Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
5MHZ AUTO TEMP 8-TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione3.072 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | SPI | 5MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
5MHZ AUTO GRADE 8-SOIC-N
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.536 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | SPI | 5MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
5MHZ AUTO GRADE1 8-UDFN
|
pacchetto: 8-UFDFN Exposed Pad |
Azione2.720 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | SPI | 5MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
5MHZ AUTO GRADE1 8-UDFN
|
pacchetto: 8-UFDFN Exposed Pad |
Azione7.008 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | SPI | 5MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
5MHZ AUTO TEMP 8-TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione6.096 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | SPI | 5MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
5MHZ AUTO GRADE 8-SOIC-N
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.408 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | SPI | 5MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
5MHZ AUTO GRADE1 8-UDFN
|
pacchetto: 8-UFDFN Exposed Pad |
Azione2.016 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | SPI | 5MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
5MHZ AUTO GRADE1 8-UDFN
|
pacchetto: 8-UFDFN Exposed Pad |
Azione7.568 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | SPI | 5MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
5MHZ AUTO TEMP 8-TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione5.664 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | SPI | 5MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
5MHZ AUTO GRADE 8-SOIC-N
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione3.984 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | SPI | 5MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
5MHZ AUTO GRADE1 8-UDFN
|
pacchetto: 8-UFDFN Exposed Pad |
Azione4.304 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | SPI | 5MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
5MHZ AUTO GRADE1 8-UDFN
|
pacchetto: 8-UFDFN Exposed Pad |
Azione2.032 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | SPI | 5MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
400KHZ AUTO TEMP 8-TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione6.768 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I²C | 400kHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
400KHZ AUTO GRADE 8-SOIC-N
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.288 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I²C | 400kHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
1MHZ AUTO GRADE1 8-UDFN
|
pacchetto: 8-UFDFN Exposed Pad |
Azione5.680 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I²C | 400kHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
1MHZ AUTO GRADE1 8-UDFN
|
pacchetto: 8-UFDFN Exposed Pad |
Azione5.456 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I²C | 400kHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
400KHZ AUTO TEMP 8-TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione4.816 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I²C | 1MHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
32KB I2C EEPROM AUTO GRADE 1
|
pacchetto: SOT-23-5 Thin, TSOT-23-5 |
Azione3.808 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I²C | 1MHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | SOT-23-5 Thin, TSOT-23-5 | TSOT-23-5 |
||
Microchip Technology |
400KHZ AUTO GRADE 8-SOIC-N
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.752 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I²C | 1MHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
1MHZ AUTO GRADE1 8-UDFN
|
pacchetto: 8-UFDFN Exposed Pad |
Azione2.512 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I²C | 1MHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
1MHZ AUTO GRADE1 8-UDFN
|
pacchetto: 8-UFDFN Exposed Pad |
Azione6.960 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I²C | 1MHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
400KHZ AUTO GRADE 8-SOIC-N
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione2.304 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I²C | 400kHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
1MHZ AUTO GRADE1 8-UDFN
|
pacchetto: 8-UFDFN Exposed Pad |
Azione6.992 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I²C | 400kHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
1MHZ AUTO GRADE1 8-UDFN
|
pacchetto: 8-UFDFN Exposed Pad |
Azione2.416 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I²C | 400kHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
1MHZ AUTO TMP 8-TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione6.544 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | I²C | 1MHz | 5ms | 550ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
16KB I2C EEPROM AUTO GRADE 1
|
pacchetto: SOT-23-5 Thin, TSOT-23-5 |
Azione5.072 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | I²C | 1MHz | 5ms | 550ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | SOT-23-5 Thin, TSOT-23-5 | TSOT-23-5 |
||
Microchip Technology |
1MHZ AUTO TMP 8-SOIC-N
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione3.968 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | I²C | 1MHz | 5ms | 550ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
1.7-5.5V 1MHZ AUTO GRADE3 8-UDFN
|
pacchetto: 8-UFDFN Exposed Pad |
Azione5.584 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | I²C | 1MHz | 5ms | 550ns | 1.7V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |