1) | USB 2.0 (2), USB 2.0 + PHY (2) | 1.3V, 1.8V, 2.775V, 3.3V | -40°C ~ 85°C (TA) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | 529-FBGA | 529-TEPBGA-2 (19x19) |
||
NXP |
IC MPU I.MX51 600MHZ 529BGA
|
pacchetto: 529-LFBGA |
Azione81.840 |
|
1 Core, 32-Bit | 600MHz | Multimedia; NEON? SIMD | LPDDR, DDR2 | Yes | Keypad, LCD | 10/100 Mbps (1) | - | USB 2.0 (3), USB 2.0 + PHY (1) | 1.2V, 1.875V, 2.775V, 3.0V | -40°C ~ 125°C (TJ) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | 529-LFBGA | 529-BGA Case 2017 (19x19) |
||
NXP |
IC MPU Q OR IQ 500MHZ 457TEBGA
|
pacchetto: 457-LFBGA |
Azione3.952 |
|
2 Core, 32-Bit | 500MHz | - | DDR3, DDR3L | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1) | - | 0°C ~ 105°C (TA) | - | 457-LFBGA | 457-TEPBGA-1 (19x19) |