Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microsemi Corporation |
IC HDLC PROTOCOL CTLR 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione6.944 |
|
- | 1 | 4.75 V ~ 5.25 V | 1µA | - | -40°C ~ 85°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microsemi Corporation |
IC DSIC SUBSCRIBER NETWRK 24SSOP
|
pacchetto: 24-SSOP (0.209", 5.30mm Width) |
Azione5.968 |
|
- | 1 | 4.75 V ~ 5.25 V | 10mA | - | -40°C ~ 85°C | Surface Mount | 24-SSOP (0.209", 5.30mm Width) | 24-SSOP |
||
Microsemi Corporation |
IC TXRX DTMF 20DIP
|
pacchetto: 20-DIP (0.300", 7.62mm) |
Azione5.536 |
|
- | 1 | 4.75 V ~ 5.25 V | 7mA | - | -40°C ~ 85°C | Through Hole | 20-DIP (0.300", 7.62mm) | 20-PDIP |
||
Microsemi Corporation |
IC TXRX DTMF 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione40.800 |
|
- | 1 | 4.75 V ~ 5.25 V | 7mA | - | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microsemi Corporation |
IC TXRX DTMF 20DIP
|
pacchetto: 20-DIP (0.300", 7.62mm) |
Azione5.984 |
|
- | 1 | 4.75 V ~ 5.25 V | 7mA | - | -40°C ~ 85°C | Through Hole | 20-DIP (0.300", 7.62mm) | 20-PDIP |
||
Microsemi Corporation |
IC TXRX DTMF 24SSOP
|
pacchetto: 24-SSOP (0.209", 5.30mm Width) |
Azione6.528 |
|
- | 1 | 4.75 V ~ 5.25 V | 7mA | - | -40°C ~ 85°C | Surface Mount | 24-SSOP (0.209", 5.30mm Width) | 24-SSOP |
||
Microsemi Corporation |
IC TXRX DTMF 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione6.320 |
|
- | 1 | 4.75 V ~ 5.25 V | 7mA | - | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microsemi Corporation |
IC CNIC1.1 CLIP CID TYPE1 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione107.772 |
|
3-Wire | 1 | 2.7 V ~ 5.5 V | 1.9mA | - | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Microsemi Corporation |
IC DIGITAL SWITCH 32K CH 324BGA
|
pacchetto: 324-BGA |
Azione4.848 |
|
- | 1 | 1.71 V ~ 1.89 V | 500mA | - | -40°C ~ 85°C | Surface Mount | 324-BGA | 324-PBGA (19x19) |
||
Microsemi Corporation |
IC VOICE ECHO CANCELLER 100LQFP
|
pacchetto: 100-LQFP |
Azione5.424 |
|
- | 1 | 1.6 V ~ 2 V | 10mA | - | -40°C ~ 85°C | Surface Mount | 100-LQFP | 100-LQFP (14x14) |
||
Microsemi Corporation |
IC VOICE ECHO CANCEL 100LQFP
|
pacchetto: 100-LQFP |
Azione7.728 |
|
- | 1 | 1.6 V ~ 2 V | 10mA | - | -40°C ~ 85°C | Surface Mount | 100-LQFP | 100-LQFP |
||
Microsemi Corporation |
IC SUBSCRIBER NETWRK DNIC 24SSOP
|
pacchetto: - |
Azione4.624 |
|
- | 1 | 4.75 V ~ 5.25 V | 10mA | - | -40°C ~ 85°C | Surface Mount | - | 24-SSOP |
||
Microsemi Corporation |
IC VOICE PROCESSOR 100LQFP
|
pacchetto: 100-LQFP |
Azione18.660 |
|
I2S, SPI, UART | 2 | - | - | - | -40°C ~ 85°C | Surface Mount | 100-LQFP | 100-LQFP (14x14) |
||
Microsemi Corporation |
IC DSIC SUBSCRIBER NETWRK 24SSOP
|
pacchetto: 24-SSOP (0.209", 5.30mm Width) |
Azione5.520 |
|
- | 1 | 4.75 V ~ 5.25 V | 10mA | - | -40°C ~ 85°C | Surface Mount | 24-SSOP (0.209", 5.30mm Width) | 24-SSOP |
||
Microsemi Corporation |
IC RECEIVER DTMF 18SOIC
|
pacchetto: 18-SOIC (0.295", 7.50mm Width) |
Azione353.532 |
|
- | 1 | 4.75 V ~ 5.25 V | 3mA | - | -40°C ~ 85°C | Surface Mount | 18-SOIC (0.295", 7.50mm Width) | 18-SOIC |
||
Microsemi Corporation |
IC TXRX DTMF 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione18.408 |
|
- | 1 | 4.75 V ~ 5.25 V | 7mA | - | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microsemi Corporation |
IC TXRX DTMF 20DIP
|
pacchetto: 20-DIP (0.300", 7.62mm) |
Azione112.452 |
|
- | 1 | 4.75 V ~ 5.25 V | 7mA | - | -40°C ~ 85°C | Through Hole | 20-DIP (0.300", 7.62mm) | 20-PDIP |
||
Microsemi Corporation |
IC RECEIVER DTMF 18SOIC
|
pacchetto: 18-SOIC (0.295", 7.50mm Width) |
Azione172.044 |
|
- | 1 | 2.7 V ~ 3.6 V | 2mA | - | -40°C ~ 85°C | Surface Mount | 18-SOIC (0.295", 7.50mm Width) | 18-SOIC |
||
Microsemi Corporation |
IC SIGNAL COND 8X8 69-BGA
|
pacchetto: 36-FBGA |
Azione5.472 |
|
TTL/CMOS | 8 | 2.5V, 3.3V | - | 2.65W | 0°C ~ 110°C | Surface Mount | 36-FBGA | 69-BGA |
||
Microsemi Corporation |
IC SIGNAL COND 4X4 69-BGA
|
pacchetto: 69-FBGA |
Azione4.608 |
|
TTL/CMOS | 4 | 2.5V, 3.3V | - | 1.5W | 0°C ~ 110°C | Surface Mount | 69-FBGA | 69-BGA |
||
Microsemi Corporation |
IC SIGNAL COND OCTAL 69-BGA
|
pacchetto: 69-FBGA |
Azione6.800 |
|
TTL/CMOS | 8 | 2.5V, 3.3V | - | 2.65W | 0°C ~ 110°C | Surface Mount | 69-FBGA | 69-BGA |
||
Microsemi Corporation |
MODULE SONET/SDH
|
pacchetto: - |
Azione5.952 |
|
- | - | - | - | - | - | - | - | - |
||
Microsemi Corporation |
MODULE SONET/SDH
|
pacchetto: - |
Azione3.584 |
|
- | - | - | - | - | - | - | - | - |
||
Microsemi Corporation |
MODULE SONET/SDH
|
pacchetto: - |
Azione3.920 |
|
- | - | - | - | - | - | - | - | - |
||
Microsemi Corporation |
MODULE SONET/SDH
|
pacchetto: - |
Azione7.936 |
|
- | - | - | - | - | - | - | - | - |
||
Microsemi Corporation |
84/63 CHAN T1/E1 VT1.5/VT2 MAPPE
|
pacchetto: - |
Azione2.528 |
|
- | - | - | - | - | - | - | - | - |
||
Microsemi Corporation |
TEMUX 336NG, PB FREE BUMP
|
pacchetto: - |
Azione7.376 |
|
- | - | - | - | - | - | - | - | - |
||
Microsemi Corporation |
33 LINK, 672 HDLC CHANNEL FRAME
|
pacchetto: - |
Azione6.600 |
|
- | - | - | - | - | - | - | - | - |