Prodotti Microchip Technology

DSC2311KE2-R0008T

Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

• Type: MEMS (Silicon)
• Frequency - Output 1: -
• Frequency - Output 2: -
• Function: Enable/Disable
• Output: CMOS
• Voltage - Supply: 2.25 V ~ 3.6 V
• Frequency Stability: ±25ppm
• Operating Temperature: -20°C ~ 70°C
• Current - Supply (Max): -
• Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
• Height: 0.035" (0.90mm)
• Package / Case: 6-SMD, No Lead

pacchetto: 6-SMD, No Lead

DSC1001CL1-111.0000

Microchip Technology

OSC MEMS 111.0000MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 111MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 1.8 V ~ 3.3 V
• Frequency Stability: ±50ppm
• Operating Temperature: -40°C ~ 105°C
• Current - Supply (Max): 8.7mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
• Height - Seated (Max): 0.035" (0.90mm)

pacchetto: 4-SMD, No Lead

DSC1001AI2-120.0000

Microchip Technology

OSC MEMS 120.0000MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 120MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 1.8 V ~ 3.3 V
• Frequency Stability: ±25ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 8.7mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead Exposed Pad
• Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
• Height - Seated (Max): 0.035" (0.90mm)

pacchetto: 4-SMD, No Lead Exposed Pad

DSC1102DE2-025.0000T

Microchip Technology

OSC MEMS 25.000MHZ LVPECL SMD

• Type: MEMS (Silicon)
• Frequency: 25MHz
• Function: Standby (Power Down)
• Output: LVPECL
• Voltage - Supply: 2.25 V ~ 3.6 V
• Frequency Stability: ±25ppm
• Operating Temperature: -20°C ~ 70°C
• Current - Supply (Max): 58mA
• Ratings: -
• Mounting Type: Surface Mount
• Package / Case: 6-SMD, No Lead
• Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
• Height - Seated (Max): 0.035" (0.90mm)

pacchetto: 6-SMD, No Lead

DSC1122AI2-156.2500T

Microchip Technology

OSC MEMS 156.25MHZ LVPECL SMD

• Type: MEMS (Silicon)
• Frequency: 156.25MHz
• Function: Enable/Disable
• Output: LVPECL
• Voltage - Supply: 2.25 V ~ 3.6 V
• Frequency Stability: ±25ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 58mA
• Ratings: -
• Mounting Type: Surface Mount
• Package / Case: 6-SMD, No Lead, Exposed Pad
• Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
• Height - Seated (Max): 0.035" (0.90mm)

pacchetto: 6-SMD, No Lead, Exposed Pad

DSC1101CI2-025.0000

Microchip Technology

OSC MEMS 25.000MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 25MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 2.25 V ~ 3.6 V
• Frequency Stability: ±25ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 35mA
• Ratings: -
• Mounting Type: Surface Mount
• Package / Case: 6-SMD, No Lead
• Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
• Height - Seated (Max): 0.035" (0.90mm)

pacchetto: 6-SMD, No Lead

MIC37301-1.8YME-TR

Microchip Technology

IC REG LINEAR 1.8V 3A 8SOIC

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 1
• Voltage - Input (Max): 6V
• Voltage - Output (Min/Fixed): 1.8V
• Voltage - Output (Max): -
• Voltage Dropout (Max): 0.55V @ 3A
• Current - Output: 3A
• Current - Quiescent (Iq): -
• Current - Supply (Max): 50mA
• PSRR: -
• Control Features: Enable
• Protection Features: Over Current, Over Temperature, Reverse Polarity
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width) Exposed Pad
• Supplier Device Package: 8-SOIC-EP

pacchetto: 8-SOIC (0.154", 3.90mm Width) Exposed Pad

MCP112T-475E/LB

Microchip Technology

IC VOLT DET 4.63V LOW SC70-3

• Type: Simple Reset/Power-On Reset
• Number of Voltages Monitored: 1
• Output: Push-Pull, Totem Pole
• Reset: Active Low
• Reset Timeout: -
• Voltage - Threshold: 4.63V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: SC-70, SOT-323
• Supplier Device Package: SC-70-3

pacchetto: SC-70, SOT-323

25LC128-E/SN

Microchip Technology

IC EEPROM 128KBIT 10MHZ 8SOIC

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 128Kb (16K x 8)
• Memory Interface: SPI
• Clock Frequency: 10MHz
• Write Cycle Time - Word, Page: 5ms
• Access Time: -
• Voltage - Supply: 2.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

pacchetto: 8-SOIC (0.154", 3.90mm Width)

SY10EP51VZI

Microchip Technology

IC D-TYPE POS/NEG 8SOIC

• Function: Reset
• Type: D-Type
• Output Type: Differential
• Number of Elements: 1
• Number of Bits per Element: 1
• Clock Frequency: 3GHz
• Max Propagation Delay @ V, Max CL: -
• Trigger Type: Positive, Negative
• Current - Output High, Low: -
• Voltage - Supply: -3 V ~ -5.5 V
• Current - Quiescent (Iq): 40mA
• Input Capacitance: -
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)

pacchetto: 8-SOIC (0.154", 3.90mm Width)

PIC17C42AT-33I/PT

Microchip Technology

IC MCU 8BIT 4KB OTP 44TQFP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 33MHz
• Connectivity: UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: 33
• Program Memory Size: 4KB (2K x 16)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 232 x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 6 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 44-TQFP
• Supplier Device Package: 44-TQFP (10x10)

pacchetto: 44-TQFP

PIC18F4680-H/ML

Microchip Technology

IC MCU 8BIT 64KB FLASH 44QFN

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 25MHz
• Connectivity: CAN, I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number of I/O: 36
• Program Memory Size: 64KB (32K x 16)
• Program Memory Type: FLASH
• EEPROM Size: 1K x 8
• RAM Size: 3.25K x 8
• Voltage - Supply (Vcc/Vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 11x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 150°C (TA)
• Mounting Type: -
• Package / Case: 44-VQFN Exposed Pad
• Supplier Device Package: 44-QFN (8x8)

pacchetto: 44-VQFN Exposed Pad

DSPIC33FJ64GS606T-I/MR

Microchip Technology

IC MCU 16BIT 64KB FLASH 64QFN

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 40 MIPs
• Connectivity: CAN, I2C, IrDA, LIN, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, QEI, POR, PWM, WDT
• Number of I/O: 58
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 9K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 16x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-VFQFN Exposed Pad
• Supplier Device Package: 64-QFN (9x9)

pacchetto: 64-VFQFN Exposed Pad

DSPIC33EP128GP504-E/PT

Microchip Technology

IC MCU 16BIT 128KB FLASH 44TQFP

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 60 MIPs
• Connectivity: CAN, I2C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number of I/O: 35
• Program Memory Size: 128KB (43K x 24)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 16
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 9x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 44-TQFP
• Supplier Device Package: 44-TQFP (10x10)

pacchetto: 44-TQFP

PIC16F18324-E/SL

Microchip Technology

IC MCU 8BIT 7KB FLASH 14SOIC

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 32MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 12
• Program Memory Size: 7KB (4K x 14)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 2.3 V ~ 5.5 V
• Data Converters: A/D 11x10b, D/A 1x5b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 14-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 14-SOIC

pacchetto: 14-SOIC (0.154", 3.90mm Width)

PIC32MK1024MCF100-I/PT

Microchip Technology

IC MCU 32BIT 1MB FLASH 100TQFP

• Core Processor: MIPS32? microAptiv?
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: CAN, IrDA, LIN, PMP, QEI, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, Motor Control PWM, WDT
• Number of I/O: 78
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 256K x 8
• Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V
• Data Converters: A/D 42x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 100-TQFP
• Supplier Device Package: 100-TQFP (12x12)

pacchetto: 100-TQFP

MCP47FVB22A2T-E/ST

Microchip Technology

IC DAC 12BIT

• Number of Bits: 12
• Number of D/A Converters: 2
• Settling Time: 6µs (Typ)
• Output Type: Voltage - Buffered
• Differential Output: No
• Data Interface: I2C
• Reference Type: External, Internal, Supply
• Voltage - Supply, Analog: 2.7 V ~ 5.5 V
• Voltage - Supply, Digital: 2.7 V ~ 5.5 V
• INL/DNL (LSB): ±1.5, ±0.2
• Architecture: R-2R
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 8-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 8-TSSOP
• Mounting Type: -

pacchetto: 8-TSSOP (0.173", 4.40mm Width)

UM7514SM

Microchip Technology

SI PPIN HERMETIC MELF

• Diode Type: PIN - Single
• Voltage - Peak Reverse (Max): 1400V
• Current - Max: -
• Capacitance @ Vr, F: 1pF @ 100V, 1MHz
• Resistance @ If, F: 1Ohm @ 50mA, 100MHz
• Power Dissipation (Max): 10 W
• Operating Temperature: -65°C ~ 175°C
• Package / Case: SQ-MELF
• Supplier Device Package: -

pacchetto: -

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JANS1N4135-1

Microchip Technology

ZENER DIODE

• Voltage - Zener (Nom) (Vz): 100 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 1500 Ohms
• Current - Reverse Leakage @ Vr: 10 nA @ 76 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-204AH (DO-35)

pacchetto: -

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JANS1N823-1-TR

Microchip Technology

DIODE ZENER TEMP COMPENSATED

• Voltage - Zener (Nom) (Vz): 6.2 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 15 Ohms
• Current - Reverse Leakage @ Vr: 2 µA @ 3 V
• Voltage - Forward (Vf) (Max) @ If: -
• Operating Temperature: -55°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-204AH (DO-35)

pacchetto: -

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ATSAM4CMP16CC-AUT

Microchip Technology

IC MCU 32BIT 1MB FLASH 100TQFP

• Core Processor: ARM® Cortex®-M4F
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: EBI/EMI, I2C, IrDA, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
• Number of I/O: 52
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
• Data Converters: A/D 6x10b SAR
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-TQFP
• Supplier Device Package: 100-TQFP (14x14)

pacchetto: -

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ZL30643LDG1

Microchip Technology

3-CHANNEL, 10-OUTPUT LINE CARD

• PLL: Yes
• Main Purpose: Ethernet, SONET/SDH, Wireless Base Stations
• Input: CMOS
• Output: CMOS, LVDS, LVPECL
• Number of Circuits: 3
• Ratio - Input:Output: 5:10
• Differential - Input:Output: Yes/Yes
• Frequency - Max: 750MHz
• Voltage - Supply: 1.8V, 3.3V
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: 64-VFQFN Exposed Pad
• Supplier Device Package: 64-VQFN (9x9)

pacchetto: -

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1N5935C

Microchip Technology

ZENER DIODE

• Voltage - Zener (Nom) (Vz): 27 V
• Tolerance: ±2%
• Power - Max: 1.25 W
• Impedance (Max) (Zzt): 23 Ohms
• Current - Reverse Leakage @ Vr: 1 µA @ 20.6 V
• Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Package / Case: DO-204AL, DO-41, Axial
• Supplier Device Package: DO-41

pacchetto: -

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JAN1N6341D

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 51 V
• Tolerance: ±1%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 85 Ohms
• Current - Reverse Leakage @ Vr: 50 nA @ 39 V
• Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-204AH (DO-35)

pacchetto: -

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GC9911-S12

Microchip Technology

SI SCHOTTKY NON HERMETIC BEAM LE

• Diode Type: Schottky - Single
• Voltage - Peak Reverse (Max): 2V
• Current - Max: -
• Capacitance @ Vr, F: 0.1pF @ 0V, 1MHz
• Resistance @ If, F: 20Ohm @ 5mA, 1MHz
• Power Dissipation (Max): -
• Operating Temperature: -55°C ~ 150°C
• Package / Case: 2-SMD, Flat Lead
• Supplier Device Package: -

pacchetto: -

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CDLL4486-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 75 V
• Tolerance: ±5%
• Power - Max: 1.5 W
• Impedance (Max) (Zzt): 130 Ohms
• Current - Reverse Leakage @ Vr: 250 nA @ 60.4 V
• Voltage - Forward (Vf) (Max) @ If: 1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Surface Mount
• Package / Case: DO-213AB, MELF
• Supplier Device Package: DO-213AB

pacchetto: -

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RT4G150L-LGG1657PROTO

Microchip Technology

RT4G150L-LGG1657PROTO

• Number of LABs/CLBs: -
• Number of Logic Elements/Cells: 151824
• Total RAM Bits: 5325
• Number of I/O: -
• Number of Gates: -
• Voltage - Supply: 1.14V ~ 1.26V
• Mounting Type: Surface Mount
• Operating Temperature: -55°C ~ 125°C (TJ)
• Package / Case: 1657-BCLGA
• Supplier Device Package: 1657-CLGA (42.5x42.5)

pacchetto: -

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JANS1N4961C

Microchip Technology

ZENER DIODE

• Voltage - Zener (Nom) (Vz): 13 V
• Tolerance: ±2%
• Power - Max: 5 W
• Impedance (Max) (Zzt): 3 Ohms
• Current - Reverse Leakage @ Vr: 10 µA @ 9.9 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Package / Case: E, Axial
• Supplier Device Package: E, Axial

pacchetto: -

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