Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Frequency - Output 1 | Frequency - Output 2 | Function | Output | Voltage - Supply | Frequency Stability | Operating Temperature | Current - Supply (Max) | Size / Dimension | Height | Package / Case |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
pacchetto: 20-VFQFN Exposed Pad |
Azione4.968 |
|
25MHz, 50MHz, 125MHz, 150MHz | 100MHz, 156.25MHz | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±25ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
pacchetto: 20-VFQFN Exposed Pad |
Azione2.988 |
|
25MHz, 50MHz, 125MHz, 150MHz | 100MHz, 156.25MHz | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
pacchetto: 20-VFQFN Exposed Pad |
Azione8.604 |
|
25MHz, 50MHz, 125MHz, 150MHz | 100MHz, 156.25MHz | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
pacchetto: 20-VFQFN Exposed Pad |
Azione8.046 |
|
- | - | Enable/Disable | LVPECL | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
pacchetto: 20-VFQFN Exposed Pad |
Azione3.852 |
|
- | - | Enable/Disable | LVPECL | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
pacchetto: 20-VFQFN Exposed Pad |
Azione2.538 |
|
- | - | Enable/Disable | LVPECL | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
pacchetto: 20-VFQFN Exposed Pad |
Azione5.400 |
|
- | - | Enable/Disable | LVPECL | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
pacchetto: 20-VFQFN Exposed Pad |
Azione6.876 |
|
- | - | Enable/Disable | LVPECL | 2.25 V ~ 3.6 V | ±25ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
pacchetto: 20-VFQFN Exposed Pad |
Azione4.302 |
|
- | - | Enable/Disable | LVPECL | 2.25 V ~ 3.6 V | ±25ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
pacchetto: 20-VFQFN Exposed Pad |
Azione3.762 |
|
- | - | Enable/Disable | LVPECL | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
pacchetto: 20-VFQFN Exposed Pad |
Azione5.724 |
|
- | - | Enable/Disable | LVPECL | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
pacchetto: 20-VFQFN Exposed Pad |
Azione3.600 |
|
- | - | Enable/Disable | HCSL, LVCMOS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
pacchetto: 20-VFQFN Exposed Pad |
Azione6.084 |
|
- | - | Enable/Disable | HCSL, LVCMOS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
pacchetto: 20-VFQFN Exposed Pad |
Azione4.986 |
|
- | - | Enable/Disable | HCSL, LVCMOS | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
pacchetto: 20-VFQFN Exposed Pad |
Azione4.446 |
|
- | - | Enable/Disable | HCSL, LVCMOS | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
pacchetto: 20-VFQFN Exposed Pad |
Azione7.488 |
|
- | - | Enable/Disable | HCSL, LVCMOS | 2.25 V ~ 3.6 V | ±25ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
pacchetto: 20-VFQFN Exposed Pad |
Azione4.428 |
|
- | - | Enable/Disable | HCSL, LVCMOS | 2.25 V ~ 3.6 V | ±25ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
pacchetto: 20-VFQFN Exposed Pad |
Azione2.610 |
|
- | - | Enable/Disable | HCSL, LVCMOS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
pacchetto: 20-VFQFN Exposed Pad |
Azione4.572 |
|
- | - | Enable/Disable | HCSL, LVCMOS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
pacchetto: 20-VFQFN Exposed Pad |
Azione4.212 |
|
- | - | Enable/Disable | HCSL, LVCMOS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
pacchetto: 20-VFQFN Exposed Pad |
Azione2.286 |
|
- | - | Enable/Disable | HCSL, LVCMOS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
pacchetto: 20-VFQFN Exposed Pad |
Azione8.982 |
|
- | - | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
pacchetto: 20-VFQFN Exposed Pad |
Azione6.732 |
|
- | - | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
pacchetto: 20-VFQFN Exposed Pad |
Azione4.878 |
|
- | - | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±25ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
pacchetto: 20-VFQFN Exposed Pad |
Azione6.084 |
|
- | - | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±25ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
pacchetto: 20-VFQFN Exposed Pad |
Azione6.930 |
|
- | - | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
pacchetto: 20-VFQFN Exposed Pad |
Azione4.590 |
|
- | - | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
pacchetto: 20-VFQFN Exposed Pad |
Azione7.128 |
|
- | - | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |