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Prodotti Intel

Record 9.824
Pagina  255/351
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SLXT361QE.A2
Intel

IC 1-PORT T1/E1 PAR TXCVR 44-QFP

  • Type: Transceiver
  • Protocol: E1
  • Number of Drivers/Receivers: -
  • Duplex: -
  • Receiver Hysteresis: -
  • Data Rate: -
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Operating Temperature: -
  • Mounting Type: Surface Mount
  • Package / Case: 44-QFP
  • Supplier Device Package: -
pacchetto: 44-QFP
Azione6.304
1SX280LU3F50I2LG
Intel

2397-PIN FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 2800K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
pacchetto: -
Azione5.920
EP1SGX10CF672C7GA
Intel

IC FPGA STRATIX GX 672FBGA

  • Number of LABs/CLBs: 1057
  • Number of Logic Elements/Cells: 10570
  • Total RAM Bits: 920448
  • Number of I/O: 362
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 672-BBGA, FCBGA
  • Supplier Device Package: 672-FBGA (27x27)
pacchetto: 672-BBGA, FCBGA
Azione7.952
EPF10K30EQC208-1N
Intel

IC FPGA

  • Number of LABs/CLBs: 216
  • Number of Logic Elements/Cells: 1728
  • Total RAM Bits: 24576
  • Number of I/O: 147
  • Number of Gates: 119000
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Package / Case: 208-BFQFP
  • Supplier Device Package: 208-PQFP (28x28)
pacchetto: 208-BFQFP
Azione4.944
EP20K1000EFC33-2
Intel

IC FPGA 708 I/O 1020FBGA

  • Number of LABs/CLBs: 3840
  • Number of Logic Elements/Cells: 38400
  • Total RAM Bits: 327680
  • Number of I/O: 708
  • Number of Gates: 1772000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1020-BBGA
  • Supplier Device Package: 1020-FBGA (33x33)
pacchetto: 1020-BBGA
Azione4.288
EP2SGX130GF40C4ES
Intel

IC FPGA 734 I/O 1508FBGA

  • Number of LABs/CLBs: 6627
  • Number of Logic Elements/Cells: 132540
  • Total RAM Bits: 6747840
  • Number of I/O: 734
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1508-BBGA, FCBGA
  • Supplier Device Package: 1508-FBGA (30x30)
pacchetto: 1508-BBGA, FCBGA
Azione2.448
EP20K300EQC240-1
Intel

IC FPGA 152 I/O 240QFP

  • Number of LABs/CLBs: 1152
  • Number of Logic Elements/Cells: 11520
  • Total RAM Bits: 147456
  • Number of I/O: 152
  • Number of Gates: 728000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 240-BQFP
  • Supplier Device Package: 240-PQFP (32x32)
pacchetto: 240-BQFP
Azione2.352
EP20K400FC672-1
Intel

IC FPGA 502 I/O 672FBGA

  • Number of LABs/CLBs: 1664
  • Number of Logic Elements/Cells: 16640
  • Total RAM Bits: 212992
  • Number of I/O: 502
  • Number of Gates: 1052000
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 672-BBGA, FCBGA
  • Supplier Device Package: 672-FBGA (27x27)
pacchetto: 672-BBGA, FCBGA
Azione4.336
EP1K30TI144-2
Intel

IC FPGA 102 I/O 144TQFP

  • Number of LABs/CLBs: 216
  • Number of Logic Elements/Cells: 1728
  • Total RAM Bits: 24576
  • Number of I/O: 102
  • Number of Gates: 119000
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
pacchetto: 144-LQFP
Azione4.048
EP3SE260H780I4L
Intel

IC FPGA 488 I/O 780HBGA

  • Number of LABs/CLBs: 10200
  • Number of Logic Elements/Cells: 255000
  • Total RAM Bits: 16672768
  • Number of I/O: 488
  • Number of Gates: -
  • Voltage - Supply: 0.86 V ~ 1.15 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 780-BBGA, FCBGA
  • Supplier Device Package: 780-HBGA (33x33)
pacchetto: 780-BBGA, FCBGA
Azione6.320
5SGXEABN3F45I3L
Intel

IC FPGA 840 I/O 1932FBGA

  • Number of LABs/CLBs: 359200
  • Number of Logic Elements/Cells: 952000
  • Total RAM Bits: 65561600
  • Number of I/O: 840
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1932-BBGA, FCBGA
  • Supplier Device Package: 1932-FBGA, FC (45x45)
pacchetto: 1932-BBGA, FCBGA
Azione5.456
5SGXMA5N1F45C2N
Intel

IC FPGA 840 I/O 1932FBGA

  • Number of LABs/CLBs: 185000
  • Number of Logic Elements/Cells: 490000
  • Total RAM Bits: 53105664
  • Number of I/O: 840
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1932-BBGA, FCBGA
  • Supplier Device Package: 1932-FBGA, FC (45x45)
pacchetto: 1932-BBGA, FCBGA
Azione2.096
EP4SGX110FF35I3N
Intel

IC FPGA 372 I/O 1152FBGA

  • Number of LABs/CLBs: 4224
  • Number of Logic Elements/Cells: 105600
  • Total RAM Bits: 9793536
  • Number of I/O: 372
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
pacchetto: 1152-BBGA, FCBGA
Azione2.192
EP2AGX190FF35C5
Intel

IC FPGA 612 I/O 11152FBGA

  • Number of LABs/CLBs: 7612
  • Number of Logic Elements/Cells: 181165
  • Total RAM Bits: 10177536
  • Number of I/O: 612
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
pacchetto: 1152-BBGA, FCBGA
Azione6.560
EP3SL70F780C3
Intel

IC FPGA 488 I/O 780FBGA

  • Number of LABs/CLBs: 2700
  • Number of Logic Elements/Cells: 67500
  • Total RAM Bits: 2699264
  • Number of I/O: 488
  • Number of Gates: -
  • Voltage - Supply: 0.86 V ~ 1.15 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 780-BBGA, FCBGA
  • Supplier Device Package: 780-FBGA (29x29)
pacchetto: 780-BBGA, FCBGA
Azione5.776
EP3C120F484C7N
Intel

IC FPGA 283 I/O 484FBGA

  • Number of LABs/CLBs: 7443
  • Number of Logic Elements/Cells: 119088
  • Total RAM Bits: 3981312
  • Number of I/O: 283
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BGA
  • Supplier Device Package: 484-FBGA (23x23)
pacchetto: 484-BGA
Azione3.136
DCF0324WN1N
Intel

IC DAISY CHAIN SAMPLE

  • Type: -
  • Applications: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
pacchetto: -
Azione5.184
EP3SL70F780I4LG
Intel

IC FPGA 488 I/O 780FBGA

  • Number of LABs/CLBs: 2700
  • Number of Logic Elements/Cells: 67500
  • Total RAM Bits: 2699264
  • Number of I/O: 488
  • Number of Gates: -
  • Voltage - Supply: 0.86V ~ 1.15V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 780-BBGA, FCBGA
  • Supplier Device Package: 780-FBGA (29x29)
pacchetto: 780-BBGA, FCBGA
Azione7.536
1SG110HN1F43E2LG
Intel

IC FPGA 688 I/O 1760FBGA

  • Number of LABs/CLBs: 137500
  • Number of Logic Elements/Cells: 1100000
  • Total RAM Bits: -
  • Number of I/O: 688
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FBGA (42.5x42.5)
pacchetto: -
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AGFA023R31C3E3E
Intel

IC FPGA AGILEX-F 3184FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 2.3M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 3184-BFBGA Exposed Pad
  • Supplier Device Package: 3184-BGA (56x45)
pacchetto: -
Request a Quote
EP4SGX360KF40I3NAC
Intel

IC FPGA 744 I/O 1517FBGA

  • Number of LABs/CLBs: 141440
  • Number of Logic Elements/Cells: 353600
  • Total RAM Bits: 23105536
  • Number of I/O: 744
  • Number of Gates: -
  • Voltage - Supply: 0.87V ~ 0.93V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
pacchetto: -
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QGE7320MC
Intel

MEMORY CONTROLLER HUB (MCH)

  • Applications: -
  • Core Processor: -
  • Program Memory Type: -
  • Controller Series: -
  • RAM Size: -
  • Interface: -
  • Number of I/O: -
  • Voltage - Supply: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
pacchetto: -
Request a Quote
AGFC019R24C2I3E
Intel

IC FPGA AGILEX-F 2340BGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 1.9M Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 2340-BFBGA Exposed Pad
  • Supplier Device Package: 2340-BGA (45x42)
pacchetto: -
Request a Quote
5SGSMD3H2F35C3G
Intel

IC FPGA 432 I/O 1152FBGA

  • Number of LABs/CLBs: 89000
  • Number of Logic Elements/Cells: 236000
  • Total RAM Bits: 13312000
  • Number of I/O: 432
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
pacchetto: -
Request a Quote
AGFB019R25A2E3E
Intel

IC FPGA AGILEX-F 2581FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 1.9M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
pacchetto: -
Request a Quote
AGFC019R31C2E1V
Intel

IC FPGA AGILEX-F 3184FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 1.9M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 3184-BFBGA Exposed Pad
  • Supplier Device Package: 3184-BGA (56x45)
pacchetto: -
Request a Quote
AGIC040R39A1E2VB
Intel

IC FPGA AGILEX-I 3948FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 4.047M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 3948-BFBGA Exposed Pad
  • Supplier Device Package: 3948-BGA (56x56)
pacchetto: -
Request a Quote
5SGXEB6R2F43C2G
Intel

IC FPGA 600 I/O 1760FBGA

  • Number of LABs/CLBs: 225400
  • Number of Logic Elements/Cells: 597000
  • Total RAM Bits: 53248000
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.87V ~ 0.93V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FCBGA (42.5x42.5)
pacchetto: -
Request a Quote