Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Core Size | Speed | Connectivity | Peripherals | Number of I/O | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
NXP 32-BIT MCU POWER ARCH 1.5M
|
pacchetto: 176-LQFP |
Azione5.968 |
|
32-Bit | 120MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 128K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
||
NXP |
NXP 32-BIT MCU POWER ARCH 1.5M
|
pacchetto: 176-LQFP |
Azione3.712 |
|
32-Bit | 120MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 128K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
pacchetto: 176-LQFP |
Azione4.528 |
|
32-Bit | 120MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 3MB (3M x 8) | FLASH | 64K x 8 | 192K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
||
NXP |
NXP 32-BIT MCU TRIPLE POWER ARC
|
pacchetto: 176-LQFP |
Azione6.480 |
|
32-Bit Tri-Core | 150MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI, UART/USART | DMA, LVD, POR, Zipwire | - | 3MB (3M x 8) | FLASH | - | 192K x 8 | 3.5 V ~ 5.5 V | A/D 12b SAR, 16b Sigma-Delta | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
||
NXP |
ARM 32-BIT MCU TRIPLE CORE 4MB
|
pacchetto: 208-LQFP Exposed Pad |
Azione4.688 |
|
32-Bit Tri-Core | 80MHz, 160MHz, 320MHz | CANbus, EBI/EMI, Ethernet, I²C, LINbus, SPI | DMA, LCD, LVD/HVD, POR, PWM, WDT | - | 4MB (4M x 8) | FLASH | - | 2.3M x 8 | 3.15 V ~ 5.5 V | A/D 24x12b | Internal | -40°C ~ 105°C (TA) | - | 208-LQFP Exposed Pad | 208-LQFP (28x28) |
||
NXP |
DUAL CORE 4M FLASH 512K RAM F
|
pacchetto: 176-LQFP Exposed Pad |
Azione7.200 |
|
32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 129 | 4MB (4M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
||
NXP |
DUAL CORE 4M FLASH 512
|
pacchetto: 176-LQFP Exposed Pad |
Azione5.808 |
|
32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI | DMA, LVD, POR, WDT | 129 | 4MB (4M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
||
NXP |
FREESCALE 32-BIT MCU TRIPLE POW
|
pacchetto: 176-LQFP |
Azione4.912 |
|
32-Bit Tri-Core | 150MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI, UART/USART | DMA, LVD, POR, Zipwire | - | 4MB (4M x 8) | FLASH | - | 256K x 8 | 3.5 V ~ 5.5 V | A/D 12b SAR, 16b Sigma-Delta | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
pacchetto: 324-BBGA |
Azione5.920 |
|
32-Bit | 120MHz | CANbus, EBI/EMI, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 151 | 2MB (2M x 8) | FLASH | - | 128K x 8 | 1.14 V ~ 5.25 V | A/D 40x12b | Internal | -40°C ~ 125°C (TA) | - | 324-BBGA | 324-TEPBGA (23x23) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
pacchetto: 176-LQFP |
Azione4.688 |
|
32-Bit | 120MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 2MB (2M x 8) | FLASH | 64K x 8 | 160K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
||
NXP |
DUAL CORE 3M FLASH 384K RAM F
|
pacchetto: 256-LBGA |
Azione7.440 |
|
32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 178 | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | 256-LBGA | 256-MAPPBGA (17x17) |
||
NXP |
NXP 32-BIT MCU POWER ARCH 1.5M
|
pacchetto: 176-LQFP |
Azione6.192 |
|
32-Bit | 120MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 128K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
||
NXP |
NXP 32-BIT MCU POWER ARCH 1.5M
|
pacchetto: 176-LQFP |
Azione7.552 |
|
32-Bit | 120MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 128K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
||
NXP |
NXP 32-BIT MCU POWER ARCH 1.5M
|
pacchetto: 176-LQFP |
Azione7.792 |
|
32-Bit | 120MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 128K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
||
NXP |
ARM 32-BIT MCU TRIPLE CORE 3MB
|
pacchetto: 516-BGA |
Azione2.240 |
|
32-Bit Tri-Core | 80MHz, 160MHz, 320MHz | CANbus, EBI/EMI, Ethernet, I²C, LINbus, SPI | DMA, LCD, LVD/HVD, POR, PWM, WDT | - | 3MB (3M x 8) | FLASH | - | 2.3M x 8 | 3.15 V ~ 5.5 V | A/D 24x12b | Internal | -40°C ~ 105°C (TA) | - | 516-BGA | 516-MAPBGA (27x27) |
||
NXP |
DUAL CORE 3M FLASH 512K RAM F
|
pacchetto: 176-LQFP Exposed Pad |
Azione7.120 |
|
32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 129 | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
||
NXP |
DUAL CORE 6M FLASH 768K RAM F
|
pacchetto: 176-LQFP Exposed Pad |
Azione6.768 |
|
32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 129 | 6MB (6M x 8) | FLASH | - | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 85°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
||
NXP |
DUAL CORE 4M FLASH 512
|
pacchetto: 176-LQFP Exposed Pad |
Azione7.056 |
|
32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 129 | 4MB (4M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
||
NXP |
DUAL CORE 3M FLASH 384K RAM F
|
pacchetto: 176-LQFP Exposed Pad |
Azione4.432 |
|
32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 129 | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
||
NXP |
NXP 32-BIT MCU DUAL POWER ARCH
|
pacchetto: 176-LQFP |
Azione3.056 |
|
32-Bit Dual-Core | 80MHz/120MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 192K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
||
NXP |
NXP 32-BIT MCU DUAL POWER ARCH
|
pacchetto: 176-LQFP |
Azione7.696 |
|
32-Bit Dual-Core | 80MHz/120MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 192K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
||
NXP |
32 BIT DUAL CORE 3M FLASH 512
|
pacchetto: 256-LBGA |
Azione3.632 |
|
32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 178 | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | 256-LBGA | 256-MAPPBGA (17x17) |
||
NXP |
ARM 32-BIT MCU TRIPLE CORE 4MB
|
pacchetto: 516-BGA |
Azione4.624 |
|
32-Bit Tri-Core | 80MHz, 160MHz, 320MHz | CANbus, EBI/EMI, Ethernet, I²C, LINbus, SPI | DMA, LCD, LVD/HVD, POR, PWM, WDT | - | 4MB (4M x 8) | FLASH | - | 2.3M x 8 | 3.15 V ~ 5.5 V | A/D 24x12b | Internal | -40°C ~ 105°C (TA) | - | 516-BGA | 516-MAPBGA (27x27) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
pacchetto: 176-LQFP |
Azione3.664 |
|
32-Bit | 120MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 128K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
||
NXP |
SINGLE CORE, 3M FLASH
|
pacchetto: 176-LQFP Exposed Pad |
Azione7.248 |
|
32-Bit | 160MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | 129 | 3MB (3M x 8) | FLASH | 64K x 8 | 384K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b, 16x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
||
NXP |
32 BITDUAL CORE3M FLASH384 RA
|
pacchetto: 256-LBGA |
Azione4.144 |
|
32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 178 | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | 256-LBGA | 256-MAPPBGA (17x17) |
||
NXP |
32 BITDUAL CORE3M FLASH512K R
|
pacchetto: 176-LQFP Exposed Pad |
Azione2.304 |
|
32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 129 | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
||
NXP |
ARM 32-BIT MCU TRIPLE CORE 3MB
|
pacchetto: 208-LQFP Exposed Pad |
Azione4.992 |
|
32-Bit Tri-Core | 80MHz, 160MHz, 320MHz | CANbus, EBI/EMI, Ethernet, I²C, LINbus, SPI | DMA, LCD, LVD/HVD, POR, PWM, WDT | - | 3MB (3M x 8) | FLASH | - | 2.3M x 8 | 3.15 V ~ 5.5 V | A/D 24x12b | Internal | -40°C ~ 105°C (TA) | - | 208-LQFP Exposed Pad | 208-LQFP (28x28) |