Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of D/A Converters | Settling Time | Output Type | Differential Output | Data Interface | Reference Type | Voltage - Supply, Analog | Voltage - Supply, Digital | INL/DNL (LSB) | Architecture | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
I2C SINGLE CHANNEL 8-BIT VOLATIL
|
pacchetto: 10-VFDFN Exposed Pad |
Azione18.084 |
|
1 | 16µs (Typ) | Voltage - Buffered | No | I²C | External, Internal | 1.8 V ~ 5.5 V | 1.8 V ~ 5.5 V | ±0.1, ±0.1 | Current Source | -40°C ~ 125°C | 10-VFDFN Exposed Pad | 10-DFN (3x3) | Surface Mount |
||
Microchip Technology |
I2C SINGLE CHANNEL 8-BIT VOLATIL
|
pacchetto: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
Azione12.768 |
|
1 | 16µs (Typ) | Voltage - Buffered | No | I²C | External, Internal | 1.8 V ~ 5.5 V | 1.8 V ~ 5.5 V | ±0.1, ±0.1 | Current Source | -40°C ~ 125°C | 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) | 10-MSOP | Surface Mount |
||
Microchip Technology |
DUAL 12-BIT DAC WITH SPI INTERAC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione2.368 |
|
2 | 4.5µs (Typ) | Voltage - Buffered | No | SPI | Internal | 2.7 V ~ 5.5 V | 2.7 V ~ 5.5 V | ±4, ±0.25 | String DAC | -40°C ~ 125°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC | Surface Mount |
||
Microchip Technology |
I2C DUAL CHANNEL 12-BIT
|
pacchetto: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
Azione15.348 |
|
2 | 16µs (Typ) | Voltage - Buffered | No | I²C | External, Internal | 1.8 V ~ 5.5 V | 1.8 V ~ 5.5 V | ±1, ±1 | Current Source | -40°C ~ 125°C | 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) | 10-MSOP | Surface Mount |
||
Microchip Technology |
I2C DUAL CHANNEL 12-BIT VOLATILE
|
pacchetto: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
Azione17.448 |
|
2 | 16µs (Typ) | Voltage - Buffered | No | I²C | External, Internal | 1.8 V ~ 5.5 V | 1.8 V ~ 5.5 V | ±1, ±1 | Current Source | -40°C ~ 125°C | 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) | 10-MSOP | Surface Mount |
||
Microchip Technology |
I2C DUAL CHANNEL 12-BIT VOLATILE
|
pacchetto: 16-VFQFN Exposed Pad |
Azione16.860 |
|
2 | 16µs (Typ) | Voltage - Buffered | No | I²C | External, Internal | 1.8 V ~ 5.5 V | 1.8 V ~ 5.5 V | ±1, ±1 | Current Source | -40°C ~ 125°C | 16-VFQFN Exposed Pad | 16-QFN (3x3) | Surface Mount |
||
Microchip Technology |
I2C DUAL CHANNEL 12-BIT VOLATILE
|
pacchetto: 10-VFDFN Exposed Pad |
Azione14.064 |
|
2 | 16µs (Typ) | Voltage - Buffered | No | I²C | External, Internal | 1.8 V ~ 5.5 V | 1.8 V ~ 5.5 V | ±1, ±1 | Current Source | -40°C ~ 125°C | 10-VFDFN Exposed Pad | 10-DFN (3x3) | Surface Mount |
||
Microchip Technology |
I2C DUAL CHANNEL 10-BIT
|
pacchetto: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
Azione19.728 |
|
2 | 16µs (Typ) | Voltage - Buffered | No | I²C | External, Internal | 1.8 V ~ 5.5 V | 1.8 V ~ 5.5 V | ±0.25, ±0.25 | Current Source | -40°C ~ 125°C | 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) | 10-MSOP | Surface Mount |
||
Microchip Technology |
I2C DUAL CHANNEL 10-BIT
|
pacchetto: 16-VFQFN Exposed Pad |
Azione13.998 |
|
2 | 16µs (Typ) | Voltage - Buffered | No | I²C | External, Internal | 1.8 V ~ 5.5 V | 1.8 V ~ 5.5 V | ±0.25, ±0.25 | Current Source | -40°C ~ 125°C | 16-VFQFN Exposed Pad | 16-QFN (3x3) | Surface Mount |
||
Microchip Technology |
I2C DUAL CHANNEL 10-BIT VOLATILE
|
pacchetto: 16-VFQFN Exposed Pad |
Azione20.580 |
|
2 | 16µs (Typ) | Voltage - Buffered | No | I²C | External, Internal | 1.8 V ~ 5.5 V | 1.8 V ~ 5.5 V | ±0.25, ±0.25 | Current Source | -40°C ~ 125°C | 16-VFQFN Exposed Pad | 16-QFN (3x3) | Surface Mount |
||
Microchip Technology |
I2C SINGLE CHANNEL 12-BIT
|
pacchetto: 10-VFDFN Exposed Pad |
Azione14.568 |
|
1 | 16µs (Typ) | Voltage - Buffered | No | I²C | External, Internal | 1.8 V ~ 5.5 V | 1.8 V ~ 5.5 V | ±1, ±1 | Current Source | -40°C ~ 125°C | 10-VFDFN Exposed Pad | 10-DFN (3x3) | Surface Mount |
||
Microchip Technology |
I2C SINGLE CHANNEL 8-BIT
|
pacchetto: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
Azione12.570 |
|
1 | 16µs (Typ) | Voltage - Buffered | No | I²C | External, Internal | 1.8 V ~ 5.5 V | 1.8 V ~ 5.5 V | ±0.1, ±0.1 | Current Source | -40°C ~ 125°C | 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) | 10-MSOP | Surface Mount |
||
Microchip Technology |
IC DAC 12BIT DUAL W/SPI 14TSSOP
|
pacchetto: 14-TSSOP (0.173", 4.40mm Width) |
Azione2.896 |
|
2 | 4.5µs (Typ) | Voltage - Buffered | No | SPI | External | 2.7 V ~ 5.5 V | 2.7 V ~ 5.5 V | ±4, ±0.25 | String DAC | -40°C ~ 125°C | 14-TSSOP (0.173", 4.40mm Width) | 14-TSSOP | Surface Mount |
||
Microchip Technology |
IC DAC 12BIT DUAL W/SPI 14SOIC
|
pacchetto: 14-SOIC (0.154", 3.90mm Width) |
Azione2.000 |
|
2 | 4.5µs (Typ) | Voltage - Buffered | No | SPI | External | 2.7 V ~ 5.5 V | 2.7 V ~ 5.5 V | ±4, ±0.25 | String DAC | -40°C ~ 125°C | 14-SOIC (0.154", 3.90mm Width) | 14-SOIC | Surface Mount |
||
Microchip Technology |
DAC 12BIT SGL W/SPI 8DFN
|
pacchetto: 8-VFDFN Exposed Pad |
Azione4.464 |
|
1 | 4.5µs (Typ) | Voltage - Buffered | No | SPI | External | 2.7 V ~ 5.5 V | 2.7 V ~ 5.5 V | ±4, ±0.25 | String DAC | -40°C ~ 125°C | 8-VFDFN Exposed Pad | 8-DFN (2x3) | Surface Mount |
||
Microchip Technology |
IC DAC 12BIT W/SPI 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione3.744 |
|
1 | 4.5µs (Typ) | Voltage - Buffered | No | SPI | Internal | 2.7 V ~ 5.5 V | 2.7 V ~ 5.5 V | ±4, ±0.25 | String DAC | -40°C ~ 125°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC | Surface Mount |
||
Microchip Technology |
DAC 8BIT DUAL SPI/VREF 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.408 |
|
2 | 4.5µs (Typ) | Voltage - Buffered | No | SPI | Internal | 2.7 V ~ 5.5 V | 2.7 V ~ 5.5 V | ±0.25, ±0.2 | String DAC | -40°C ~ 125°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC | Surface Mount |
||
Microchip Technology |
IC DAC 12BIT W/I2C SOT23A-6
|
pacchetto: SOT-23-6 |
Azione2.608 |
|
1 | 6µs (Typ) | Voltage - Buffered | No | I²C | Supply | 2.7 V ~ 5.5 V | 2.7 V ~ 5.5 V | ±2, ±0.2 | String DAC | -40°C ~ 125°C | SOT-23-6 | SOT-23-6 | Surface Mount |
||
Microchip Technology |
IC DAC 10BIT NV EEP I2C SOT-23-6
|
pacchetto: SOT-23-6 |
Azione6.960 |
|
1 | 6µs (Typ) | Voltage - Buffered | No | I²C | External, Supply | 2.7 V ~ 5.5 V | 2.7 V ~ 5.5 V | ±0.5, ±0.05 | R-2R | -40°C ~ 125°C | SOT-23-6 | SOT-23-6 | Surface Mount |
||
Microchip Technology |
DAC 12BIT SGL SPI 8DFN
|
pacchetto: 8-VFDFN Exposed Pad |
Azione3.184 |
|
1 | 4.5µs (Typ) | Voltage - Buffered | No | SPI | External | 2.7 V ~ 5.5 V | 2.7 V ~ 5.5 V | ±4, ±0.25 | String DAC | -40°C ~ 125°C | 8-VFDFN Exposed Pad | 8-DFN (2x3) | Surface Mount |
||
Microchip Technology |
DAC 10BIT DUAL SPI 14TSSOP
|
pacchetto: 14-TSSOP (0.173", 4.40mm Width) |
Azione5.136 |
|
2 | 4.5µs (Typ) | Voltage - Buffered | No | SPI | External | 2.7 V ~ 5.5 V | 2.7 V ~ 5.5 V | ±1, ±0.2 | String DAC | -40°C ~ 125°C | 14-TSSOP (0.173", 4.40mm Width) | 14-TSSOP | Surface Mount |
||
Microchip Technology |
IC DAC 12BIT W/SPI 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.912 |
|
1 | 4.5µs (Typ) | Voltage - Buffered | No | SPI | Internal | 2.7 V ~ 5.5 V | 2.7 V ~ 5.5 V | ±4, ±0.25 | String DAC | -40°C ~ 125°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC | Surface Mount |
||
Microchip Technology |
IC DAC 12-BIT I2C 10-MSOP
|
pacchetto: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
Azione2.816 |
|
4 | 6µs (Typ) | Voltage - Buffered | No | I²C | Internal, Supply | 2.7 V ~ 5.5 V | 2.7 V ~ 5.5 V | ±2, ±0.2 | String DAC | -40°C ~ 125°C | 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) | 10-MSOP | Surface Mount |
||
Microchip Technology |
IC DAC 12BIT DUAL W/SPI 14TSSOP
|
pacchetto: 14-TSSOP (0.173", 4.40mm Width) |
Azione2.176 |
|
2 | 4.5µs (Typ) | Voltage - Buffered | No | SPI | External | 2.7 V ~ 5.5 V | 2.7 V ~ 5.5 V | ±4, ±0.25 | String DAC | -40°C ~ 125°C | 14-TSSOP (0.173", 4.40mm Width) | 14-TSSOP | Surface Mount |
||
Microchip Technology |
IC DAC 12BIT DUAL W/SPI 14SOIC
|
pacchetto: 14-SOIC (0.154", 3.90mm Width) |
Azione6.848 |
|
2 | 4.5µs (Typ) | Voltage - Buffered | No | SPI | External | 2.7 V ~ 5.5 V | 2.7 V ~ 5.5 V | ±4, ±0.25 | String DAC | -40°C ~ 125°C | 14-SOIC (0.154", 3.90mm Width) | 14-SOIC | Surface Mount |
||
Microchip Technology |
IC DAC 12BIT SNGL W/SPI 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.888 |
|
1 | 4.5µs (Typ) | Voltage - Buffered | No | SPI | External | 2.7 V ~ 5.5 V | 2.7 V ~ 5.5 V | ±4, ±0.25 | String DAC | -40°C ~ 125°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC | Surface Mount |
||
Microchip Technology |
IC DAC 12BIT I2C 4CH 10MSOP
|
pacchetto: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
Azione2.272 |
|
4 | 6µs (Typ) | Voltage - Buffered | No | I²C | Internal, Supply | 2.7 V ~ 5.5 V | 2.7 V ~ 5.5 V | ±2, ±0.2 | String DAC | -40°C ~ 125°C | 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) | 10-MSOP | Surface Mount |
||
Microchip Technology |
I2C DUAL CHANNEL 12-BIT
|
pacchetto: 16-VFQFN Exposed Pad |
Azione7.616 |
|
2 | 16µs (Typ) | Voltage - Buffered | No | I²C | External, Internal | 1.8 V ~ 5.5 V | 1.8 V ~ 5.5 V | ±1, ±1 | Current Source | -40°C ~ 125°C | 16-VFQFN Exposed Pad | 16-QFN (3x3) | Surface Mount |