Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Frequency - Output 1 | Frequency - Output 2 | Function | Output | Voltage - Supply | Frequency Stability | Operating Temperature | Current - Supply (Max) | Size / Dimension | Height | Package / Case |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
pacchetto: 20-VFQFN Exposed Pad |
Azione3.852 |
|
- | - | Enable/Disable | LVCMOS, LVPECL | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
pacchetto: 20-VFQFN Exposed Pad |
Azione4.896 |
|
- | - | Enable/Disable | LVCMOS, LVPECL | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
pacchetto: 20-VFQFN Exposed Pad |
Azione3.780 |
|
- | - | Enable/Disable | LVCMOS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
pacchetto: 20-VFQFN Exposed Pad |
Azione2.628 |
|
- | - | Enable/Disable | LVCMOS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
pacchetto: 20-VFQFN Exposed Pad |
Azione5.292 |
|
- | - | Enable/Disable | LVCMOS | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
pacchetto: 20-VFQFN Exposed Pad |
Azione2.070 |
|
- | - | Enable/Disable | LVCMOS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
pacchetto: 20-VFQFN Exposed Pad |
Azione4.986 |
|
- | - | Enable/Disable | LVCMOS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
pacchetto: 20-VFQFN Exposed Pad |
Azione4.248 |
|
25MHz, 50MHz, 125MHz, 150MHz | 100MHz, 156.25MHz | Enable/Disable | LVCMOS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
pacchetto: 20-VFQFN Exposed Pad |
Azione5.346 |
|
25MHz, 50MHz, 125MHz, 150MHz | 100MHz, 156.25MHz | Enable/Disable | LVCMOS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
pacchetto: 20-VFQFN Exposed Pad |
Azione2.178 |
|
- | - | Enable/Disable | HCSL, LVCMOS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
pacchetto: 20-VFQFN Exposed Pad |
Azione3.168 |
|
- | - | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
pacchetto: 20-VFQFN Exposed Pad |
Azione7.866 |
|
- | - | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
pacchetto: 20-VFQFN Exposed Pad |
Azione7.866 |
|
- | - | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
pacchetto: 20-VFQFN Exposed Pad |
Azione2.592 |
|
- | - | Enable/Disable | LVCMOS, LVDS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
pacchetto: 20-VFQFN Exposed Pad |
Azione3.454 |
|
- | - | Enable/Disable | LVCMOS | 2.25 V ~ 3.6 V | ±25ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
pacchetto: 6-SMD, No Lead |
Azione4.716 |
|
- | - | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 105°C | - | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) | 6-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
pacchetto: 6-SMD, No Lead |
Azione3.888 |
|
- | - | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 105°C | - | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) | 6-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
pacchetto: 6-SMD, No Lead |
Azione7.470 |
|
- | - | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 105°C | - | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) | 6-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
pacchetto: 6-SMD, No Lead |
Azione5.904 |
|
- | - | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | - | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) | 6-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
pacchetto: 6-SMD, No Lead |
Azione8.298 |
|
- | - | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | - | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) | 6-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
pacchetto: 6-SMD, No Lead |
Azione3.420 |
|
- | - | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | - | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) | 6-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
pacchetto: 6-SMD, No Lead |
Azione4.734 |
|
- | - | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | - | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) | 6-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
pacchetto: 6-SMD, No Lead |
Azione6.714 |
|
- | - | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±25ppm | -20°C ~ 70°C | - | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) | 6-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
pacchetto: 6-SMD, No Lead |
Azione6.498 |
|
- | - | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) | 6-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
pacchetto: 6-SMD, No Lead |
Azione5.202 |
|
25MHz | 125MHz | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) | 6-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
pacchetto: 14-SMD, No Lead |
Azione2.700 |
|
- | - | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | 32mA | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
pacchetto: 14-SMD, No Lead |
Azione3.276 |
|
- | - | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | 32mA | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
pacchetto: 14-SMD, No Lead |
Azione7.506 |
|
148.35MHz, 148.5MHz | - | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | 32mA | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead |