Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Frequency | Function | Output | Voltage - Supply | Frequency Stability | Operating Temperature | Current - Supply (Max) | Ratings | Mounting Type | Package / Case | Size / Dimension | Height - Seated (Max) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
OSC MEMS 9.6000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead |
Azione7.434 |
|
9.6MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -40°C ~ 85°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 40.0000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead |
Azione5.274 |
|
40MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±50ppm | -20°C ~ 70°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 1.8432MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead |
Azione5.364 |
|
1.8432MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±50ppm | -20°C ~ 70°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 125.0000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead |
Azione5.094 |
|
125MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±50ppm | 0°C ~ 70°C | 8.7mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 40.0000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead |
Azione2.160 |
|
40MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±50ppm | 0°C ~ 70°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 19.6608MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione7.452 |
|
19.6608MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -40°C ~ 85°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 14.7456MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione7.308 |
|
14.7456MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -40°C ~ 85°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 80.0000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione3.006 |
|
80MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±50ppm | -40°C ~ 85°C | 8.7mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 64.0000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione2.592 |
|
64MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±50ppm | -40°C ~ 85°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 48.0000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione8.226 |
|
48MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±50ppm | -40°C ~ 85°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 14.3181MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione3.222 |
|
14.3181MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±50ppm | -40°C ~ 85°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 12.2880MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione6.066 |
|
12.288MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±50ppm | -40°C ~ 85°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 1.8432MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione3.330 |
|
1.8432MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±50ppm | -40°C ~ 85°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 40.6080MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione2.160 |
|
40.608MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±10ppm | -20°C ~ 70°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 7.6800MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione6.642 |
|
7.68MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±10ppm | -20°C ~ 70°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 40.608MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione6.354 |
|
40.608MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -20°C ~ 70°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 8.0000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione4.932 |
|
8MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -20°C ~ 70°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 7.6800MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione2.952 |
|
7.68MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -20°C ~ 70°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 133.0000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione8.712 |
|
133MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±50ppm | -20°C ~ 70°C | 8.7mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 50.0000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione4.158 |
|
50MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±50ppm | -20°C ~ 70°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 33.0000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione3.618 |
|
33MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±50ppm | -20°C ~ 70°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 27.0000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione6.588 |
|
27MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | 0°C ~ 70°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 40.0000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione6.858 |
|
40MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±50ppm | 0°C ~ 70°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 33.3333MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione2.286 |
|
33.3333MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±50ppm | 0°C ~ 70°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 24.0000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione2.538 |
|
24MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±50ppm | 0°C ~ 70°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 40.000MHZ CMOS SMD
|
pacchetto: 6-SMD, No Lead |
Azione3.418 |
|
40MHz | Standby (Power Down) | CMOS | 2.25 V ~ 3.6 V | ±25ppm | -55°C ~ 125°C | 35mA | - | Surface Mount | 6-SMD, No Lead | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSCILLATOR SMD
|
pacchetto: 6-SMD, No Lead |
Azione2.286 |
|
125MHz | Enable/Disable | CMOS | 2.375 V ~ 3.63 V | - | - | - | - | Surface Mount | 6-SMD, No Lead | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.055" (1.40mm) |
||
Microchip Technology |
OSCILLATOR XO 156.25MHZ LVDS SMD
|
pacchetto: 6-SMD, No Lead |
Azione6.984 |
|
156.25MHz | Enable/Disable | LVDS | 2.375 V ~ 3.63 V | ±50ppm | -40°C ~ 85°C | 90mA | - | Surface Mount | 6-SMD, No Lead | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.055" (1.40mm) |